Items : %s%s
RF Transceiver ICs
Contact Plating
- Copper, Gold
- Copper, Lead, Tin
- Copper, Silver, Tin
- Copper, Tin
- Gold
- Gold, Silver
- Gold, Tin
- Silver, Tin
- Tin
ECCN Code
- 3A991.A.2
- 5A002
- 5A002.A.1
- 5A991
- 5A991.A
- 5A991.B
- 5A991.B.1
- 5A991.G
- 5A992
- 5A992.B
- 5A992.C
- 5A992C
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 142 Weeks
- 143 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 26 Weeks
- 27 Weeks
- 28 Weeks
- 29 Weeks
- 3 Weeks
- 31 Weeks
- 4 Weeks
- 5 Weeks
- 52 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 18 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 2 weeks ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 hours ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- CONSULT SALES OFFICE (Last Updated: 1 week ago)
- CONSULT SALES OFFICE (Last Updated: 2 weeks ago)
- CONTACT ADI (Last Updated: 2 weeks ago)
- LAST SHIPMENTS (Last Updated: 1 week ago)
- LAST SHIPMENTS (Last Updated: 2 days ago)
- LAST SHIPMENTS (Last Updated: 2 weeks ago)
- NRND (Last Updated: 1 day ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 3 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 months ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
- PRODUCTION (Last Updated: 4 weeks ago)
Manufacturer Package Identifier
- 32QN2
- CYW20730A1KML2GT
- CYW20736A1KML2G
- ESP32-D0WD
- QFN32_POA_8362854
- QFN48 (5x5 mm)
- RGZ(S-PVQFN-N48)
- RHB (S-PVQFN-N32_
- RSM (S-PVQFN-N32)
- SI4464-B1X-FM
Material
- Metal
Max Operating Temperature
- 105°C
- 125°C
- 60°C
- 70°C
- 75°C
- 80°C
- 85°C
Mfr
- Espressif Systems
- Nordic Semiconductor ASA
Min Operating Temperature
- -10°C
- -20°C
- -25°C
- -35°C
- -40°C
- -45°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2 (1 Year)
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- 4 (72 Hours)
- 5 (48 Hours)
- 6 (Time on Label)
- Vendor Undefined
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 100
- 105
- 112
- 116
- 120
- 130
- 144
- 16
- 168
- 169
- 196
- 20
- 24
- 28
- 31
- 32
- 34
- 36
- 40
- 42
- 44
- 47
- 48
- 51
- 52
- 54
- 56
- 60
- 62
- 63
- 64
- 67
- 68
- 70
- 72
- 73
- 76
- 8
- 84
- 85
- 96
Number of Terminals
- 141
- 196
- 242
Number of Terminations
- 100
- 111
- 112
- 116
- 125
- 141
- 144
- 153
- 16
- 161
- 168
- 192
- 196
- 20
- 24
- 25
- 261
- 27
- 28
- 286
- 289
- 31
- 32
- 34
- 35
- 36
- 38
- 40
- 400
- 42
- 43
- 44
- 48
- 49
- 50
- 51
- 53
- 54
- 55
- 56
- 60
- 61
- 62
- 63
- 64
- 66
- 68
- 69
- 70
- 71
- 72
- 73
- 74
- 76
- 8
- 81
- 85
- 90
- 96
- 99
Operating Temperature
- -
- -10°C~60°C
- -10°C~70°C
- -10°C~85°C TA
- -20°C~60°C
- -20°C~70°C
- -20°C~75°C
- -20°C~80°C
- -20°C~85°C
- -20°C~85°C TA
- -25°C~70°C
- -25°C~75°C
- -25°C~75°C TA
