Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Page Size | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
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.png "W25Q64JWSSIM") |
W25Q64JWSSIM | Winbond Electronics | 1.0312 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tube | SpiFlash® | Active | RoHS Compliant | 8-SOIC (0.209, 5.30mm Width) | compliant | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 1.7V~1.95V | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL512SAGBHAC10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Automotive, AEC-Q100, FL-S | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | ITS ALSO CONFIGURABLE AS 512MX1 | 24-TBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | AEC-Q100; TS 16949 | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 64MX8 | 8 | 512753664 bit | SERIAL | 133MHz | 1 | 3V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V657S12BFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | Parallel | 3.45V | 3.15V | 1.1 Mb | 15mm | 1.4mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | INDUSTRIAL | YES | 0.8mm | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM | 30b | 0.515mA | 0.015A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q128FWEIG | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 8 | 85°C | -40°C | 1.8V | RoHS Compliant | No | 8 | SPI, Serial | 1.95V | 1.7V | 128 Mb | 104MHz | CMOS | 1 | 20mA | DUAL | 1.8V | 8 | INDUSTRIAL | 1.27mm | Flash Memories | 7.5 ns | FLASH, NOR | 24b | 1 | Synchronous | 0.00002A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 256B | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16100E-6BL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | yes | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 10.1mm | RoHS Compliant | 60 | AUTO/SELF REFRESH | 60-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 160mA | 1.2mm | 8542.32.00.02 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 10 | 60 | YES | 0.65mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.5ns | 16Mb 1M x 16 | Volatile | 3V~3.6V | 1MX16 | 16 | 16b | 166MHz | 0.002A | COMMON | 2048 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S16800F-7B-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | 5.4ns | 128Mb 8M x 16 | Volatile | 3V~3.6V | 143MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3579S65PFG | Integrated Device Technology (IDT) | 9.0761 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Through Hole | Bulk | 2009 | yes | Active | 3 (168 Hours) | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 14mm | 1.4mm | e3 | Matte Tin (Sn) | 260 | 100 | 6.5 ns | 133MHz | 512kB | RAM, SDR, SRAM | 18b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3558SA133BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 13mm | 1.2mm | CMOS | 1 | 300mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA80BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | unknown | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.26mA | 128KX36 | 36 | 4718592 bit | 95MHz | 0.045A | 8 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3579S5BF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | Non-RoHS Compliant | 208-LFBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3579 | 208-CABGA (15x15) | 5ns | 1.125Mb 32K x 36 | Volatile | 3.15V~3.45V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3399S166PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.45V | 3.15V | 2.3 Mb | 166MHz | 14mm | 1.4mm | CMOS | 1 | 500mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.635mm | SRAMs | 3-STATE | 3.6 ns | 166MHz | 256kB | RAM, SDR, SRAM | 34b | Synchronous | 0.03A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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7164S20DB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2007 | no | Active | 1 (Unlimited) | 28 | 125°C | -55°C | 5V | 1 | 37.2mm | RoHS Compliant | Contains Lead | No | 28 | CDIP | Parallel | 64 kb | 15.24mm | 1.65mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | THROUGH-HOLE | 240 | 5V | 28 | MILITARY | NO | 2.54mm | SRAMs | 5V | 3-STATE | MIL-STD-883 Class B | RAM, SRAM - Asynchronous | 13b | 8KX8 | 0.02A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67903S80PFG | Integrated Device Technology (IDT) | 16.7268 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 100MHz | 14mm | 1.4mm | CMOS | 1 | 210mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 8 ns | 100MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.05A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S80BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 200mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 8 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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S34ML02G104TFI013 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | 48 | 18.4mm | RoHS Compliant | 12mm | CMOS | ASYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | GULL WING | NOT SPECIFIED | 3.3V | NOT SPECIFIED | INDUSTRIAL | YES | 0.5mm | R-PDSO-G48 | 2.7V | 85°C | -40°C | 3.6V | 128MX16 | 16 | 2147483648 bit | FLASH | PARALLEL | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C256-20UM/883 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 23 Weeks | Through Hole | Tray | 1997 | no | Active | 1 (Unlimited) | 28 | 5V | 16.51mm | Non-RoHS Compliant | Contains Lead | Lead, Tin | 28 | AUTOMATIC WRITE | 28-BCPGA | Parallel, SPI | 256 kb | 200GHz | 13.97mm | Through Hole | -55°C~125°C TC | CMOS | ASYNCHRONOUS | 4.4mm | 1 | 50mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | 225 | 5V | 30 | AT28C256 | 2.54mm | Not Qualified | 5V | 3-STATE | 200ns | MIL-STD-883 Class C | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 0.0003A | 10000 Write/Erase Cycles | 10ms | 5V | YES | YES | 64words | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
