Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W632GG6MB11I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 7.5mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.5V | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 2Gb 128M x 16 | Volatile | 1.425V~1.575V | 128MX16 | 16 | 2147483648 bit | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q256FVCIG | Winbond Electronics | 2.1117 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24 | 24-TBGA | SPI, Serial | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 3V | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 256MX1 | 1 | 268435456 bit | 104MHz | 0.000025A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "W632GG8NB-12") |
W632GG8NB-12 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 2Gb 256M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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40060108 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Last Time Buy | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C512R-45TU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | -40°C~85°C TC | EPROM - OTP | AT27C512 | 28-TSOP | 45ns | 512Kb 64K x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X05CLSNIG | Winbond Electronics | 0.4834 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | DUAL | 3V | 8 | YES | 1.27mm | R-PDSO-G8 | 2.7V | Not Qualified | 2.5/3.3V | 3.6V | 512Kb 64K x 8 | Non-Volatile | 0.015mA | 2.3V~3.6V | 512KX1 | 1 | 524288 bit | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||
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W631GG6MB-11 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Cut Tape (CT) | 2017 | Active | 3 (168 Hours) | ROHS3 Compliant | 96-VFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 64M x 16 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9412G6KH-5 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | ROHS3 Compliant | 66-TSSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SDRAM - DDR | 50ns | 128Mb 8M x 16 | Volatile | 2.3V~2.7V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X40CLSSIG | Winbond Electronics | 0.6947 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2016 | SpiFlash® | Active | 3 (168 Hours) | 8 | EAR99 | 5.28mm | ROHS3 Compliant | IT ALSO OPERATES AT 2.3 V AT 80 MHZ | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.28mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | DUAL | 3V | 8 | YES | 1.27mm | S-PDSO-G8 | 2.7V | 3.6V | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 4MX1 | 1 | 4194304 bit | 104MHz | 2.7V | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LCS52T-I/MC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2003 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 2mm | ROHS3 Compliant | Tin | No | 8 | 8-VFDFN Exposed Pad | 2-Wire, I2C, Serial | 2 kb | 950μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LCS52 | 8 | 0.5mm | 2.2V | 2.5/5V | 5.5V | 900ns | 2Kb 256 x 8 | Non-Volatile | 2.2V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||
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70V631S12BFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | Parallel | 3.45V | 3.15V | 4.5 Mb | 15mm | 1.4mm | CMOS | 1 | 515mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 18b | Asynchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29GL01GT11DHB020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | 64 | 9mm | ROHS3 Compliant | CAN ALSO ORGANISED AS 1GX1 | 9mm | CMOS | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | INDUSTRIAL | YES | 1mm | S-PBGA-B64 | 2.7V | 105°C | -40°C | 3.6V | AEC-Q100 | 64MX16 | 16 | 1073741824 bit | FLASH | PARALLEL | 110 ns | 2.7V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25AA080C-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | SPI, Serial | 8 kb | 950μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 25AA080C | 8 | 0.65mm | 160 ns | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S80BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 210mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 8 ns | RAM, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H64M8CB-5E:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2006 | Obsolete | 5 (48 Hours) | 60 | EAR99 | 1.8V | 1 | 12mm | ROHS3 Compliant | Lead Free | 60 | AUTO/SELF REFRESH | 60-FBGA | unknown | 512 Mb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 115mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT47H64M8 | 60 | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 600ps | 512Mb 64M x 8 | Volatile | 16b | 1.7V~1.9V | 64MX8 | 8 | 200MHz | 0.007A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||||
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W25Q64DWZPIG | Winbond Electronics | 0.4506 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2012 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 1.8V | 6mm | ROHS3 Compliant | 8 | TOP/BOTTOM BOOT BLOCK | 8-WDFN Exposed Pad | SPI, Serial | 64 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 40mA | DUAL | 1.8V | 8 | 1.27mm | 1.7V | Not Qualified | 1.95V | 7 ns | 64Mb 8M x 8 | Non-Volatile | 1b | 1.7V~1.95V | 256KX32 | 32 | Synchronous | 104MHz | 0.00002A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LV25616AL-10TI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | no | Not For New Designs | 2 (1 Year) | 44 | 3.3V | 1 | Non-RoHS Compliant | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 4 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 110mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 3.3V | 44 | 0.8mm | 3.63V | 3-STATE | 4Mb 256K x 16 | Volatile | 18b | 3.135V~3.6V | 16 | Asynchronous | 16b | COMMON | 2V | SRAM | Parallel | 10ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28BV256-20JU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tube | 1997 | yes | Active | 2 (1 Year) | 32 | 3.3V | 13.97mm | ROHS3 Compliant | Lead Free | No | 32 | 32-LCC (J-Lead) | Parallel, SPI | No SVHC | 256 kb | 200GHz | 11.43mm | Surface Mount | -40°C~85°C TC | CMOS | 3.556mm | 1 | 15mA | e3 | Matte Tin (Sn) - annealed | QUAD | 245 | 3V | 40 | AT28BV256 | 1.27mm | 2.7V | 3.6V | 200ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 0.00002A | 10 | 10000 Write/Erase Cycles | HARDWARE/SOFTWARE | 10ms | 3V | YES | YES | 64words | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||
