Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Lead Pitch | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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S29GL256P11FFIS42 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | GL-P | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 64 | 64-LBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32800D-75EB | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | no | Obsolete | 3 (168 Hours) | 90 | EAR99 | 3.3V | 1 | 13mm | Non-RoHS Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | 180mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 90 | 0.8mm | 3V | Not Qualified | 3.6V | 5.5ns | 256Mb 8M x 32 | Volatile | 13b | 3V~3.6V | 8MX32 | 32 | 32b | 133MHz | 0.003A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||
.png "70V26L35G") |
70V26L35G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2009 | Active | 70°C | 0°C | 3.3V | 2 | 27.94mm | RoHS Compliant | Contains Lead | No | 84 | Parallel | 3.6V | 3V | 256 kb | 27.94mm | 3.68mm | 120mA | 35 ns | RAM, SRAM | 28b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62C25616BL-45TLI | ISSI, Integrated Silicon Solution Inc | 4.2046 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | yes | Active | 3 (168 Hours) | 44 | EAR99 | 5V | 1 | ROHS3 Compliant | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 4 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 20mA | 1 | 20mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 44 | YES | 0.8mm | 5V | 3-STATE | 4Mb 256K x 16 | Volatile | 18b | 4.5V~5.5V | 32KX8 | 8 | Asynchronous | 45 ns | 16b | COMMON | 2V | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25WD020-JBLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | 1.8V | RoHS Compliant | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 2 Mb | Surface Mount | 540.001716mg | -40°C~105°C TA | FLASH - NOR | 5mA | 2Mb 256K x 8 | Non-Volatile | 18b | 1.65V~1.95V | 8b | 80MHz | 256B | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V25761S183BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Discontinued | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 350mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.3 ns | RAM, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA15PZG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71256 | 28-TSOP | 15ns | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25U3232FZNI02 | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | MXSMIO™ | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 1.65V~2V | 133MHz | 1.8V | FLASH | SPI - Quad I/O, QPI | 40μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL129P0XNFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Surface Mount | Tray | 2014 | FL-P | Obsolete | 3 (168 Hours) | 8 | 3A991.B.1.A | ROHS3 Compliant | No | 8 | 8-UDFN Exposed Pad | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1 | 38mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 1.27mm | 2.7V | 3/3.3V | 3.3V | 1.5 ms | 128Mb 16M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 104MHz | 0.00001A | 1b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 50ms | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 5μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS61NLP51236B-200B3I | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Last Time Buy | 3 (168 Hours) | 165 | 15mm | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 1 | BOTTOM | 3.3V | YES | 1mm | R-PBGA-B165 | 3.135V | 3.465V | 3ns | 18Mb 512K x 36 | Volatile | 3.135V~3.465V | 512KX36 | 36 | 18874368 bit | 200MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC00/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 128 b | 3mm | Surface Mount | 0°C~70°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | DUAL | 260 | 4.5V | 40 | 24LC00 | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 3500ns | 128b 16 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | 4ms | I2C | 1010XXXR | EEPROM | I2C | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256L25YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 20 | 28 | INDUSTRIAL | YES | 1.27mm | 4.5V | Not Qualified | 5.5V | RAM, SRAM - Asynchronous | 32KX8 | 8 | 262144 bit | 25 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V7519S200BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2013 | yes | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | No | 256 | PIPELINED OR FLOW THROUGH ARCHITECTURE | BGA | Parallel | 3.45V | 1mm | 3.15V | 9 Mb | 200MHz | 17mm | 1.4mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 256 | COMMERCIAL | YES | 15 ns | 200MHz | 1.1MB | RAM, SDR, SRAM | 36b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 13mm | 1.2mm | CMOS | 1 | 310mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28EW01GABA1HPC-0SIT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | Active | 3 (168 Hours) | 64 | 13mm | ROHS3 Compliant | 64-LBGA | 11mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.4mm | 1 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | 260 | 3V | 30 | YES | 1mm | R-PBGA-B64 | 2.7V | 3.6V | 95ns | 1Gb 128M x 8 64M x 16 | Non-Volatile | 2.7V~3.6V | 64MX16 | 16 | 1073741824 bit | 3V | FLASH | Parallel | 60ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C128M8D3A-12BCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 78-VFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 20ns | 1Gb 128M x 