Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
25LC1024T-I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 6mm | ROHS3 Compliant | No | 8 | 200 YEARS OF DATA RETENTION; 1000000 ENDURANCE CYCLES/WORD | 8-VDFN Exposed Pad | SPI, Serial | 1 Mb | 5mm | Surface Mount | -40°C~85°C TA | CMOS | 1mm | 1 | 10mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 25LC1024 | 8 | 1.27mm | 2.5V | Flash Memories | 3/5V | 5.5V | 50 ns | 1Mb 128K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 20MHz | 0.000001A | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 6ms | SPI | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V261L55PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V261 | 256Kb 16K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M93C76-RDW6TP | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | ACTIVE (Last Updated: 7 months ago) | Surface Mount | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | Serial | 8 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | 2mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 30 | M93C76 | 8 | 0.65mm | Not Qualified | 200 ns | 8Kb 1K x 8 512 x 16 | Non-Volatile | 1.8V~5.5V | 512X16 | 16 | 1MHz | 0.000002A | 8 | 40 | 1000000 Write/Erase Cycles | SOFTWARE | 10ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MTFC16GJDEC-H1 WT") |
MTFC16GJDEC-H1 WT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | -25°C~85°C TA | FLASH - NAND | 128Gb 16G x 8 | Non-Volatile | 1.65V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC64M4A2P-75:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2010 | Obsolete | 2 (1 Year) | 70°C | 0°C | 3.3V | ROHS3 Compliant | Lead Free | No | 54 | 54-TSOP (0.400, 10.16mm Width) | Parallel | 3.6V | 3V | 256 Mb | 133MHz | Surface Mount | 0°C~70°C TA | SDRAM | 135mA | 133MHz | MT48LC64M4A2 | 54-TSOP II | 5.4ns | 256Mb 64M x 4 | Volatile | 15b | 3V~3.6V | 4b | 133MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C64M16D3A-12BAN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | Automotive, AEC-Q100 | yes | Discontinued | 3 (168 Hours) | 96 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-VFBGA | 8mm | Surface Mount | -40°C~105°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.5V | YES | 0.8mm | R-PBGA-B96 | 1.425V | 1.575V | 20ns | 1Gb 64M x 16 | Volatile | 1.425V~1.575V | 64MX16 | 16 | 1073741824 bit | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1370D-200BZI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2011 | NoBL™ | no | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | 3.3V | 4 | 15mm | Non-RoHS Compliant | Contains Lead | No | 165 | PIPELINED ARCHITECTURE | 165-LBGA | 18 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1 | 300mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 3.3V | CY7C1370 | 165 | 1mm | 3.135V | 3.6V | 3-STATE | 3ns | 18Mb 512K x 36 | Volatile | 19b | 3.135V~3.6V | 512KX36 | 36 | Synchronous | 200MHz | 0.07A | 36b | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29C020-90TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT29C020 | 90ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA100BGGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 119-BGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3556 | 119-PBGA (14x22) | 5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 100MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA16HT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 16 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 2.5V | 40 | 24AA16H | 8 | 1.27mm | 1.7V | 900ns | 16Kb 2K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24LC16B-M/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | 3A001.A.2.C | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 16 kb | 1.5mm | 3.9mm | Surface Mount | -55°C~125°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LC16B | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7015L25G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2005 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | Parallel | 5.5V | 4.5V | 72 kb | 29.46mm | 3.68mm | CMOS | 1 | 220mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | RAM, SRAM | 26b | 8KX9 | Asynchronous | 0.005A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3599S133DRGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 208-BFQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | IDT70V3599 | 208-PQFP (28x28) | 4.2ns | 4.5Mb 128K x 36 | Volatile | 3.15V~3.45V | 133MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MX29GL512FHXGI-10Q | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 56 | 85°C | -40°C | 9mm | RoHS Compliant | TFBGA | Parallel | 7mm | CMOS | ASYNCHRONOUS | 1.2mm | 1 | BOTTOM | BALL | 260 | 3.3V | 40 | INDUSTRIAL | YES | 0.5mm | R-PBGA-B56 | 3V | 3.6V | FLASH, NOR | 32MX16 | 16 | 536870912 bit | 100 ns | 8 | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V016SA15YG | Renesas Electronics America Inc. | 27.9806 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 44-BSOJ (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71V016 | 44-SOJ | 15ns | 1Mb 64K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