|
625432-0030 03 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT28C256F-15TU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tape & Reel (TR) | 1997 | Active | 3 (168 Hours) | 28 | 11.8mm | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | 8mm | Surface Mount | -40°C~85°C TC | CMOS | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 5V | YES | 0.55mm | R-PDSO-G28 | 4.5V | 5.5V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 3ms | 5V | EEPROM | Parallel | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S29GL256S90DHSS30 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | GL-S | Active | 3 (168 Hours) | ROHS3 Compliant | 64 | 64-LBGA | Surface Mount | 0°C~85°C TA | FLASH - NOR | 90ns | 256Mb 16M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75602S150PFG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71T75 | 100-TQFP (14x14) | 3.8ns | 18Mb 512K x 36 | Volatile | 2.375V~2.625V | 150MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71342LA20PFG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 64-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT71342 | 64-TQFP (14x14) | 20ns | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7026L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 256 kb | 29.21mm | 3.63mm | 230mA | 84 | 55 ns | 32kB | RAM, SDR, SRAM | 14b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C512M8D3LB-12BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | 78 | 1 | 10.6mm | ROHS3 Compliant | AUTO/SELF REFRESH; ALSO OPERATES AT 1.35 V | 78-VFBGA | 9mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.5V | NOT SPECIFIED | YES | 0.8mm | R-PBGA-B78 | 1.425V | 1.575V | 20ns | 4Gb 512M x 8 | Volatile | 1.283V~1.45V | 512MX8 | 8 | 4294967296 bit | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C08A-10PC-1.8 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C TA | EEPROM | AT24C08 | 8-PDIP | 4.5μs | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3319S166PRF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.45V | 3.15V | 4.5 Mb | 166MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 500mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 36b | Synchronous | 0.03A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V631S15PRF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | TQFP | Parallel | 3.45V | 3.15V | 4.5 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 440mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 18b | Asynchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA044-E/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2002 | Active | 1 (Unlimited) | 8 | 9.271mm | ROHS3 Compliant | Tin | 8 | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | 7.62mm | Through Hole | -40°C~125°C TA | CMOS | SYNCHRONOUS | 5.334mm | 1 | e3 | DUAL | NOT APPLICABLE | 2.5V | NOT APPLICABLE | 24AA044 | 1.27mm | 1.7V | 5.5V | 400ns | TS 16949 | 4Kb 256 x 8 x 2 | Non-Volatile | 1.7V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W94AD6KBHX5I TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | Surface Mount | -40°C~85°C TC | SDRAM - Mobile LPDDR | 5ns | 1Gb 64M x 16 | Volatile | 1.7V~1.95V | 200MHz | DRAM | Parallel | 15ns |
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W25Q256FVCIG Winbond Electronics
3/3.3V V SpiFlash® Memory IC SpiFlash® Series 8mm mm
Price: 2.1117
RFQ -
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W25X05CLSNIG Winbond Electronics
2.5/3.3V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 4.9mm mm
Price: 0.4834
RFQ -
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W25X40CLSSIG Winbond Electronics
SpiFlash® 8 Pin Memory IC SpiFlash® Series 5.28mm mm
Price: 0.6947
RFQ -
24LCS52T-I/MC Microchip Technology
2.5/5V V Surface Mount 8 Pin Memory IC 24LCS52 2 kb kb 2mm mm 3mA mA
Price: 0.0000
RFQ -
70V631S12BFGI8 Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 4.5 Mb kb 15mm mm 515mA mA 18b b
Price: 0.0000
RFQ -
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25AA080C-I/MS Microchip Technology
Surface Mount 8 Pin Memory IC 25AA080C 8 kb kb 3mm mm 5mA mA
Price: 0.0000
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71V3577S80BGI8 Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 210mA mA 36b b
Price: 0.0000
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MT47H64M8CB-5E:B Micron Technology Inc.
Surface Mount 60 Pin Memory IC MT47H64M8 512 Mb kb 12mm mm 115mA mA
Price: 0.0000
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W25Q64DWZPIG Winbond Electronics
Surface Mount SpiFlash® 8 Pin Memory IC SpiFlash® Series 64 Mb kb 6mm mm 40mA mA 8b b
Price: 0.4506
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IS61LV25616AL-10TI ISSI, Integrated Silicon Solution Inc
Surface Mount 44 Pin Memory IC 4 Mb kb 110mA mA 16b b
Price: 0.0000
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AT28BV256-20JU Microchip Technology
Surface Mount Memory IC AT28BV256 256 kb kb 13.97mm mm 15mA mA
Price: 0.0000
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7026L55J8 Integrated Device Technology (IDT)
Surface Mount 84 Pin Memory IC 256 kb kb 29.21mm mm 230mA mA 16b b
Price: 0.0000
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70V3319S166PRF8 Integrated Device Technology (IDT)
Surface Mount 128 Pin Memory IC 4.5 Mb kb 20mm mm 500mA mA 18b b
Price: 0.0000
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70V631S15PRF8 Integrated Device Technology (IDT)
Surface Mount 128 Pin Memory IC 4.5 Mb kb 20mm mm 440mA mA 18b b
Price: 0.0000
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