Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Max Power Dissipation | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MR0A08BCYS35 | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 55mA | 1.2mm | 8542.32.00.71 | 1 | 70mA | DUAL | 3.3V | 44 | 0.8mm | 3V | 3.6V | 1Mb 128K x 8 | Non-Volatile | 3V~3.6V | 128KX8 | 8 | 8b | 0.007A | 35 ns | 8b | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W631GG6MB15I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | 96 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.5V | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 1Gb 64M x 16 | Volatile | 1.425V~1.575V | 64MX16 | 16 | 1073741824 bit | 667MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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X28HC256JIZ-90 | Intersil (Renesas Electronics America) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | Active | 85°C | -40°C | 5V | RoHS Compliant | No | 32 | PLCC | Parallel | 256 kb | 90 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR25H10MDF | Everspin Technologies Inc. | 10.3598 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | 8 | 8-VDFN Exposed Pad | 1 Mb | 900μm | Surface Mount | -40°C~125°C TA | MRAM (Magnetoresistive RAM) | SYNCHRONOUS | 1 | 27mA | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | 1.27mm | 3V | 3.6V | 125°C | 600mW | 10 ns | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 8b | RAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS25LP256D-JLLE-TR | ISSI, Integrated Silicon Solution Inc | 2.8258 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 8 | 8mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 0.85mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 2.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.3V~3.6V | 32MX8 | 8 | 268435456 bit | SERIAL | 133MHz | 3V | FLASH | SPI - Quad I/O, QPI, DTR | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "W948D6FBHX5G") |
W948D6FBHX5G | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR | 5ns | 256Mb 16M x 16 | Volatile | 1.7V~1.95V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9825G2JB-75 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2011 | Active | 3 (168 Hours) | 90 | EAR99 | 3.3V | 1 | 13mm | ROHS3 Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | 140mA | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 90 | 0.8mm | 2.7V | Not Qualified | 3.6V | 5.4ns | 256Mb 8M x 32 | Volatile | 12b | 2.7V~3.6V | 8MX32 | 32 | 133MHz | 0.004A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9825G6JB-6 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | 5ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR4A16BMA35 | Everspin Technologies Inc. | 41.4373 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | 2014 | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 10mm | ROHS3 Compliant | Lead Free | 48 | 48-LFBGA | 16 Mb | 1.35mm | Surface Mount | 0°C~70°C TA | MRAM (Magnetoresistive RAM) | 110mA | ASYNCHRONOUS | 8542.32.00.71 | 1 | 180mA | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 48 | 0.75mm | 3V | Not Qualified | 3.6V | 70°C | 16Mb 1M x 16 | Non-Volatile | 3V~3.6V | 1MX16 | 16 | 16b | 0.014A | 35 ns | 16b | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W631GU6KS-15 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 7.5mm | CMOS | SYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 1.35V | NOT SPECIFIED | OTHER | YES | 0.8mm | R-PBGA-B96 | 1.283V | 85°C | 1.45V | 64MX16 | 16 | 1073741824 bit | DDR DRAM | MULTI BANK PAGE BURST | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W29N01GVBIAA | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63 | 63-VFBGA | unknown | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 3.3V | YES | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 128MX8 | 8 | 1073741824 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W29GL064CH7B | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | 64 | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | 3V | 64 | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 1 | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 64K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C66-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Surface Mount | Tube | 2000 | no | Active | 1 (Unlimited) | 8 | 5V | ROHS3 Compliant | Lead Free | Tin | No | 8 | 10K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, Serial | 4 kb | Surface Mount | -40°C~125°C TA | CMOS | 1 | 4mA | e0 | DUAL | 5V | 93C66 | 8 | 1.27mm | 5V | 3-STATE | 6 ms | 4Kb 512 x 8 256 x 16 | Non-Volatile | 4.5V~5.5V | 8 | 2MHz | 0.0001A | 16 | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 1ms | MICROWIRE | EEPROM | SPI | 2ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W631GU6KB12I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-TFBGA | 9mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | BOTTOM | NOT SPECIFIED | 1.35V | NOT SPECIFIED | 96 | YES | 0.8mm | R-PBGA-B96 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 20ns | 1Gb 64M x 16 | Volatile | 0.4mA | 1.283V~1.45V | 64MX16 | 16 | 1073741824 bit | 800MHz | 0.014A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RM25C512C-LMAI-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2013 | Mavriq™ | yes | Not For New Designs | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | 8-UFDFN Exposed Pad | SPI, Serial | 2mm | Surface Mount | -40°C~85°C TA | CBRAM | SYNCHRONOUS | 0.6mm | 1 | DUAL | 3.3V | YES | 0.5mm | R-PDSO-N8 | 1.65V | 3.6V | 512kb 128B Page Size | Non-Volatile | 1.65V~3.6V | 512KX1 | 1 | 524288 bit | 20MHz | SPI | CBRAM® | SPI | 100μs, 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W29GL064CH7T | Winbond Electronics | 1.0170 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | DUAL | 3V | 56 | YES | 0.5mm | R-PDSO-G56 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 64MX1 | 1 | 67108864 bit | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 64K | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q128FWPIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | 