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STM32F103C8T6
MFI343S00177
STM32F407VET6
ATMEGA328P-PU

Categories
- Integrated Circuits (ICs)
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  - Integrated circuits, often referred to as ICs or microchips, are miniature electronic circuits that contain thousands to billions of transistors, resistors, capacitors, and other electronic components on a small semiconductor material. ICs are the building blocks of modern electronics and are used in a vast array of devices and systems, ranging from smartphones and computers to automotive electronics and medical devices. They provide compactness, high functionality, and improved performance by integrating multiple electronic functions onto a single chip.
- Connectors
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  - Connectors are devices used to establish electrical or mechanical connections between two or more components or systems. They provide a means for joining cables, wires, or other conductive elements, enabling the transmission of electrical signals, power, or data. Connectors come in a wide range of forms, including electrical connectors, coaxial connectors, modular connectors, and fiber optic connectors. They play a critical role in industries such as telecommunications, automotive, aerospace, and consumer electronics, facilitating reliable and secure connections.
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  - Discrete Semiconductor refer to electronic components that are individual and separate from each other, as opposed to integrated circuits that contain multiple components on a single chip. These discrete components include diodes, transistors, thyristors, and other similar devices that perform specific functions in electronic circuits. They are commonly used in power supplies, amplifiers, and other electronic devices where precise control and regulation of electrical signals is required. Discrete Semiconductor Products are available in a variety of sizes, shapes, and specifications to meet the needs of different applications. They are widely used in the electronics industry and are essential components in many electronic devices.
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  - Capacitors are electronic components that store and release electrical energy. They consist of two conductive plates separated by an insulating material known as a dielectric. Capacitors are widely used in electronic circuits for various purposes, including energy storage, filtering, decoupling, timing, and coupling signals. They are available in different types, such as electrolytic capacitors, ceramic capacitors, and tantalum capacitors, each with unique characteristics suitable for different applications.
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  - Sensors are devices that detect and measure physical or environmental parameters and convert them into electrical signals. They enable the acquisition of real-world data for monitoring, control, and feedback purposes. Sensors can detect variables such as temperature, pressure, light, motion, proximity, and many others. They find application in diverse fields, including automotive systems, consumer electronics, industrial automation, healthcare, and environmental monitoring.
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  - Resistors are passive electronic components designed to impede the flow of electric current in a circuit. They are used to control current levels, divide voltage, and limit power dissipation. Resistors are available in various types, including fixed resistors, variable resistors (potentiometers), and specialized resistors for specific applications such as high power or precision requirements. They are fundamental components in electronic circuits, playing roles in voltage regulation, signal conditioning, and impedance matching.
- Isolators
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  - Isolators, also known as isolation devices or isolating components, are electronic components designed to electrically separate or isolate different parts of a circuit or system. They provide protection by preventing unwanted electrical currents, noise, or interference from affecting sensitive components or systems. Isolators are commonly used in applications where electrical isolation is crucial, such as power supplies, communication systems, motor control, and industrial automation. They ensure reliable operation, safety, and protection from electrical disturbances or faults.
- Board Mount Power Supplies
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  - Box and enclosure products refer to electronic components that are designed to protect and house electronic devices. These products come in a variety of shapes and sizes, and are typically made from materials such as plastic, metal, or fiberglass. Box and enclosure products are essential for protecting electronic components from environmental factors such as dust, moisture, and temperature fluctuations. They also provide a secure and organized way to store and transport electronic devices. Box and enclosure products are commonly used in industries such as telecommunications, aerospace, and automotive, as well as in consumer electronics.
- RF/IF & RFID
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  - Attenuators
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  - RF power dividers/splitters are electronic components that are used to divide or split an incoming RF signal into multiple output signals. These components are commonly used in communication systems, such as radio and television broadcasting, as well as in radar and satellite communication systems. RF power dividers/splitters are designed to maintain signal integrity and minimize signal loss, ensuring that each output signal is of equal strength and quality. They come in various configurations, including 2-way, 3-way, 4-way, and 8-way, and can be used in both indoor and outdoor applications. RF power dividers/splitters are essential components in any RF system that requires signal distribution.
- Circuit Protection
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  - Circuit protection is a crucial aspect of electronic components classification. It refers to the measures taken to prevent damage to electronic circuits due to overvoltage, overcurrent, or short circuits. Circuit protection devices such as fuses, circuit breakers, surge protectors, and voltage regulators are used to safeguard electronic components from damage caused by power surges, lightning strikes, and other electrical disturbances. These devices are designed to interrupt the flow of current when the voltage or current exceeds a safe level, thereby protecting the circuit and preventing damage to the electronic components. Circuit protection is essential for ensuring the reliability and longevity of electronic devices and systems.
- Crystals
  - Crystals
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  - Oscillators
  - Pin Configurable Oscillators
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  - Voltage Controlled Oscillators
  - Crystals, in the context of electronics, refer to quartz crystals or other similar crystalline structures used as precise timing references or frequency-determining elements. These crystals exhibit a phenomenon called piezoelectricity, which allows them to generate a stable and accurate electrical signal when subjected to mechanical stress or voltage. Crystals are extensively used in oscillators
- Inductors
  - Inductors
  - Adjustable Inductors
  - Delay Lines
  - Fixed Inductors
  - Signal Transformers
  - Wireless Charging Coils
  - Inductors are passive electronic components that store electrical energy in the form of a magnetic field. They are typically made of a coil of wire wound around a core material and are used in various electrical circuits and systems. Inductors resist changes in current flow and are commonly employed in filtering, energy storage, impedance matching, and signal conditioning applications. They play a vital role in applications such as power supplies, radio frequency (RF) circuits, motor control, and electromagnetic compatibility (EMC) solutions.
- Filters
  - Filters
  - Cable Ferrites
  - Ceramic Filters
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  - Ferrite Beads and Chips
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  - Filters Accessories
  - Helical Filters
  - Monolithic Crystals
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  - SAW Filters
  - Filters are electronic components designed to selectively allow or block certain frequencies or ranges of frequencies in a signal or waveform. They are used to remove unwanted noise, interference, or specific frequency components, and to shape or modify the frequency response of a circuit or system. Filters can be classified into different types, such as low-pass, high-pass, band-pass, and band-stop filters, each serving specific purposes in applications ranging from audio and communication systems to power electronics and signal processing.
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Items : %s%s

