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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Contact Finish - Mating Number of Contacts RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Lead Pitch Mounting Type Operating Temperature HTS Code Contact Resistance Type Lead Length JESD-609 Code Number of Rows Contact Finish Termination Feature Current Rating (Amps) Material Flammability Rating Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post
ICM-318-1-GT-HT ICM-318-1-GT-HT Adam Tech 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 9 Weeks Polyphenylene Sulfide (PPS) Tube ICM Active 1 (Unlimited) Solder Gold ROHS3 Compliant Lead Free Through Hole -40°C~105°C 4mOhm DIP, 0.3 (7.62mm) Row Spacing Open Frame 3A UL94 V-0 0.100 2.54mm Tin Flash 18 (2 x 9) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
510-87-143-15-081101 510-87-143-15-081101 Preci-Dip 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 510 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 143 Through Hole -55°C~125°C 10mOhm PGA 3.175mm Open Frame UL94 V-0 0.100 2.54mm Tin Flash 143 (15 x 15) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
85-PGM11007-10H 85-PGM11007-10H Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2009 PGM Active 1 (Unlimited) Solder 105°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 3A Through Hole -55°C~105°C PGA 4.191mm 3A UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.165 4.19mm 0.100 2.54mm
522-93-114-13-062001 522-93-114-13-062001 Mill-Max Manufacturing Corp. 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 114 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA114
32-6518-01 32-6518-01 Aries Electronics 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 Active 1 (Unlimited) Solder 32 EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.6 (15.24mm) Row Spacing 3.175mm e4 2 Open Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 32 (2 x 16) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
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