47C16-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | 8-TSSOP (0.173, 4.40mm Width) | 3mm | Surface Mount | -40°C~85°C TA | EEPROM, SRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 47C16 | YES | 0.65mm | R-PDSO-G8 | 4.5V | 5.5V | 400ns | 16Kb 2K x 8 | Non-Volatile | 4.5V~5.5V | 2KX8 | 8 | 16384 bit | 1MHz | EERAM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL032N90FFIS20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | 2014 | GL-N | Active | 3 (168 Hours) | ROHS3 Compliant | 64 | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 2M x 16 | Non-Volatile | 2.7V~3.6V | 16b | FLASH | Parallel | 90ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24AA02E64T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | 100KHZ AVAILABLE @1.7V | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 24AA02E64 | YES | 1.27mm | 2.5V | Not Qualified | 5.5V | 900ns | TS 16949 | 2Kb 256 x 8 | Non-Volatile | 0.003mA | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | 5ms | I2C | 1010XXXR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1381D-100BZC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2004 | Obsolete | 3 (168 Hours) | 165 | 3A991.B.2.A | 3.3V | 4 | 15mm | Non-RoHS Compliant | Contains Lead | 165 | FLOW-THROUGH ARCHITECTURE | 165-LBGA | not_compliant | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | 220 | 3.3V | NOT SPECIFIED | CY7C1381 | 165 | YES | 1mm | 3.135V | Not Qualified | 3.6V | 3-STATE | 8.5ns | 18Mb 512K x 36 | Volatile | 19b | 0.175mA | 3.135V~3.6V | 512KX36 | 36 | 100MHz | 0.07A | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT49F4096A-90RC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 44-SOIC (0.525, 13.34mm Width) | Surface Mount | 0°C~70°C TC | AT49F4096 | 90ns | 4Mb 512K x 8 256K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS28DG02G-3C+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2007 | Obsolete | 1 (Unlimited) | 36 | EAR99 | 5V | 6mm | ROHS3 Compliant | 36 | 36-WFQFN Exposed Pad | SPI, Serial | 6mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | QUAD | 260 | 3.3V | NOT SPECIFIED | DS28DG02 | 36 | YES | 0.5mm | 2.2V | Not Qualified | 2Kb 256 x 8 | Non-Volatile | 0.0008mA | 2.2V~5.25V | 256X8 | 8 | 2048 bit | 2MHz | 0.0001A | 40 | 200000 Write/Erase Cycles | HARDWARE | 3V | SPI | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62147EV18LL-45BVXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2001 | MoBL® | Obsolete | 3 (168 Hours) | 48 | 3A991.B.2.A | 8mm | ROHS3 Compliant | Lead Free | 48 | 48-VFBGA | 45GHz | 6mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1mm | 8542.32.00.41 | 1 | BOTTOM | 1.8V | CY62147 | 48 | YES | 0.75mm | 1.65V | Not Qualified | 2.25V | 4Mb 256K x 16 | Volatile | 1.65V~2.25V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W979H6KBQX2E | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 168 | 85°C | -25°C | 1 | 12mm | RoHS Compliant | 168 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | Parallel | 400MHz | 12mm | CMOS | SYNCHRONOUS | 0.8mm | 1 | BOTTOM | BALL | 1.2V | YES | 0.5mm | 1.14V | 1.3V | RAM, SDRAM | 32MX16 | 16 | 536870912 bit | FOUR BANK PAGE BURST | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24VL024T/MNY | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 3.3V | 2mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-WFDFN Exposed Pad | 2-Wire, I2C, Serial | No SVHC | 2 kb | 750μm | 3mm | Surface Mount | -20°C~85°C TA | CMOS | 1 | 3mA | e4 | DUAL | 260 | 1.8V | 40 | 24VL024 | 8 | 0.5mm | 1.5V | 3.6V | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.5V~3.6V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
S29GL032N90FFIS43 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 18 Weeks | Tape & Reel (TR) | 2015 | GL-N | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-LBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64-FBGA (13x11) | 90ns | 32Mb 4M x 8 2M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 90ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S29GL128S10FHIV20 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2015 | GL-S | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | 64 | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 30 | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 100ns | 128Mb 8M x 16 | Non-Volatile | 0.08mA | 1.65V~3.6V | 8MX16 | 16 | 134217728 bit | 0.0001A | 3V | YES | YES | YES | 128 | 16words | YES | YES | FLASH | Parallel | 60ns | 64K | |||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FVEIG | Winbond Electronics | 8.0572 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | 3A991.B.1.A | ROHS3 Compliant | No | 8 | 8-WDFN Exposed Pad | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 20mA | DUAL | 3V | 8 | 1.27mm | 2.7V | 3/3.3V | 3.6V | 7 ns | 128Mb 16M x 8 | Non-Volatile | 24b | 2.7V~3.6V | 1 | Synchronous | 104MHz | 0.00002A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116SA35SO8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.1mA | 2KX8 | 8 | 16384 bit | 0.002A | 35 ns | YES | COMMON | 4.5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1362B-166BGC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2003 | Obsolete | 3 (168 Hours) | 119 | 3A991.B.2.A | 22mm | Non-RoHS Compliant | Contains Lead | PIPELINED ARCHITECTURE | 119-BGA | not_compliant | 14mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 2.4mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | BOTTOM | 220 | 3.3V | NOT SPECIFIED | CY7C1362 | 119 | YES | 1.27mm | R-PBGA-B119 | 3.135V | Not Qualified | 2.5/3.33.3V | 3.6V | 3-STATE | 3.5ns | 9Mb 512K x 18 | Volatile | 0.18mA | 3.135V~3.6V | 512KX18 | 18 | 9437184 bit | 166MHz | 0.03A | COMMON | 3.14V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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709359L6PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 144 kb | 52.6MHz | 14mm | 1.4mm | 430mA | 6.5 ns | 18kB | RAM, SDR, SRAM | 26b | Synchronous | 18b |
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