Single MOSFETs Transistors

Accuracy

Breakdown Voltage

Capacitance

1.02nF
2.569nF

Capacitance - Input

1.1nF
1.7nF
50pF
6.8nF
750pF

Case Code (Imperial)

0603

Case Code (Metric)

1608

Case Connection

DRAIN
DRAIN SOURCE
ISOLATED
SOURCE

Clamping Voltage

Collector Emitter Breakdown Voltage

Color

Black
Black, Clear
Natural

Configuration

SINGLE
SINGLE WITH BUILT-IN DIODE
SINGLE WITH BUILT-IN DIODE AND RESISTOR

Diameter

12.7mm
13.081mm
15.875mm
16.764mm
19.304mm
22.225mm
44.958mm

ECCN Code

EAR99

Element Configuration

Dual
Single

FET Feature

Current Sensing
Depletion Mode
Schottky Diode (Body)
Schottky Diode (Isolated)
Standard
Super Junction
Temperature Sensing Diode

FET Technology

METAL-OXIDE SEMICONDUCTOR

FET Type

N-Channel
P-Channel

Flange Diameter

24.5872 mm

Forward Current

1.1A
2mA

Forward Voltage

-1.2V
1.3V
1V
450mV

Halogen Free

Halogen Free
Not Halogen Free

Hole Diameter

22.225 mm

HTS Code

8541.21.00.75
8541.21.00.95
8541.29.00.75
8541.29.00.95

Interface

On/Off

Isolation Voltage

2.5kV
2kV

JESD-609 Code

e0
e1
e2
e3
e3/e2
e4
e6

Lead Free

Contains Lead
Contains Lead, Lead Free
Lead Free

Lead Length

9.65mm

Lead Pitch

2.28mm
2.54mm
5.45mm

Material

Aluminium, Plastic
Brass
Brass, Bronze
Brass, Metal
Brass, Metal, Plastic
Brass, Plastic
Metal
Metal, Nylon
Plastic

Max Input Voltage

Max Output Current

1.6A
115A
1A
2A
45A

Max Repetitive Reverse Voltage (Vrrm)

Max Supply Voltage

Min Breakdown Voltage

100V
20V
30V
60V

Moisture Sensitivity Level (MSL)

1
1 (Unlimited)
2 (1 Year)
2A (4 Weeks)
3 (168 Hours)
Not Applicable
Vendor Undefined

Mount

Chassis Mount
Chassis Mount, Panel
Chassis Mount, Panel, Screw
Chassis Mount, Screw
Chassis Mount, Screw, Surface Mount
PCB, Through Hole
Surface Mount
Surface Mount, Through Hole
Through Hole