- -25°C~85°C
- -30°C~70°C
- -30°C~85°C
- -30°C~85°C TA
- -35°C~85°C
- -40°C ~ 105°C
- -40°C ~ 125°C
- -40°C ~ 85°C
- -40°C ~ 85°C (TA)
- -40°C~105°C
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~110°C
- -40°C~120°C
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~135°C TJ
- -40°C~150°C
- -40°C~85°C
- -40°C~85°C TA
- -40°C~95°C
- -55°C~105°C
- 0°C~50°C
- 0°C~60°C
- 0°C~65°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
P1dB
- 10 dBm
Package / Case
- 100-SMD Module
- 100-TFBGA
- 100-TQFP
- 100-UFBGA, WLCSP
- 100-VFBGA
- 105-LFBGA
- 105-VFBGA
- 109-UFBGA, WLBGA
- 111-VFBGA
- 112-VFBGA
- 116-LGA Module
- 119-WFBGA, WLBGA
- 120-LFBGA
- 120-VFBGA
- 120-VFQFN Dual Rows, Exposed Pad
- 121-TFBGA
- 124-QFN
- 125-VFBGA
- 130-FLGA Module
- 133-UFBGA, WLBGA
- 138-UFBGA, WLBGA
- 140-UFBGA, WLBGA
- 141-UFBGA, WLBGA
- 144-LFBGA
- 144-LFBGA, CSPBGA
- 144-LQFP Exposed Pad
- 144-TFBGA
- 145-TFLGA
- 145-UFBGA, WLBGA
- 151-UFBGA, WLBGA
- 153-XFBGA, WLCSP
- 155-WFBGA
- 16-TSSOP (0.173, 4.40mm Width)
- 16-WFQFN Exposed Pad
- 16-WQFN Exposed Pad
- 161-LFBGA, FCBGA
- 161-TFBGA, FCCSP
- 161-TFLGA Module
- 168-LFLGA
- 169-TFBGA
- 17-XFBGA, WLCSP
- 182-UFBGA, WLBGA
- 192-UFBGA, WLBGA
- 196-LFBGA
- 196-LFBGA, CSPBGA
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SMD Module
- 20-UFQFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 208-TFBGA, FCBGA
- 208-XFBGA, WLCSP
- 24-UFQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 24-WFQFN, FC
- 25-SMD Module
- 252-TFBGA, FCBGA
- 254-TFBGA, FCBGA
- 261-SMD Module
- 27-VFLGA Module
- 28-SOIC (0.295, 7.50mm Width) Exposed Pad
- 28-SSOP (0.154, 3.90mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-UFBGA, WLCSP
- 28-UltraCSP™ (Xcept)
- 28-VFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 28-WFQFN Exposed Pad
- 286-XFBGA, WLCSP
- 289-LFBGA, CSPBGA
- 30-BLGA Module
- 31-UFBGA, WLCSP
- 316-XFBGA, WLCSP
- 32-LFLGA
- 32-LQFP
- 32-PowerVFQFN
- 32-QFN Exposed Pad
- 32-UFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VFQFN Exposed Pad, 32-MLF®
- 32-VQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 32-WFQFN Exposed Pad, CSP
- 33-UFBGA, WLCSP
- 339-XFBGA, WLCSP
- 34-UFBGA, DSBGA
- 34-UFBGA, WLCSP
- 34-XFBGA, WLCSP
- 36-QFN
- 36-SMD Module
- 36-TFBGA
- 36-UFBGA, WLBGA
- 36-VFQFN Exposed Pad
- 36-WFLGA Exposed Pad
- 36-WFQFN Exposed Pad
- 38-TFSOP (0.173, 4.40mm Width)
- 39-SMD Module
- 395-XFBGA, WLCSP
- 40-DIP (0.600, 15.24mm)
- 40-QFN
- 40-UFQFN Exposed Pad
- 40-VFQFN
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 40-WFQFN Exposed Pad, CSP
- 400-BFBGA, FCBGA
- 41-VFLGA
- 42-CSP
- 42-LFLGA Exposed Pad
- 42-UFBGA, WLBGA
- 42-VFLGA Exposed Pad
- 42-WFQFN Exposed Pad
- 43-UFBGA, CSPBGA
