Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "DS28E01P-W0N+1") |
DS28E01P-W0N+1 | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA12YGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | yes | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | RoHS Compliant | 28 | Parallel | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 30 | 28 | INDUSTRIAL | YES | 1.27mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.16mA | 32KX8 | 8 | 262144 bit | 0.015A | 12 ns | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR2A16ACYS35R | Everspin Technologies Inc. | 11.3897 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2002 | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | 4 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.71 | 1 | 165mA | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 44 | 0.8mm | 3V | Not Qualified | 3.6V | 4Mb 256K x 16 | Non-Volatile | 3V~3.6V | 256KX16 | 16 | 16b | 0.028A | 35 ns | 16b | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V321L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 3.3V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | BATTERY BACKUP;AUTOMATIC POWER DOWN | PLCC | Parallel | 3.6V | 3V | 16 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 95mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 52 | COMMERCIAL | SRAMs | 3-STATE | 35 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB85RS256TYPNF-G-BCERE1 | Fujitsu Electronics America, Inc. | 3.2163 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~125°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 256Kb 32K x 8 | Non-Volatile | 1.8V~3.6V | 33MHz | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB85R256FPF-G-BND-ERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-SOIC (0.295, 7.50mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 28-SOP | 150ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | FRAM | Parallel | 150ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85RC64TAPNF-G-BDERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 130ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~3.6V | 3.4MHz | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB85RS128BPNF-G-JNE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tube | 2014 | Discontinued | 3 (168 Hours) | 85°C | -40°C | RoHS Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI | 3.6V | Unknown | 2.7V | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 128Kb 16K x 8 | Non-Volatile | 2.7V~3.6V | 33MHz | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3599S133BF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tape & Reel (TR) | Active | 4 (72 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3599 | 208-CABGA (15x15) | 4.2ns | 4.5Mb 128K x 36 | Volatile | 3.15V~3.45V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G02FVJ-3GTE2 | ROHM Semiconductor | 0.9324 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 3mm | ROHS3 Compliant | Lead Free | Tin | SEATED HT-CALCULATED | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | 2 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G02 | 0.65mm | S-PDSO-G8 | 1.6V | 5.5V | 900 ns | 2Kb 256 x 8 | Non-Volatile | 1.6V~5.5V | 256X8 | 8 | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST38VF6402-90-5I-EKE | Microchip Technology | 6.6452 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Surface Mount | Tray | 2000 | SST38 | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.3V | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | TOP BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | 64 Mb | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST38VF6402 | 48 | 0.5mm | 2.7V | 3.6V | 90ns | 64Mb 4M x 16 | Non-Volatile | 22b | 2.7V~3.6V | 4MX16 | 16 | Asynchronous | 16b | 0.00003A | 16b | 2.7V | YES | YES | YES | 1K | 4words | YES | YES | FLASH | Parallel | 10μs | 4K | TOP | |||||||||||||||||||||||||||||||||||||||||||
|
25AA020A/W16K | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 1 (Unlimited) | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | EEPROM | 25AA020A | Die | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85RS128APNF-G-JNE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tray | 2005 | Not For New Designs | 1 (Unlimited) | 85°C | -40°C | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.6V | Unknown | 3V | 25MHz | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 128Kb 16K x 8 | Non-Volatile | 3V~3.6V | 25MHz | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85RC16VPNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 550ns | 16Kb 2K x 8 | Non-Volatile | 3V~5.5V | 1MHz | FRAM | I2C | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85R256GPF-G-BNDE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | FRAM | Parallel | 150ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MB85RS64TUPNF-G-JNERE2 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 64Kb 8K x 8 | Non-Volatile | 1.8V~3.6V | 10MHz | FRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RMLV0416EGSB-4S2#AA1 | Renesas Electronics America | 3.7769 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | yes | Active | 3 (168 Hours) | 44 | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 44 | YES | R-PDSO-G44 | 2.7V | 3.6V | 4Mb 256K x 16 | Volatile | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
