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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

IC Adapters

Additional Feature

  • ADAPTER
  • SOCKET ADAPTER
  • SOCKET ADAPTER, 94V-0
  • SOCKET ADAPTER, UL 94V-0
  • STANDARD: UL 94V-0
  • UL 94V-0

Board Material

  • FR4 Epoxy Glass
  • Polyimide (PI)

Body Breadth

  • 0.7 inch

Body Depth

  • 0.3 inch

Body Material

  • Glass, Polysulfone

Cable Length

  • 3m

Connector Type

  • DIP, Socket

Contact Finish - Mating

  • GOLD
  • GOLD (10)
  • GOLD (10) OVER NICKEL (100)
  • NOT SPECIFIED
  • Silver
  • TIN
  • TIN LEAD
  • Tin-Lead

Contact Finish - Post

  • Gold
  • Tin
  • Tin-Lead

Contact Finish Thickness - Post

  • Flash

Contact Material

  • Brass
  • Copper

Contact Material - Mating

  • Beryllium Copper
  • Brass
  • Copper
  • Phosphor Bronze

Contact Material - Post

  • Beryllium Copper
  • Brass
  • Brass Alloy
  • Phosphor Bronze

Contact Plating

  • Gold
  • Gold, Tin
  • Lead, Tin
  • Silver
  • Tin

Contact Style

  • RND PIN-SKT

Convert From (Adapter End)

  • AT90PWM1
  • AT90PWM2
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • HB2E Relay
  • MSOP
  • Multiple Packages
  • PLCC
  • PQFP
  • QFP
  • SIP
  • Socket, 0.6 (15.24mm) Row Spacing
  • SOIC
  • SOIC-W
  • SOJ
  • SSOP
  • TQFP
  • TSOP
  • VQFP

Convert To (Adapter End)

  • DIP
  • DIP, 0.3 (7.62mm) Row Spacing
  • DIP, 0.4 (10.16mm) Row Spacing
  • DIP, 0.6 (15.24mm) Row Spacing
  • DIP, 0.8 (20.32mm) Row Spacing
  • DIP, 0.9 (22.86mm) Row Spacing
  • DIP, 1.0 (25.40mm) Row Spacing
  • JEDEC
  • PGA
  • PLCC
  • QFP
  • SOIC
  • SOWIC

Core Architecture

  • AVR

Current Rating

  • 1A
  • 3A

Current Rating (Amps)

  • 1A
  • 3A

Depth

  • 25.4mm
  • 32.3mm
  • 32mm
  • 43.2mm
  • 6.9mm

Device Socket Type

  • IC SOCKET

ECCN Code

  • EAR99

Factory Lead Time

  • 16 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks

Feature

  • Closed Frame
  • High Temperature
  • Socket Included

Flammability Rating

  • UL94 V-0

Gender

  • Female

Height

  • 1.58mm
  • 2.29mm
  • 2.39mm
  • 5.85mm
  • 6.08mm
  • 6.9mm

Housing Material

  • Polyamide
  • Polyamide (PA46), Nylon 4/6, Glass Filled
  • Polyester
  • Polyphenylene Sulfide (PPS)
  • Polysulfone (PSU), Glass Filled
  • RYTON

Insulation Resistance

  • 1GOhm

JESD-609 Code

  • e0
  • e3
  • e4

Lead Free

  • Contains Lead
  • Lead Free

Lead Length

  • 2.032mm
  • 2.286mm
  • 3.175mm
  • 3.302mm
  • 3.683mm
  • 3.81mm
  • 3m
  • 5.9944mm

Lead Pitch

  • 1.27mm
  • 2.54mm

Length

  • 10.2mm
  • 100.3mm
  • 17.8mm
  • 19.4mm
  • 20.3mm
  • 22.2mm
  • 22.9mm
  • 25.4mm
  • 30.5mm
  • 34.3mm
  • 35.6mm
  • 39.4mm
  • 3m
  • 40.1mm
  • 40.5mm
  • 40.6mm
  • 43.2mm
  • 45mm
  • 50.3mm
  • 55.2mm
  • 65.5mm
  • 68.1mm
  • 69.9mm
  • 72.5mm
  • 95.7mm

Material

  • Glass, Polyester, Thermoplastic
  • Polyester

Material Flammability Rating

  • UL94 V-0

Moisture Sensitivity Level (MSL)