8 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H16M32LFCM-5:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | Obsolete | 2 (1 Year) | ROHS3 Compliant | 90-VFBGA | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPDDR | MT46H16M32 | 90-VFBGA (10x13) | 5ns | 512Mb 16M x 32 | Volatile | 1.7V~1.95V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V256SA12YI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-BSOJ (0.300, 7.62mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT71V256 | 28-SOJ | 12ns | 256Kb 32K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65802S150PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 150MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.325mA | 512KX18 | 18 | 9437184 bit | 0.04A | 3.8 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C256M16D3A-12BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | 96-VFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 4Gb 256M x 16 | Volatile | 1.425V~1.575V | 800MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL512SAGBHVB10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2016 | FL-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24 | IT ALSO HAVE MEMORY WIDTH X1 | 24-TBGA | SPI, Serial | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 0.061mA | 2.7V~3.6V | 64MX8 | 8 | 512753664 bit | 133MHz | 0.0003A | 1 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C025AV-25AXCT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2003 | Obsolete | 3 (168 Hours) | 100 | EAR99 | 3.3V | 2 | ROHS3 Compliant | Lead Free | No | 100 | 100-LQFP | 128 kb | 25GHz | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | e3 | Matte Tin (Sn) | QUAD | 3.3V | CY7C025 | YES | 0.5mm | 3-STATE | 128Kb 8K x 16 | Volatile | 26b | 0.165mA | 3V~3.6V | 8KX16 | 16 | 0.00005A | COMMON | 2V | SRAM | Parallel | 25ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA12PZG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 8mm | RoHS Compliant | Lead Free | No | 28 | TSSOP | Parallel | 5.5V | 4.5V | 256 kb | 11.8mm | 1mm | CMOS | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 5V | 30 | 28 | COMMERCIAL | 0.55mm | SRAMs | 5V | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V35L15PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 144 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 185mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3.3V | 100 | COMMERCIAL | 0.5mm | 15 ns | 18kB | RAM, SDR, SRAM | 26b | 8KX18 | Asynchronous | 18b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256L35YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2005 | no | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 17.9324mm | Non-RoHS Compliant | 28 | Parallel | not_compliant | 7.5184mm | CMOS | 3.556mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 5V | 20 | 28 | INDUSTRIAL | YES | 1.27mm | SRAMs | Not Qualified | 5V | 5V | 3-STATE | RAM, SRAM - Asynchronous | 0.105mA | 32KX8 | 8 | 262144 bit | 0.0002A | 35 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43LD32160A-25BLI | ISSI, Integrated Silicon Solution Inc | 8.0571 |
Min: 1 Mult: 1 |
0.00000000 | 14 Weeks | Tray | Active | 3 (168 Hours) | 134 | EAR99 | 1 | 11.5mm | ROHS3 Compliant | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-TFBGA | 512 Mb | Surface Mount | -40°C~85°C TC | SDRAM - Mobile LPDDR2-S4 | SYNCHRONOUS | 1.1mm | 1 | 400MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | NOT SPECIFIED | 1.2V | NOT SPECIFIED | YES | 0.65mm | R-PBGA-B134 | 1.14V | 1.3V | 512Mb 16M x 32 | Volatile | 13b | 1.14V~1.95V | 16MX32 | 32 | FOUR BANK PAGE BURST | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C128M16D2A-25BCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2015 | Active | 3 (168 Hours) | RoHS Compliant | 84-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | NOT SPECIFIED | NOT SPECIFIED | 2Gb 128M x 16 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA20YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 2010 | no | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 5V | 1 | RoHS Compliant | 28 | Parallel | 5.5V | 4.5V | 256 kb | CMOS | 3.556mm | 1 | 145mA | e0 | DUAL | J BEND | 225 | 5V | 20 | 28 | INDUSTRIAL | SRAMs | Not Qualified | 5V | 3-STATE | 20 ns | RAM, SRAM - Asynchronous | 15b | 32KX8 | 8 | Asynchronous | 8b | YES | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PC28F00AP30TF0 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2015 | Axcell™ | Discontinued | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 64 | 64-TBGA | Parallel | Surface Mount | -40°C~85°C TA | FLASH - NOR | 28F00AP30 | 64-EasyBGA (8x10) | 100ns | 1Gb 64M x 16 | Non-Volatile | 1.7V~2V | 52MHz | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL512SDPMFVG10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | FL-S | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X1 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 7.5mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-G16 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 0.075mA | 2.7V~3.6V | 64MX8 | 8 | 512753664 bit | 66MHz | 0.0003A | 1 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O |
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IS42S32800D-75EB ISSI, Integrated Silicon Solution Inc
Surface Mount 90 Pin Memory IC 256 Mb kb 13mm mm 180mA mA
Price: 0.0000
RFQ -
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