Mounting Type

Chassis Mount
Surface Mount
Surface Mount, Wettable Flank
Through Hole

Number of Channels

Number of Contacts

Number of Drivers

Number of Elements

Number of Rows

Number of Segments

Number of Terminations

Operating Mode

-0.85
-0.95
DEPLETION MODE
ENHANCEMENT MODE

Output Configuration

High Side

Output Current

2.3A
2.5A
5.3A

Output Type

Fixed

Output Voltage

-15V
2.5V

Panel Thickness

1.5748mm

Part Status

Active
Discontinued
Last Time Buy
Not For New Designs
Obsolete

Pbfree Code

Peak Reflow Temperature (Cel)

225
240
245
250
260
NOT APPLICABLE
NOT SPECIFIED

Pin Count

Pitch

Plating

Gold
Gold, Lead, Tin
Gold, Tin
Lead, Tin
Tin

Polarity

NPN
Positive

Polarity/Channel Type

N-CHANNEL
P-CHANNEL

Power Dissipation-Max (Abs)

198W
417W

Power Rating

100mW

Qualification Status

Not Qualified

Quiescent Current

Radiation Hardening

Rds On (Max) @ Id, Vgs

1Ohm @ 3.3A, 10V
3.6Ohm @ 1A, 10V
3Ohm @ 1.5A, 10V
550mOhm @ 6A, 10V

Reach Compliance Code

not_compliant
unknown

REACH SVHC

No SVHC
Unknown
Yes

Reference Standard

AEC-Q101
AEC-Q101; IEC-60134
IEC-60134

RoHS Status

Non-RoHS Compliant
RoHS Compliant
ROHS3 Compliant

Row Spacing

6.3 mm
7.62 mm

Source Url Status Check Date

2013-06-14 00:00:00

Subcategory

FET General Purpose Power
FET General Purpose Powers
Other Transistors

Surface Mount

Switching Current

Technology

GaNFET (Gallium Nitride)
MOSFET (Metal Oxide)
SiC (Silicon Carbide Junction Transistor)
SiCFET (Silicon Carbide)

Temperature Coefficient

25 ppm/°C

Terminal Form

BALL
C BEND
FLAT
GULL WING
NO LEAD
THROUGH-HOLE
UNSPECIFIED
WIRE

Terminal Position

BOTTOM
DUAL
SINGLE
UPPER

Termination

Crimp
Screw
SMD/SMT
SMD/SMT, Solder
Through Hole
Wire Wrap

Thickness

1.58mm
1mm
2mm

Time@Peak Reflow Temperature-Max (s)

10
20
30
40
NOT APPLICABLE
NOT SPECIFIED

Tolerance

0.1%
1%

Transistor Application

AMPLIFIER
SWITCHING

Transistor Element Material

SILICON

Voltage - Rated

Voltage - Threshold

2.1V
3V

Wire Gauge (Max)

18 AWG
22 AWG
24 AWG
26 AWG
28 AWG

Wire Gauge (Min)