  • 1 (Unlimited)
  • Not Applicable

Mount

  • Socket
  • Surface Mount
  • Through Hole
  • Through Hole, Wire
  • Wire

Mounting Type

  • Surface Mount
  • Through Hole

Number of Contacts

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 200
  • 208
  • 22
  • 24
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Pins

  • 10
  • 100
  • 12
  • 128
  • 132
  • 14
  • 144
  • 16
  • 160
  • 169
  • 18
  • 184
  • 20
  • 208
  • 22
  • 24
  • 26
  • 28
  • 32
  • 36
  • 40
  • 42
  • 44
  • 48
  • 52
  • 56
  • 60
  • 64
  • 68
  • 8
  • 80
  • 84
  • 90

Number of Positions

  • 10
  • 12
  • 14
  • 144
  • 16
  • 160
  • 18
  • 20
  • 22
  • 24
  • 26
  • 28
  • 32
  • 40
  • 42
  • 48
  • 56
  • 64
  • 90
  • 95

Number of Rows

  • 1
  • 2

Orientation

  • Straight

Package / Case

  • PLCC
  • QFP
  • SOIC
  • TO-8
  • TSOP

Packaging

  • Box
  • Bulk

Part Status

  • Active
  • Obsolete

Pbfree Code

  • no
  • yes

PCB Contact Pattern

  • RECTANGULAR

PCB Contact Row Spacing

  • 0.3 mm
  • 0.6 mm

Pitch

  • 1.778mm
  • 1.78mm
  • 2.54mm

Pitch - Mating

  • 0.020 0.50mm
  • 0.024 0.60mm
  • 0.025 0.64mm
  • 0.026 0.65mm
  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Pitch - Post

  • 0.031 0.80mm
  • 0.050 1.27mm
  • 0.070 1.78mm
  • 0.100 2.54mm

Published

  • 2000
  • 2001
  • 2002
  • 2003
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2017
  • 2018

Radiation Hardening

  • No

REACH SVHC

  • No SVHC

RoHS Status

  • Non-RoHS Compliant
  • RoHS Compliant
  • ROHS3 Compliant

Row Spacing

  • 10.16 mm
  • 15.24 mm
  • 2.54 mm
  • 20.32 mm
  • 22.86 mm
  • 25.4 mm
  • 3.81 mm
  • 7.62 mm

Sensing Distance

  • 3 m

Series

  • 647
  • DS9075

Termination

  • Solder
  • Wire Wrap

Termination Post Length

  • 0.030 0.76mm
  • 0.031 0.80mm
  • 0.080 2.03mm
  • 0.089 2.28mm
  • 0.090 2.29mm
  • 0.125 3.18mm
  • 0.130 3.30mm
  • 0.145 3.68mm
  • 0.150 3.81mm
  • 0.180 4.57mm
  • 0.236 6.00mm
  • 0.620 15.75mm

