Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "MT53B4DAWT-DC") |
MT53B4DAWT-DC | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 1 (Unlimited) | SDRAM - Mobile LPDDR4 | Volatile | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62WV25616EALL-55BLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 48 | 8mm | ROHS3 Compliant | 48-VFBGA | 6mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.75mm | R-PBGA-B48 | 1.65V | 2.2V | 4Mb 256K x 16 | Volatile | 1.65V~2.2V | 256KX16 | 16 | 4194304 bit | 55 ns | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7130SA25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 8 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 25 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577SA85BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | not_compliant | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.18mA | 128KX36 | 36 | 4718592 bit | 87MHz | 0.03A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS45S16160G-7TLA2-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 54 | ROHS3 Compliant | 54 | 54-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~105°C TA | SDRAM | DUAL | 3.3V | YES | 0.8mm | Not Qualified | 3.3V | 3-STATE | 5.4ns | AEC-Q100 | 256Mb 16M x 16 | Volatile | 0.13mA | 3V~3.6V | 16MX16 | 16 | 16b | 143MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT21CS01-SSHM14-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | 2010 | yes | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TC | CMOS | SYNCHRONOUS | 1.75mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 1.8V | 40 | AT21CS01 | YES | 1.27mm | 1.7V | 3.6V | 1Kb 128 x 8 | Non-Volatile | 1.7V~3.6V | 8 | 1024 bit | SERIAL | 125kHz | 5ms | 1-WIRE | EEPROM | I2C, Single Wire | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71T75702S85PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.245mA | 512KX36 | 36 | 18874368 bit | 90MHz | 0.06A | 8.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC46AT-I/OT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2004 | yes | Active | 1 (Unlimited) | 6 | 3.1mm | ROHS3 Compliant | Lead Free | No | 6 | SOT-23-6 | Serial | 1 kb | 1.3mm | 1.8mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 93LC46A | 6 | 0.95mm | 2.5V | 3/5V | 5.5V | TOTEM POLE | 250 ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 128X8 | 2MHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | I2C | EEPROM | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
25LC010A/WF16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | EEPROM | 25LC010A | Die | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 10MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9179L9PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 288 kb | 40MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | RAM, SRAM | 30b | Synchronous | 0.006A | 9b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA85BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.235mA | 128KX36 | 36 | 4718592 bit | 90MHz | 0.045A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS64LV25616AL-12TLA3-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel (TR) | Active | 2 (1 Year) | 125°C | -40°C | 3.3V | 1 | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | Parallel | 3.63V | 3.135V | 4 Mb | Surface Mount | -40°C~125°C TA | SRAM - Asynchronous | 120mA | 44-TSOP II | 12ns | 4Mb 256K x 16 | Volatile | 18b | 3.135V~3.6V | Asynchronous | 16b | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29AL008J70BAI012 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2009 | AL-J | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48 | 48-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 512K x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C256W-10SI-2.7-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C256 | 8-SOIC | 550ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~5.5V | 1MHz | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61WV20488BLL-10MLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 2 (1 Year) | 48 | 1 | ROHS3 Compliant | 48 | 48-TFBGA | 16 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 100mA | BOTTOM | YES | 0.75mm | Not Qualified | 2.5/3.3V | 3-STATE | 16Mb 2M x 8 | Volatile | 21b | 2.4V~3.6V | 2MX8 | 8 | Asynchronous | 0.025A | 8b | COMMON | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY14MB064Q1B-SXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2008 | Obsolete | 3 (168 Hours) | 8 | 3A991.B.2.A | 4.889mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | unknown | 3.8985mm | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | SYNCHRONOUS | 1.727mm | 8542.32.00.41 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 3V | 20 | CY14MB064 | YES | 1.27mm | R-PDSO-G8 | 2.7V | SRAMs | Not Qualified | 3V | 3.6V | 64Kb 8K x 8 | Non-Volatile | 0.003mA | 2.7V~3.6V | 8KX8 | 8 | 65536 bit | 40MHz | 0.00012A | NVSRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CY15V104QSN-108LPXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | Excelon™-Ultra, F-RAM™ | Active | 3 (168 