14 AWG
16 AWG
20 AWG
22 AWG
24 AWG

Wire/Cable Gauge

18 AWG

Reset

Apply

Name	Manufacturer	Pricing(USD)	Quantity	Datasheet	Factory Lead Time	Mount	Packaging	Published	Series	Pbfree Code	Part Status	Moisture Sensitivity Level (MSL)	Number of Terminations	Termination	ECCN Code	Length	RoHS Status	Lead Free	Contact Plating	Current Rating	Radiation Hardening	Number of Pins	Additional Feature	Package / Case	REACH SVHC	Lead Pitch	Height	Width	Resistance	Mounting Type	Weight	Operating Temperature	Voltage - Rated DC	Technology	Operating Mode	JESD-609 Code	Terminal Finish	Terminal Position	Terminal Form	Peak Reflow Temperature (Cel)	Time@Peak Reflow Temperature-Max (s)	Pin Count	Surface Mount	JESD-30 Code	Number of Channels	Subcategory	Qualification Status	Number of Elements	Configuration	JEDEC-95 Code	Case Connection	Element Configuration	Power Dissipation	Turn On Delay Time	Threshold Voltage	Power Dissipation-Max	Recovery Time	Continuous Drain Current (ID)	Max Junction Temperature (Tj)	Transistor Application	Drain-source On Resistance-Max	DS Breakdown Voltage-Min	Turn-Off Delay Time	Transistor Element Material	FET Type	Rds On (Max) @ Id, Vgs	Vgs(th) (Max) @ Id	Input Capacitance (Ciss) (Max) @ Vds	Gate Charge (Qg) (Max) @ Vgs	Rise Time	Fall Time (Typ)	Gate to Source Voltage (Vgs)	Drain to Source Breakdown Voltage	Dual Supply Voltage	FET Feature	Nominal Vgs	Drain Current-Max (Abs) (ID)	Current - Continuous Drain (Id) @ 25°C	Drain to Source Voltage (Vdss)	Pulsed Drain Current-Max (IDM)	Avalanche Energy Rating (Eas)	Drive Voltage (Max Rds On,Min Rds On)	Vgs (Max)
IXFH150N25X3HV	IXYS	0.0000	RFQ Min: 1 Mult: 1	download	24 Weeks						Active
SI8445DB-T2-E1	Vishay Siliconix	0.0000	RFQ Min: 1 Mult: 1	download		Surface Mount	Tape & Reel (TR)	2013	TrenchFET®	yes	Obsolete	1 (Unlimited)	4		EAR99		ROHS3 Compliant				No	4		4-XFBGA, CSPBGA						Surface Mount		-55°C~150°C TJ		MOSFET (Metal Oxide)	ENHANCEMENT MODE	e3	MATTE TIN	BOTTOM	BALL	260	40	4				Other Transistors		1				Single	1.8W	11 ns		1.8W Ta 11.4W Tc		-9.8A		SWITCHING			37 ns	SILICON	P-Channel	84m Ω @ 1A, 4.5V	850mV @ 250μA	700pF @ 10V	16nC @ 5V	25ns	10 ns	5V	-20V				3.9A	9.8A Tc	20V			1.2V 4.5V	±5V
IRFS23N20DPBF	Infineon Technologies	0.0000	RFQ Min: 1 Mult: 1	download			Tube	2000	HEXFET®		Discontinued	1 (Unlimited)	2		EAR99		ROHS3 Compliant							TO-263-3, D2Pak (2 Leads + Tab), TO-263AB						Surface Mount		-55°C~175°C TJ		MOSFET (Metal Oxide)	ENHANCEMENT MODE	e3	Matte Tin (Sn) - with Nickel (Ni) barrier	SINGLE	GULL WING	260	30		YES	R-PSSO-G2		FET General Purpose Power	Not Qualified	1	SINGLE WITH BUILT-IN DIODE		DRAIN					3.8W Ta 170W Tc				SWITCHING	0.1Ohm	200V		SILICON	N-Channel	100m Ω @ 14A, 10V	5.5V @ 250μA	1960pF @ 25V	86nC @ 10V								24A	24A Tc	200V	96A	250 mJ	10V	±30V
SSM3J356R,LF	Toshiba Semiconductor and Storage	0.0357	Add to Cart Min: 1 Mult: 1		12 Weeks	Surface Mount	Tape & Reel (TR)	2015	U-MOSVI	yes	Active	1 (Unlimited)	3				RoHS Compliant							SOT-23-3 Flat Leads						Surface Mount		150°C TJ		MOSFET (Metal Oxide)	ENHANCEMENT MODE			DUAL						R-PDSO-F3				1	SINGLE WITH BUILT-IN DIODE							1W Ta		2A		SWITCHING	0.4Ohm	60V		SILICON	P-Channel	300m Ω @ 1A, 10V	2V @ 1mA	330pF @ 10V	8.3nC @ 10V								2A	2A Ta	60V			4V 10V	+10V, -20V
IRFP064NPBF	Infineon Technologies	0.0000	RFQ Min: 1 Mult: 1	download	12 Weeks	Through Hole	Tube	1997	HEXFET®		Active	1 (Unlimited)	3	Through Hole	EAR99	15.875mm	ROHS3 Compliant	Lead Free		110A	No	3	AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE	TO-247-3	No SVHC	5.45mm	24.99mm	5.3mm	8MOhm	Through Hole		-55°C~175°C TJ	55V	MOSFET (Metal Oxide)	ENHANCEMENT MODE										1	FET General Purpose Power		1		TO-247AC	DRAIN	Single	150W	14 ns	4V	200W Tc	170 ns	110A	175°C	SWITCHING			43 ns	SILICON	N-Channel	8m Ω @ 59A, 10V	4V @ 250μA	4000pF @ 25V	170nC @ 10V	100ns	70 ns	20V	55V	55V		4 V	98A	110A Tc			480 mJ	10V	±20V
IXTN30N100L	IXYS / Littelfuse	0.0000	RFQ Min: 1 Mult: 1	download		Chassis Mount, Screw	Bulk	2010		yes	Active	Not Applicable	4				ROHS3 Compliant	Lead Free			No	4	AVALANCHE RATED, UL RECOGNIZED	SOT-227-4, miniBLOC					450MOhm	Chassis Mount		-55°C~150°C TJ		MOSFET (Metal Oxide)	ENHANCEMENT MODE		Nickel (Ni)	UPPER	UNSPECIFIED			4				FET General Purpose Power		1	SINGLE WITH BUILT-IN DIODE		DRAIN		800W			800W Tc		30A		SWITCHING			100 ns	SILICON	N-Channel	450m Ω @ 15A, 20V	5.5V @ 250μA	13700pF @ 25V	545nC @ 20V	70ns	78 ns	30V	1kV					30A Tc	1000V	70A	2000 mJ	20V	±30V
DN3545N8-G	Microchip Technology	0.0000	RFQ Min: 1 Mult: 1	download	6 Weeks	Surface Mount	Tape & Reel (TR)	2005			Active	1 (Unlimited)	3		EAR99	4.6mm	ROHS3 Compliant	Lead Free	Tin		No	4	FAST SWITCHING	TO-243AA	No SVHC		1.6mm	2.6mm		Surface Mount	52.786812mg	-55°C~150°C TJ		MOSFET (Metal Oxide)		e3			FLAT	260	40			R-PSSO-F3	1	FET General Purpose Power		1			DRAIN	Single	1.6W	20 ns		1.6W Ta		200mA		SWITCHING			30 ns	SILICON	N-Channel	20 Ω @ 150mA, 0V		360pF @ 25V		30ns	30 ns	20V	450V		Depletion Mode		0.2A		450V	0.3A		0V	±20V

