Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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70V25L20PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 26b | 0.195mA | 8KX16 | 0.005A | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT41K512M8DA-125:P TR") |
MT41K512M8DA-125:P TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 13.5ns | 4Gb 512M x 8 | Volatile | 1.283V~1.45V | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25M512JVBIQ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | yes | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24 | 24-TBGA | SPI, Serial | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | NOT SPECIFIED | YES | 1mm | 2.7V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 64MX8 | 8 | 536870912 bit | 104MHz | 1 | 3V | FLASH | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25AA160DT-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 25AA160D | 8 | 0.65mm | 160 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75902S75BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2005 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | RAM, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7142LA55C | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2007 | Active | 70°C | 0°C | 5V | 2 | 61.72mm | RoHS Compliant | Contains Lead | No | 48 | DIP | Parallel | 5.5V | 4.5V | 16 kb | 15.24mm | 3.3mm | 110mA | 55 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL512P12FFIV20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2003 | GL-P | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | Lead Free | Copper, Silver, Tin | No | 64 | 64-LBGA | No SVHC | 512 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 110mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 3V | 1mm | 2.7V | 1.8/3.33/3.3V | 3.6V | 512Mb 32M x 16 | Non-Volatile | 1.65V~3.6V | 512MX1 | 1 | Asynchronous | 8b | 0.000005A | 120 ns | 8 | 3V | YES | YES | YES | 512 | 8/16words | YES | YES | FLASH | Parallel | 120ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||
|
70T3319S133BFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2010 | yes | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 2.5V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 4 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1.7mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 208 | INDUSTRIAL | YES | 0.8mm | SRAMs | 3-STATE | RAM, SRAM | 18b | 0.45mA | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V25L25PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | Non-RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 180mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.005A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V9159L7PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 72 kb | 45.45MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 18 ns | RAM, SRAM | 13b | 8KX9 | Synchronous | 0.003A | 9b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V658S12BFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 3.45V | 3.15V | 2.3 Mb | 15mm | 1.4mm | CMOS | 1 | 515mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 32b | 64KX36 | Asynchronous | 0.015A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70121L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 210mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | NOT SPECIFIED | 52 | COMMERCIAL | SRAMs | Not Qualified | 5V | 3-STATE | 35 ns | 2.3kB | RAM, SDR, SRAM | 11b | Asynchronous | 0.005A | 9b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67903S85BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2004 | no | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | 9 Mb | 13mm | 1.2mm | CMOS | 1 | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | INDUSTRIAL | YES | SRAMs | 3.465V | 3-STATE | RAM, SRAM | 19b | 87MHz | 0.07A | 8.5 ns | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V34S25PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 190mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 9kB | RAM, SDR, SRAM | 24b | 4KX18 | Asynchronous | 0.005A | 18b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA20PZI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 1 | 11.8mm | Non-RoHS Compliant | TSSOP | Parallel | not_compliant | 8mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 240 | 5V | 20 | 28 | INDUSTRIAL | YES | 0.55mm | R-PDSO-G28 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.145mA | 32KX8 | 8 | 262144 bit | 0.015A | 20 ns | YES | COMMON | 4.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3589S166DRG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | 2009 | yes | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 28mm | RoHS Compliant | Lead Free | No | 208 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | PQFP | Parallel | 3.45V | 3.15V | 2.3 Mb | 166MHz | 28mm | 3.5mm | CMOS | 4.1mm | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 30 | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | 256kB | RAM, SDR, SRAM | 32b | 0.5mA | 64KX36 | 0.03A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7054S35PRF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 128-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Quad Port, Asynchronous | IDT7054 | 128-TQFP (14x20) | 35ns | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S75BQG | Integrated Device Technology (IDT) | 7.7031 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Bulk | 2005 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | FLOW THROUGH ARCHITECTURE | FBGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 117MHz | 13mm | 1.2mm | CMOS | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 117MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7007S35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 295mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 35 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416YS10PHI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 2008 | 3 (168 Hours) | 44 | 85°C | -40°C | 3.3V | 1 | Non-RoHS Compliant | 44 | TSOP | Parallel | 3.6V | not_compliant | 3V | 4 Mb | CMOS | 200mA | e0 | DUAL | GULL WING | 3.3V | INDUSTRIAL | 0.8mm | SRAMs | Not Qualified | 3-STATE | 10 ns | RAM, SRAM - Asynchronous | 18b | 16 | Asynchronous | 0.02A | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W632GU8KB-12 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 2Gb 256M x 8 | Volatile | 1.283V~1.45V | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BGGI | Integrated Device Technology (IDT) | 10.4595 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 310mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3578YS133PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2015 | 3 (168 Hours) | 100 | 3A991 | 70°C | 0°C | 20mm | RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 30 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-F100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 256KX18 | 18 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
6116LA25TDB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Bulk | 2013 | no | Active | 1 (Unlimited) | 24 | 125°C | -55°C | 5V | 1 | 32.51mm | RoHS Compliant | Contains Lead | No | 24 | CDIP | Parallel | 5.5V | 4.5V | 16 kb | 7.62mm | 3.56mm | CMOS | 5.08mm | 1 | 85mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 24 | MILITARY | 2.54mm | SRAMs | 5V | 3-STATE | 25 ns | MIL-STD-883 Class B | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.0003A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F1G01ABAFDWB-IT:F TR | Micron Technology Inc. | 3.0848 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 1G x 1 | Non-Volatile | 2.7V~3.6V | FLASH | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S29GL128N10FFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Bulk | 2016 | Obsolete | Vendor Undefined | 64 | 85°C | -40°C | 13mm | RoHS Compliant | 64 | BGA | Parallel | 3.6V | 2.7V | 128 Mb | 11mm | CMOS | 1.4mm | 8542.32.00.51 | 1 | 90mA | e1 | Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5) | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | INDUSTRIAL | 1mm | 100 ns | 15.3MB | NOR | 8MX16 | 16 | Asynchronous | 8 | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W632GG8NB12I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 2Gb 256M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M58LT256KST8ZA6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2010 | Obsolete | 3 (168 Hours) | 85°C | -40°C | 1.8V | ROHS3 Compliant | No | 64 | 64-TBGA | Parallel, Serial | 2V | 1.7V | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 27mA | M58LT256 | 64-TBGA (10x13) | 85ns | 256Mb 16M x 16 | Non-Volatile | 24b | 1.7V~2V | Asynchronous | 52MHz | 16b | FLASH | Parallel | 85ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST25VF080B-50-4I-S2AE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2005 | SST25 | Active | 3 (168 Hours) | 8 | 3.3V | 5.275mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.209, 5.30mm Width) | 8 Mb | 2.16mm | 5.275mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 40 | SST25VF080B | 1.27mm | 2.7V | 3.6V | 85°C | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 1 | SERIAL | 50MHz | 2.7V | FLASH | SPI | 10μs |
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