IS34ML01G084-BLI | ISSI, Integrated Silicon Solution Inc | 3.4892 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 63 | 3A991.B.1.A | 11mm | ROHS3 Compliant | 63-VFBGA | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 8542.32.00.51 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 10 | YES | 0.8mm | R-PBGA-B63 | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 128MX8 | 8 | 1073741824 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V016SA12PHG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 44 | 70°C | 0°C | 3.3V | 1 | 18.41mm | RoHS Compliant | Lead Free | 44 | TSOP | Parallel | 3.6V | 3V | 1 Mb | 10.16mm | 1mm | CMOS | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | GULL WING | 260 | 3.3V | 30 | 44 | COMMERCIAL | 0.8mm | SRAMs | Not Qualified | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | YES | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49F002N-55TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1999 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT49F002 | 55ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7133LA25PF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7133 | 32Kb 2K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V06S55J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V06 | 128Kb 16K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE25S20FDW00-AH | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC64-E/ST16KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 4.4mm | 8-TSSOP (0.173, 4.40mm Width) | compliant | 3mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | DUAL | 5V | 24LC64 | YES | 0.65mm | R-PDSO-G8 | 2.5V | 5.5V | 900ns | TS 16949 | 64Kb 8K x 8 | Non-Volatile | 2.5V~5.5V | 8KX8 | 8 | 65536 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V9089S12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 512 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | RAM, SRAM | 32b | 64KX8 | Synchronous | 0.005A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
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7143LA90J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 24mm | 3.63mm | CMOS | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 90 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2556SA100BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2011 | Active | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | 250mA | 5 ns | RAM, SRAM | 17b | Synchronous | 36b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28HC64B-12SC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 28-SOIC (0.295, 7.50mm Width) | Surface Mount | 0°C~70°C TC | EEPROM | AT28HC64 | 28-SOIC | 120ns | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST26WF040BT-104I/MF | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2014 | SST26 SQI® | Active | 3 (168 Hours) | 8 | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | SPI | 5mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 1.8V | 30 | SST26WF040 | YES | 1.27mm | R-PDSO-N8 | 1.65V | 1.95V | TS 16949 | 4Mb 512K x 8 | Non-Volatile | 1.65V~1.95V | 4MX1 | 1 | 4194304 bit | SERIAL | 104MHz | 1.8V | FLASH | SPI - Quad I/O | 1.5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7140LA55PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 8 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 55 ns | RAM, SRAM | 10b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71342SA35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 32 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 4kB | RAM, SDR, SRAM | 24b | 4KX8 | Asynchronous | 0.015A | 8b | COMMON |
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S25FL512SAGBHAC10 Cypress Semiconductor Corp
Automotive, AEC-Q100, FL-S Memory IC Automotive, AEC-Q100, FL-S Series 8mm mm
Price: 0.0000
RFQ -
70V657S12BFGI Integrated Device Technology (IDT)
208 Pin Memory IC 1.1 Mb kb 15mm mm
Price: 0.0000
RFQ -
W25Q128FWEIG Winbond Electronics Corporation
Surface Mount 8 Pin Memory IC 128 Mb kb 20mA mA 8b b
Price: 0.0000
RFQ -
IS42S16100E-6BL ISSI, Integrated Silicon Solution Inc
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RFQ -
71V3558SA133BQG Integrated Device Technology (IDT)
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RFQ -
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71V016SA12PHG Integrated Device Technology (IDT)
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24LC64-E/ST16KVAO Microchip Technology
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RFQ -
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RFQ -
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RFQ -
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SST26WF040BT-104I/MF Microchip Technology
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RFQ -
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RFQ -
71342SA35J Integrated Device Technology (IDT)
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