1.8V | 6mm | ROHS3 Compliant | 8 | 8-WDFN Exposed Pad | SPI, Serial | 128 Mb | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1 | DUAL | 1.8V | 8 | 1.27mm | 1.7V | Not Qualified | 1.95V | 6 ns | 128Mb 16M x 8 | Non-Volatile | 0.025mA | 1.65V~1.95V | 1 | 104MHz | 0.00002A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | FLASH | SPI - Quad I/O, QPI | 60μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W631GG8MB12I TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 128M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C04D-SSHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 1 (Unlimited) | 8 | 4.925mm | ROHS3 Compliant | Lead Free | Gold | 8 | ALSO OPERATES 1.7V AT 100 KHZ | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 4 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e4 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | AT24C04 | 1.27mm | 1.7V | Not Qualified | 3.6V | OPEN-DRAIN | 450ns | ISO/TS-16949 | 4Kb 512 x 8 | Non-Volatile | 0.001mA | 1.7V~3.6V | 8 | 1MHz | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | YES | 16words | I2C | 1010DDMR | NO | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64JWSSIM TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 1.7V~1.95V | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR2A16ACYS35R | Everspin Technologies Inc. | 11.3897 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2002 | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | 4 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.71 | 1 | 165mA | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 44 | 0.8mm | 3V | Not Qualified | 3.6V | 4Mb 256K x 16 | Non-Volatile | 3V~3.6V | 256KX16 | 16 | 16b | 0.028A | 35 ns | 16b | RAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25R128JVPIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | SpiFlash® | Active | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32JVSTIQ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2014 | SpiFlash® | yes | Active | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | 2.7V NOMINAL AVAILABLE WITH 104MHZ | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.28mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1mm | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3.3V | NOT SPECIFIED | YES | 1.27mm | S-PDSO-G8 | 3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 4MX8 | 8 | 33554432 bit | 133MHz | 1 | 3V | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64CVZEIG | Winbond Electronics | 3.0354 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2011 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | ROHS3 Compliant | 8 | 8-WDFN Exposed Pad | SPI, Serial | unknown | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1 | DUAL | 3V | 8 | YES | 1.27mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 64MX1 | 1 | 80MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI - Quad I/O | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25DN512C-XMHF-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 3 (168 Hours) | 8 | 4.4mm | ROHS3 Compliant | Gold | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 512 kb | Surface Mount | -40°C~85°C TC | CMOS | SYNCHRONOUS | 1.2mm | 1 | e4 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 0.65mm | 2.3V | 3.6V | 7 ns | 512Kb 64K x 8 | Non-Volatile | 16b | 2.3V~3.6V | 512KX1 | 1 | 104MHz | 3V | 256B | FLASH | SPI | 8μs, 1.75ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q64FVSTIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.28mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1mm | 1 | DUAL | YES | 1.27mm | S-PDSO-G8 | 3V | Not Qualified | 3.6V | 3-STATE | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 8MX8 | 8 | 67108864 bit | SERIAL | 104MHz | 0.00005A | 1 | 20 | HARDWARE/SOFTWARE | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C64D-SSHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 3 (168 Hours) | 8 | 5V | 4.925mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C | No SVHC | 64 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 8S1-8 | 1 | 3mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 40 | AT24C64D | 1.27mm | 1.7V | 550ns | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 8 | SERIAL | 1MHz | 0.000001A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75602S150BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 235mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.8 ns | 150MHz | 2.3MB | RAM, SDR, SRAM | 19b | Synchronous | 0.06A | 36b | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FVSIF | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2010 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | 5.23mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | 3V | YES | 1.27mm | S-PDSO-G8 | 2.7V | 3.6V | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 16MX8 | 8 | 134217728 bit | 104MHz | 3V | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR25H10CDF | Everspin Technologies Inc. | 6.2668 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 0.9mm | 1 | 27mA | DUAL | 3V | 8 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 600mW | 10 ns | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 0.000115A | 8b | RAM | SPI |
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Surface Mount 44 Pin Memory IC 1 Mb kb 18.41mm mm 70mA mA 8b b
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MR25H10MDF Everspin Technologies Inc.
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93C66-E/SN Microchip Technology
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Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 128 Mb kb 6mm mm
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71T75602S150BGGI8 Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 18 Mb kb 14mm mm 235mA mA 36b b
Price: 0.0000
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MR25H10CDF Everspin Technologies Inc.
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