Voltage - Rated

  • 1kV

Weight

  • 453.59237g
  • 680.388555g

Width

  • 24.4mm
  • 27.9mm
  • 32.3mm
  • 32mm
  • 38.5mm
  • 43.2mm
  • 6.9mm
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Weight Operating Temperature Lead Length JESD-609 Code Body Material Body Breadth Number of Rows PCB Contact Pattern Body Depth Contact Style Feature Pitch Current Rating (Amps) PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
    214-3339-09-0602J 214-3339-09-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 14 150°C -55°C Female Gold 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    1106396-14 1106396-14 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1106396 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 2 RECTANGULAR RND PIN-SKT 0.6 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    20-665000-00 20-665000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant 20 Surface Mount 787.4μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
    97-68340-P 97-68340-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2008 Correct-A-Chip® 68340 Active 1 (Unlimited) Solder EAR99 Tin 144 Non-RoHS Compliant Lead Free 144 SOCKET ADAPTER Through Hole 105°C IC SOCKET 0.026 0.65mm 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
    97-AQ132D-P 97-AQ132D-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2009 Correct-A-Chip® 97-AQ132D Active 1 (Unlimited) Solder EAR99 Gold 132 ROHS3 Compliant 132 SOCKET ADAPTER Through Hole 105°C e0 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm PQFP PGA FR4 Epoxy Glass
    1107254-20 1107254-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1107254 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 SOCKET ADAPTER 2.54mm Through Hole 3.302mm e3 0.7 inch 2 RECTANGULAR 0.3 inch RND PIN-SKT 0.3 mm UL94 V-0 IC SOCKET 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm Beryllium Copper Brass 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
    08-666000-00 08-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 8 Non-RoHS Compliant 8 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    24-354000-10 24-354000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    44-652000-10 44-652000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Lead Free Tin 1A 44 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    228-1290-29-0602J 228-1290-29-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2000 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Female Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole 453.59237g -55°C~125°C 2.54mm 1A UL94 V-0 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.4 (10.16mm) Row Spacing DIP, 0.4 (10.16mm) Row Spacing
    32-652000-10-P 32-652000-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder Non-RoHS Compliant Lead Free 1A 32 PLCC Through Hole 3.175mm 1A 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    20-301550-10 20-301550-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 762μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.030 0.76mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
    264-1300-09-0602J 264-1300-09-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 64 150°C -55°C Female Gold Straight 6.9mm 64 72.5mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 64 38.5mm Through Hole -55°C~125°C Glass, Polysulfone Closed Frame 1.78mm 1A UL94 V-0 20.32 mm 0.070 1.78mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.070 1.78mm DIP, 0.8 (20.32mm) Row Spacing DIP, 0.8 (20.32mm) Row Spacing
    24-354000-20 24-354000-20 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    224-1275-19-0602J 224-1275-19-0602J Artery 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Wire Wrap 24 150°C -55°C Female Gold Straight 6.9mm 24 45mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1kV 1A 24 32mm Through Hole 453.59237g -55°C~125°C Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 15.24 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
    32-354000-10 32-354000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder 32 Gold ROHS3 Compliant UL94 V-0 Gold 3A 32 Surface Mount 3A UL94 V-0 Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    28-555000-00 28-555000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks Surface Mount 2006 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 28 Non-RoHS Compliant 28 SOCKET ADAPTER Surface Mount e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
    36-651000-10 36-651000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 6 Weeks 2012 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 Tin 36 Non-RoHS Compliant 36 SOCKET ADAPTER Through Hole 105°C e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    20-666000-00 20-666000-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 20 Non-RoHS Compliant 20 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
    44-652000-11-RC 44-652000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 yes Active 1 (Unlimited) Solder EAR99 44 ROHS3 Compliant 1A 44 UL 94V-0 Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    64-304121-00 64-304121-00 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2006 Obsolete Not Applicable Solder EAR99 64 Non-RoHS Compliant Lead Free 64 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.031 0.80mm TQFP QFP FR4 Epoxy Glass
    14-354000-11-RC 14-354000-11-RC Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Surface Mount Polyester Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 Copper 3A 14 STANDARD: UL 94V-0 No SVHC Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    1109342 1109342 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 6 Weeks Polyphenylene Sulfide (PPS) 2017 Correct-A-Chip® 1109342 Active 1 (Unlimited) Solder EAR99 Tin 40 Non-RoHS Compliant Lead Free 44 SOCKET ADAPTER, 94V-0 2.54mm Through Hole 105°C e3 2.54mm UL94 V-0 IC SOCKET Tin-Lead 150.0μin 3.81μm 200.0μin 5.08μm Phosphor Bronze Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    48-6645-18 48-6645-18 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2006 Correct-A-Chip® 6645 Active 1 (Unlimited) Solder EAR99 48 Non-RoHS Compliant 48 ADAPTER Through Hole e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm TQFP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    28-650000-10-P 28-650000-10-P Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2010 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder 28 35.6mm Non-RoHS Compliant 28 SOIC 1.58mm Through Hole 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    28-653000-10 28-653000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks Bulk 2011 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 28 Non-RoHS Compliant Contains Lead Tin 1A 28 UL 94V-0 6.08mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
    20-354000-10 20-354000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 20 Non-RoHS Compliant UL94 V-0 Tin 3A 20 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
    16-35W000-11-RC-P (220 UP) 16-35W000-11-RC-P (220 UP) Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder ROHS3 Compliant 16 Through Hole 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    18-35W000-10 18-35W000-10 Aries Electronics 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 18 22.9mm Non-RoHS Compliant Lead Free 18 1.58mm Through Hole IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
    22-304504-18 22-304504-18 Aries Electronics 0.0000
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    		 0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 304504 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant Lead Free 22 SOCKET ADAPTER Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
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