Hours) | 8 | 3.28mm | ROHS3 Compliant | 8-UQFN | 3.23mm | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 0.55mm | 1 | DUAL | 1.8V | YES | 0.65mm | R-PDSO-N8 | 1.71V | 1.89V | 4Mb 512K x 8 | Non-Volatile | 1.71V~1.89V | 512KX8 | 8 | 4194304 bit | 108MHz | FRAM | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43R83200D-5TL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 3 (168 Hours) | 66 | ROHS3 Compliant | 66 | 66-TSSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SDRAM - DDR | DUAL | 2.5V | YES | 0.635mm | Not Qualified | 2.5V | 3-STATE | 700ps | 256Mb 32M x 8 | Volatile | 0.48mA | 2.3V~2.7V | 32MX8 | 8 | 268435456 bit | 8b | 200MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL204K0TMFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2013 | FL2-K | Obsolete | 3 (168 Hours) | 8 | EAR99 | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | No SVHC | 4 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.159mm | 1 | 25mA | DUAL | 3V | 1.27mm | 2.7V | 3/3.3V | 3.6V | 5 ns | 4Mb 512K x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 85MHz | 0.000032A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F256G08CBCBBL06B3WC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 0°C~70°C TA | FLASH - NAND | 256Gb 32G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FS064SAGNFB030 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | Automotive, AEC-Q100, FS-S | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WLGA | Surface Mount | -40°C~105°C TA | FLASH - NOR | 8542.32.00.51 | AEC-Q100; TS 16949 | 64Mb 8M x 8 | Non-Volatile | 1.7V~2V | 133MHz | FLASH | SPI - Quad I/O, QPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H128M16LFCK-5 IT:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 11.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-VFBGA | 10mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.36 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT46H128M16 | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 2Gb 128M x 16 | Volatile | 0.13mA | 1.7V~1.95V | 128MX16 | 16 | 2147483648 bit | 200MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 24816 | 24816 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W29GL032CB7S | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tray | 2016 | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 48 | YES | 0.5mm | R-PDSO-G48 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 32MX1 | 1 | 33554432 bit | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 863 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 8K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||
 |
S34ML08G101TFI200 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 14 Weeks | Surface Mount | Tray | 2013 | ML-1 | Discontinued | 3 (168 Hours) | 48 | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | No SVHC | 8 b | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1.2mm | 8542.32.00.51 | 1 | 30mA | e3 | Matte Tin (Sn) | DUAL | 3V | 0.5mm | 2.7V | 3/3.3V | 3.6V | 25 ns | 8Gb 1G x 8 | Non-Volatile | 31b | 2.7V~3.6V | 1GX8 | 8 | Asynchronous | 8b | 0.00005A | 8b | 3V | NO | NO | YES | 8K | 2Kwords | YES | FLASH | Parallel | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42RM32100D-75BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-TFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B90 | 2.3V | 2.7V | 6ns | 32Mb 1M x 32 | Volatile | 2.3V~2.7V | 1MX32 | 32 | 33554432 bit | 133MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q32JVZPIQ | Winbond Electronics | 0.2477 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | yes | Active | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 4MX8 | 8 | 33554432 bit | SERIAL | 133MHz | 1 | 3V | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS29LV032B-70TLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | 48 | 3V | 18.4mm | RoHS Compliant | 48 | BOTTOM BOOT | 48-TFSOP (0.724, 18.40mm Width) | 32 Mb | 12mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.5mm | 2.7V | 3.6V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 2.7V~3.6V | 2MX16 | 16 | 8 | 3V | FLASH | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
R1LV1616RBG-7SR#S0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | 2007 | yes | Obsolete | 1 (Unlimited) | 48 | 3V | 1 | ROHS3 Compliant | No | 48 | 48-TFBGA | 16 Mb | Surface Mount | 0°C~70°C TA | CMOS | BOTTOM | R1LV1616R | 48 | YES | 0.75mm | 3-STATE | 16Mb 1M x 16 | Volatile | 20b | 0.04mA | 2.7V~3.6V | 16 | 0.000006A | 70 ns | COMMON | 2.7V | SRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V25L15PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 185mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V321L35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 3.3V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 3.6V | 3V | 16 kb | 19mm | 3.63mm | CMOS | 1 | 95mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 52 | COMMERCIAL | SRAMs | 3-STATE | 35 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V |
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