- 44-BSOP (0.295, 7.50mm Width)
- 44-LQFP
- 44-QFN, 32-QFN
- 44-TQFN Exposed Pad Module
- 44-TQFP
- 47-WFBGA, WLCSP
- 47-XFBGA, WLCSP
- 48-LFBGA
- 48-LQFP
- 48-QFN
- 48-QLP
- 48-SMD Module
- 48-TFLGA
- 48-TFLGA, CSP
- 48-UFQFN Exposed Pad
- 48-VFLGA Exposed Pad
- 48-VFQFN
- 48-VFQFN Exposed Pad
- 48-VFQFN Exposed Pad, CSP
- 48-WFQFN Exposed Pad
- 48-WFQFN Exposed Pad, CSP
- 49-TFBGA
- 49-VFBGA, FCBGA
- 50-UFBGA
- 50-WFBGA
- 50-XFBGA, WLCSP
- 51-WLCSP
- 53-UFBGA, WLCSP
- 54-BGA, DSBGA
- 54-LFBGA
- 55-UFBGA, WLCSP
- 56-QFN
- 56-UFBGA, WLCSP
- 56-UFQFN Exposed Pad
- 56-VFQFN
- 56-VFQFN Exposed Pad
- 56-WFQFN Exposed Pad
- 60-LFBGA
- 60-VFLGA Exposed Pad
- 60-VFQFN Exposed Pad
- 60-VQFN Dual Rows, Exposed Pad
- 60-WFQFN Exposed Pad
- 62-UFBGA, WLCSP
- 63-SMD Module
- 63-UFBGA, WLBGA
- 63-VFLGA
- 64-FBGA
- 64-TFBGA
- 64-TQFP
- 64-VFBGA
- 64-VFQFN Dual Rows, Exposed Pad
- 64-VFQFN Exposed Pad
- 64-VFQFN Exposed Pad, CSP
- 68-LFLGA Exposed Pad
- 68-QFN
- 68-TQFN Exposed Pad
- 68-UFBGA, WLCSP
- 68-VFBGA
- 68-VFQFN Exposed Pad
- 69-UFBGA, WLBGA
- 71-VFLGA Exposed Pad
- 72-LFBGA
- 72-VFBGA
- 72-VFQFN Exposed Pad
- 73-VFQFN Dual Rows, Exposed Pad
- 74-UFBGA, WLBGA
- 75-UFBGA, WLCSP
- 76-UFBGA, WLCSP
- 76-VFQFN Dual Rows, Exposed Pad
- 76-VQFN Dual Rows, Exposed Pad
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
- 80-VFQFN
- 81-TFBGA
- 84-VFBGA
- 85-VFLGA Exposed Pad
- 86-VFBGA
- 88-BGA, WLCSP
- 88-VFQFN Exposed Pad
- 90-TFBGA
- 93-UFBGA, WLCSP
- 96-LFBGA
- 96-TFBGA
- 96-VFBGA
- Module
- QFN
- VQFN
Packaging
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Strip
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
- Wafer
- Waffle
Part Status
- Active
- Discontinued
- Last Time Buy
- LTB
- Not For New Designs
- NRND
- Obsolete
- Unconfirmed
Pbfree Code
- icon-pbfree yes
- no
- yes
Published
- 1994
- 1997
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 13mOhm
Series
- #3
- -
- Aero™ +
- Aero™ I
- Apollo3
- Automotive, AEC-Q100
- Automotive, AEC-Q100, mmWave
- Automotive, AEC-Q100, SimpleLink™
- Blue Gecko
- BlueCore5™ Multimedia
- BlueCore®
- BlueCore® BC6110™
- BlueCore® BC6130™
- BlueCore® BC6140™
- BlueCore® BC6145™
- BlueCore® CSR8510™ A10
- BlueCore® CSR8645™
- BlueCore® CSR8670™
- BlueCore® CSRB5348™
- BlueMoon®
- BlueNRG
- CC2430
- CyFi™
- Dust Networks®, SmartMesh IP™
- Dust Networks®, SmartMesh®, WirelessHART
- EFR32™ Blue Gecko
- ESP32
- ESP32-S3
- EZR32HG
- EZR32LG
- EZR32WG
- Flex Gecko
- JN517X
- LoRa™
- Mighty Gecko
- MSP430™
- nRF52
- PRoC
- PRoC®
- PRoC™ BLE
- PSOC® 4
- PSOC® 4 CY8C41xx BLE
- PSOC® 4 CY8C4xx8 BLE
- PurePath™ Wireless
- SimpleLink™
- SmartBond™
- SmartLEWIS™
- SMART™ SAM R21
- TC
- TrueRF™
- UL865