IXFH150N25X3HV IXYS

Price: 0.0000
RFQ
SI8445DB-T2-E1 Vishay Siliconix
MOSFET (Metal Oxide) P-Channel Tape & Reel (TR) 84m Ω @ 1A, 4.5V ±5V 700pF @ 10V 16nC @ 5V 20V 4-XFBGA, CSPBGA

Price: 0.0000
RFQ
IRFS23N20DPBF Infineon Technologies
MOSFET N-CH 200V 24A D2PAK

Price: 0.0000
RFQ
SSM3J356R,LF Toshiba Semiconductor and Storage
MOSFET (Metal Oxide) P-Channel Tape & Reel (TR) 300m Ω @ 1A, 10V +10V, -20V 330pF @ 10V 8.3nC @ 10V 60V SOT-23-3 Flat Leads

Price: 0.0357
RFQ
IRFP064NPBF Infineon Technologies
In a Tube of 25, N-Channel MOSFET, 110 A, 55 V, 3-Pin TO-247AC Infineon IRFP064NPBF

Price: 0.0000
RFQ
IXTN30N100L IXYS / Littelfuse
MOSFET N-CH 1000V 30A SOT-227

Price: 0.0000
RFQ
DN3545N8-G Microchip Technology
Trans MOSFET N-CH 450V 0.2A 4-Pin(3+Tab) SOT-89

Price: 0.0000
RFQ

Single MOSFETs Transistors

Accuracy

Additional Feature

Avalanche Energy Rating (Eas)

Base Part Number

Breakdown Voltage

Capacitance

Capacitance - Input

Case Code (Imperial)

Case Code (Metric)

Case Connection

Clamping Voltage

Collector Emitter Breakdown Voltage

Color

Configuration

Contact Plating

Continuous Drain Current (ID)

Current

Current Rating

Diameter

Drain Current-Max (Abs) (ID)

Drain to Source Breakdown Voltage

Drain to Source Resistance

Drain to Source Voltage (Vdss)

Drain-source On Resistance-Max

Drive Voltage (Max Rds On,Min Rds On)

DS Breakdown Voltage-Min

Dual Supply Voltage

ECCN Code

Element Configuration

Factory Lead Time

Fall Time (Typ)

Feedback Cap-Max (Crss)

FET Feature

FET Technology

FET Type

Flange Diameter

Forward Current

Forward Voltage

Gate Charge (Qg) (Max) @ Vgs

Gate to Source Voltage (Vgs)

Halogen Free

Height

Hole Diameter

HTS Code

Input Capacitance

Input Capacitance (Ciss) (Max) @ Vds

Interface

Isolation Voltage

JEDEC-95 Code

JESD-30 Code

JESD-609 Code

Lead Free

Lead Length

Lead Pitch

Length

Lifecycle Status

Manufacturer Package Identifier

Material

Max Dual Supply Voltage

Max Input Voltage

Max Output Current

Max Power Dissipation

Max Repetitive Reverse Voltage (Vrrm)

Max Supply Voltage

Min Breakdown Voltage

Moisture Sensitivity Level (MSL)

Mount

Mounting Type

Nominal Vgs

Number of Channels

Number of Contacts

Number of Drivers

Number of Elements

Number of Pins

Number of Rows

Number of Segments

Number of Terminations

Operating Mode

Operating Temperature