GD25Q127CSIG | GigaDevice Semiconductor (HK) Limited | 0.5544 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 12μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA183BQG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V35761 | 165-CABGA (13x15) | 3.3ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 183MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M24512-RMN6TP | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | ACTIVE (Last Updated: 6 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 512 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SO8N-SO-A | 1 | 5mA | e4 | DUAL | 260 | 2.5V | 30 | M24512 | 8 | 1.27mm | 85°C | 500ns | 512Kb 64K x 8 | Non-Volatile | 1.8V~5.5V | SERIAL | 1MHz | 0.000001A | 200 | 4000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F4G08ABCWC-ET:C TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TSOP | Surface Mount | -40°C~85°C TA | FLASH - NAND | MT29F4G08 | 4Gb 512M x 8 | Non-Volatile | 1.7V~1.95V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR93G56FJ-3AGTE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | SEATED HT-CALCULATED, ALSO AVAILABLE 2.5-4.5V OPERATES WITH 2MHZ, 1.7-2.5V OPERATES WITH 1MHZ | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 4.5V | 5.5V | 2Kb 128 x 16 | Non-Volatile | 1.7V~5.5V | 128X16 | 16 | 2048 bit | SERIAL | 3MHz | 5ms | 3-WIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C256M8D3LB-12BCN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | Active | 3 (168 Hours) | 78 | 1 | 10.5mm | ROHS3 Compliant | AUTO/SELF REFRESH | 78-VFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.35V | YES | 0.8mm | R-PBGA-B78 | 1.283V | 1.45V | 20ns | 2Gb 256M x 8 | Volatile | 1.283V~1.45V | 256MX8 | 8 | 2147483648 bit | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL256SAGMFB010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2016 | Automotive, AEC-Q100, FL-S | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | ALSO CONFIGURABLE AS 256M X 1 | 16-SOIC (0.295, 7.50mm Width) | 7.5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G16 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | SERIAL | 133MHz | 2 | 500ms | 3V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M29W256GL7AN6F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | M29W256 | 256Mb 32M x 8 16M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS1225AD-150+ | Maxim Integrated | 18.0333 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2004 | yes | Active | 1 (Unlimited) | 28 | EAR99 | 38.865mm | ROHS3 Compliant | Lead Free | 28 | 10 YEAR DATA RETENTION | 28-DIP Module (0.600, 15.24mm) | not_compliant | 15.24mm | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 10.54mm | 8473.30.11.40 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1225A | 28 | NO | 2.54mm | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 64Kb 8K x 8 | Non-Volatile | 0.075mA | 4.5V~5.5V | 8KX8 | 8 | 65536 bit | 0.01A | 150 ns | NVSRAM | Parallel | 150ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1312TV18-250BZC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | 70°C | 0°C | Non-RoHS Compliant | 165 | 165-LBGA | Parallel | 250MHz | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | CY7C1312 | 165-FBGA (13x15) | 18Mb 1M x 18 | Volatile | 1.7V~1.9V | 250MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62WV25616DBLL-45TI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | no | Discontinued | 3 (168 Hours) | 44 | 3A991.B.2.A | 18.41mm | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.2mm | 8542.32.00.41 | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | 44 | YES | 0.8mm | 2.3V | Not Qualified | 2.5/3.3V | 3.6V | 3-STATE | 4Mb 256K x 16 | Volatile | 0.018mA | 2.3V~3.6V | 256KX16 | 16 | 4194304 bit | 0.000007A | 45 ns | COMMON | 1.2V | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W979H6KBQX2I | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 168 | 85°C | -40°C | 1 | 12mm | RoHS Compliant | 168 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | Parallel | 400MHz | 12mm | CMOS | SYNCHRONOUS | 0.8mm | 1 | BOTTOM | BALL | 1.2V | INDUSTRIAL | YES | 0.5mm | 1.14V | 1.3V | RAM, SDRAM | 32MX16 | 16 | 536870912 bit | FOUR BANK PAGE BURST | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC4GACAJCN-1M WT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tray | e•MMC™ | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 30 | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC |
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IDT71256SA12YGI Integrated Device Technology (IDT)
5V V 28 Pin Memory IC 17.9324mm mm
Price: 0.0000
RFQ -
MR2A16ACYS35R Everspin Technologies Inc.
Surface Mount 44 Pin Memory IC 4 Mb kb 18.41mm mm 165mA mA 16b b
Price: 11.3897
RFQ -
71V321L35J8 Integrated Device Technology (IDT)
Surface Mount 52 Pin Memory IC 16 kb kb 19mm mm 95mA mA 8b b
Price: 0.0000
RFQ -
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BR24G02FVJ-3GTE2 ROHM Semiconductor
Surface Mount Memory IC BR24G02 2 kb kb 3mm mm
Price: 0.9324
RFQ -
SST38VF6402-90-5I-EKE Microchip Technology
Surface Mount SST38 48 Pin Memory IC SST38 Series SST38VF6402 64 Mb kb 18.4mm mm 18mA mA 16b b
Price: 6.6452
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M24512-RMN6TP STMicroelectronics
Surface Mount 8 Pin Memory IC M24512 512 kb kb 4.9mm mm 5mA mA
Price: 0.0000
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S25FL256SAGMFB010 Cypress Semiconductor Corp
Automotive, AEC-Q100, FL-S Memory IC Automotive, AEC-Q100, FL-S Series 10.3mm mm
Price: 0.0000
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IS62WV25616DBLL-45TI ISSI, Integrated Silicon Solution Inc
2.5/3.3V V 44 Pin Memory IC 18.41mm mm
Price: 0.0000
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