- WF200
- WICED
- WiLink™
- WirelessUSB™
- Z-Wave®
- µEnergy®
Supplier Device Package
- 100-CBGA (9x9)
- 100-TQFP (14x14)
- 116-LGA (10.1x14.1)
- 130-LGA (13.4 x 13.3)
- 138-WLBGA (5.74x4.53)
- 144-HLQFP (20x20)
- 145-WBLGA (4.87x5.41)
- 182-WLBGA (6.57x5.62)
- 196-FBGA (12x12)
- 20-QFN (4x4)
- 20-SSO
- 20-VQFN (4x4)
- 208-FCFBGA (7x9)
- 24-QFN (4x4)
- 24-QFN (5x5)
- 28-QFN (4x4)
- 28-QFN (5x5)
- 32-LFCSP (5x5)
- 32-LFCSP-WQ (5x5)
- 32-MLF (5x5)
- 32-QFN (5x5)
- 32-QFN (7x7)
- 32-TQFN (5x5)
- 32-VQFN (5x5)
- 33-WLCSP (2.48x2.46)
- 36-QFN (5x6)
- 36-QFN (6x6)
- 36-VQFN (6x6)
- 36-WLBGA (2.51x2.77)
- 36-WQFN (6x6)
- 40-PDIP
- 40-QFN (5x5)
- 40-QFN (6x6)
- 40-QFN (7x5)
- 40-VQFN (5x5)
- 40-VQFN (6x6)
- 40-WQFN (6x6)
- 42-LGA (5x7)
- 42-QFN (5x7)
- 44-LQFP (10x10)
- 44-QFN SIP (7.7x7.1)
- 44-QFN SIP (8x8)
- 44-SSO
- 44-TQFP (10x10)
- 44-VQFN (7x7)
- 48-LGA (6.5x6.5)
- 48-LQFP (7x7)
- 48-QFN (5x5)
- 48-QFN (6x6)
- 48-QFN (7x7)
- 48-TQFN (6x6)
- 48-TQFN (7x7)
- 48-TQFP (7x7)
- 48-VQFN (7x7)
- 50-WLCSP (2.96x3.23)
- 56-HVQFN (8x8)
- 56-QFN (7x7)
- 56-TQFN (8x8)
- 60-NFBGA (9x6)
- 60-QFN (7x7)
- 62-WLCSP (3.5x3.83)
- 62-WLCSP (3.83x3.83)
- 64-LFCSP-VQ (9x9)
- 64-QFN (8x8)
- 64-QFN (9x9)
- 64-TQFP (14x14)
- 64-VQFN (9x9)
- 66-CSP (3.38x3.25)
- 68-QFN (8x8)
- 68-VFBGA (5.5x5.5)
- 72-LFBGA (7x7)
- 72-VFBGA (5x5)
- 73-QFN (7x7)
- 75-WLCSP (3.18x3.18)
- 81-BGA (5x5)
- 81-FBGA (8x8)
- 85-LGA (6x8)
- 93-WLCSP (3.54x3.61)
- 96-VFBGA (6x6)
- PG-TSSOP-38
- PG-WFSGA-65
- PG-WFWLB-119-1
- SM-20H
- SM-20L
- SM3-20H
Surface Mount
- YES
Terminal Finish
- Gold (Au)
- Gold (Au) - with Nickel (Ni) barrier
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Gold/Palladium (Ni/Au/Pd)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- NOT SPECIFIED
- PURE MATTE TIN
- Silver (Ag)
- TIN
- Tin (Sn)
- TIN LEAD
- Tin/Lead (Sn/Pb)
- Tin/Nickel (Sn/Ni)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)
Termination
- SMD/SMT
Tolerance
- 10%
- 20%
Type
- TxRx + MCU
- TxRx Only
Weight
- 103.986051mg
- 105.687022mg
- 117.310327mg
- 117.508773mg
- 123.008581mg
- 139.989945mg
- 150.507618mg
- 16.499422mg
- 172.98879mg
- 181.692094mg
- 188.609377mg
- 200.005886mg
- 206.29948mg
- 227.391525mg
- 274.706879mg
- 42.949528mg
- 5.953513g
- 50.008559mg
- 57.747979mg
- 657.000198mg
- 67.698661mg
- 69.399633mg
- 69.994973mg
- 71.610895mg
- 72.206235mg
- 75.891673mg
- 78.698276mg
- 80.002354mg
- 810.002575mg
- 90.009736mg
- 92.589543mg
- 928.191737mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Radiation Hardening | Package / Case | Interface | Frequency | Width | Mounting Type | Weight | Operating Temperature | Technology | Height Seated (Max) | Number of Functions | Type | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Sensitivity | Surface Mount | Terminal Pitch | JESD-30 Code | Supplier Device Package | Core Architecture | Power - Output | Memory Size | Memory Type | Number of GPIO | RAM Size | Number of I/O | Voltage - Supply | Protocol | Number of Timers/Counters | Data Rate (Max) | Sensitivity (dBm) | RF Family/Standard | Current - Receiving | Current - Transmitting | Number of ADC Channels | Serial Interfaces | Modulation | GPIO |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CYW43362KUBG | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | WICED | Obsolete | 3 (168 Hours) | 69 | ROHS3 Compliant | 69-UFBGA, WLBGA | 2.4GHz | 2.92mm | Surface Mount | -30°C~85°C | 1 | TxRx + MCU | BOTTOM | BALL | 1.2V | -97dBm | YES | 0.4mm | R-PBGA-B69 | 18.5dBm | 448kB ROM 240kB RAM | 1.2V~3.3V | 802.11b/g/n | 72Mbps | WiFi | 52mA~59mA | 260mA~320mA | JTAG, SPI, UART | 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM | 5 | ||||||||||||||||||||||||
 |
CYW20730A1KMLGT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 40-VFQFN Exposed Pad | 2.4GHz | Surface Mount | 0°C~70°C | TxRx + MCU | -88dBm | 4dBm | 3.8V | Bluetooth v3.0 | 1Mbps | Bluetooth | 26.6mA | 24mA | I2C, SPI, UART | 14 | |||||||||||||||||||||||||||||||||||||
|
CYW43362KUBGT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 69 | ROHS3 Compliant | 69-UFBGA, WLBGA | 2.4GHz | 2.92mm | Surface Mount | -30°C~85°C | 1 | TxRx + MCU | BOTTOM | BALL | NOT SPECIFIED | 1.2V | NOT SPECIFIED | -97dBm | YES | 0.4mm | R-PBGA-B69 | 18.5dBm | 448kB ROM 240kB RAM | 1.2V~3.3V | 802.11b/g/n | 72Mbps | WiFi | 52mA~59mA | 260mA~320mA | JTAG, SPI, UART | 16QAM, 64QAM, BPSK, CCK, DSSS, QPSK, OFDM | 5 | |||||||||||||||||||||||
 |
CYW20702A1KWFBG | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Active | 3 (168 Hours) | 50 | 4.5mm | ROHS3 Compliant | 50-WFBGA | 2.4GHz | 4mm | Surface Mount | -30°C~85°C | CMOS | 0.8mm | 1 | TxRx + MCU | BOTTOM | BALL | 1.22V | -92dBm | YES | 0.5mm | R-PBGA-B50 | 10dBm | 2.3V~5.5V | Bluetooth v4.0 +EDR | 3Mbps | Bluetooth | 32mA | 65mA | I2C, I2S, SPI, UART, USB | 4DQPSK, 8DPSK, GFSK | 7 | ||||||||||||||||||||||||
 |
ZIC2410QN48 | CEL (California Eastern Laboratories) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | Obsolete | 3 (168 Hours) | 85°C | -40°C | 3.3V | RoHS Compliant | Lead Free | No | 48-VFQFN Exposed Pad | SPI, UART | 2.4GHz | 150.507618mg | -40°C~85°C | TxRx + MCU | -98dBm | 48-QFN (7x7) | 8051 | 8dBm | 96kB Flash 1kB ROM 8kB RAM | FLASH | 22 | 8kB | 22 | 1.35V~3.3V | Zigbee® | 4 | 1Mbps | -98 dBm | 802.15.4 | 4.6mA | 33.8mA~46.3mA | 4 | I2S, SPI, UART | O-QPSK | 22 |
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