Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AT24C08C-SSPD-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | EAR99 | 4.925mm | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | compliant | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | e4 | NICKEL PALLADIUM GOLD | DUAL | 5V | AT24C08 | YES | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 5.5V | 900ns | 8Kb 1K x 8 | Non-Volatile | 0.003mA | 2.5V~5.5V | 1KX8 | 8 | 8192 bit | SERIAL | 1MHz | 0.000004A | 100 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67803S166BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | PIPELINED ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 166MHz | 13mm | 1.2mm | CMOS | 1 | 340mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.05A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM21LD16-60-BG | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | F-RAM™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFBGA | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 48-FBGA (6x8) | 110ns | 2Mb 128K x 16 | Non-Volatile | 2.7V~3.6V | FRAM | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T631S15BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2005 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 2.6V | 2.4V | 4 Mb | 15mm | 1.4mm | CMOS | 1.5mm | 1 | 305mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 15 ns | 512kB | RAM, SDR, SRAM | 36b | Asynchronous | 0.01A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71024S15TYG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 5V | 1 | 21.95mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 5.5V | 4.5V | 1 Mb | 7.6mm | 2.67mm | CMOS | 3.76mm | 1 | 155mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 5V | 32 | COMMERCIAL | SRAMs | 5V | 3-STATE | 15 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT45DB161E-SSHD-B | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tube | 1997 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 3.3V | 5.05mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | No SVHC | 16 Mb | 1.5mm | 3.99mm | Surface Mount | -40°C~85°C TC | CMOS | 1 | 26mA | e4 | DUAL | 260 | 3V | 8 | 1.27mm | 2.5V | 3.6V | 6 ns | 16Mb 528Bytes x 4096 pages | Non-Volatile | 21b | 2.5V~3.6V | 16MX1 | Synchronous | 8b | 85MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 512B | SPI | FLASH | SPI | 8μs, 4ms | ||||||||||||||||||||||||||||||||||||||||||
 |
BR24C02-RDW6TP | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Copper, Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 2 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | BR24C02 | 8 | 0.65mm | Not Qualified | 3.5 μs | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 2KX1 | 1 | 100kHz | 3e-7A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 10ms | I2C | 1010DDDR | EEPROM | I2C | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24T08FVM-WTR | ROHM Semiconductor | 0.7191 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | 2.9mm | ROHS3 Compliant | Copper, Tin | 8-VSSOP, 8-MSOP (0.110, 2.80mm Width) | 2-Wire, I2C, Serial | 8 kb | 2.8mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.9mm | 1 | e3 | Matte Tin (Sn) | DUAL | 225 | 2.5V | NOT SPECIFIED | BR24T08 | 0.65mm | R-PDSO-G8 | 1.6V | Not Qualified | 1.8/5V | 5.5V | 900 ns | 8Kb 1K x 8 | Non-Volatile | 0.002mA | 1.6V~5.5V | 1KX8 | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||
 |
BR25H080F-WCE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tape & Reel (TR) | 2013 | Automotive, AEC-Q100 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5mm | ROHS3 Compliant | 8-SOIC (0.173, 4.40mm Width) | SPI, Serial | 8 kb | 4.4mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.71mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | BR25H080 | 8 | 1.27mm | R-PDSO-G8 | 2.5V | Not Qualified | 3/5V | 5.5V | 8Kb 1K x 8 | Non-Volatile | 0.003mA | 2.5V~5.5V | 1KX8 | 8 | 5MHz | 0.00001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416YL12PHI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2008 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | TIN LEAD | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | INDUSTRIAL | YES | 0.8mm | R-PDSO-G44 | 3V | Not Qualified | 3.6V | RAM, SRAM - Asynchronous | 256KX16 | 16 | 4194304 bit | 12 ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS6C4016-55BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2008 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 48 | 48-LFBGA | unknown | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | NOT SPECIFIED | NOT SPECIFIED | 4Mb 256K x 16 | Volatile | 2.7V~5.5V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FT24C128A-USG-T | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Cut Tape (CT) | 2010 | yes | Discontinued | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | unknown | 3.9mm | Surface Mount | -40°C~85°C | CMOS | SYNCHRONOUS | 1.75mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | YES | 1.27mm | 2.5V | 5V | 550ns | 128Kb 16K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28HC256E-70JU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 1997 | Active | 3 (168 Hours) | 32 | 13.97mm | ROHS3 Compliant | 32-LCC (J-Lead) | 11.43mm | Surface Mount | -40°C~85°C TC | CMOS | ASYNCHRONOUS | 3.556mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | R-PQCC-J32 | 4.5V | 5.5V | 70ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 10ms | 5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75602S133PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2015 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 19b | Synchronous | 0.06A | 36b | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||
.png "R1LV0108ESN-5SI#B1") |
R1LV0108ESN-5SI#B1 | Renesas Electronics America | 4.3900 |
Min: 1 Mult: 1 |
0.00000000 | download | 18 Weeks | Tube | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 32-SOIC (0.450, 11.40mm Width) | Surface Mount | -40°C~85°C TA | 32 | 1Mb 128K x 8 | Volatile | 2.7V~3.6V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC4M32B2B5-7 IT:G TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 99 Weeks | Tape & Reel (TR) | 2009 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 90-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM | MT48LC4M32B2 | 5.5ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 143MHz | DRAM | Parallel | 14ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C512BN-SH-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 1997 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C512 | 8-SOIC | 900ns | 512Kb 64K x 8 | Non-Volatile | 1.8V~3.6V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V016SA20YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 44 | 3A991.B.2.B | 85°C | -40°C | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 44 | INDUSTRIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.12mA | 64KX16 | 16 | 1048576 bit | 0.01A | 20 ns | COMMON | 3.15V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7140LA35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q40BWSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2012 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | DUAL | 1.8V | 8 | YES | 1.27mm | R-PDSO-G8 | 1.65V | Not Qualified | 1.8V | 1.95V | 4Mb 512K x 8 | Non-Volatile | 0.025mA | 1.65V~1.95V | 4MX1 | 1 | 4194304 bit | 80MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W631GG6KB12I | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1.5V | 1 | 13mm | ROHS3 Compliant | 96 | AUTO/SELF REFRESH | 96-TFBGA | 1 Gb | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | 280mA | 1.6GHz | BOTTOM | NOT SPECIFIED | 1.5V | NOT SPECIFIED | 96 | 0.8mm | 1.425V | Not Qualified | 1.575V | 3-STATE | 20ns | 1Gb 64M x 16 | Volatile | 16b | 1.425V~1.575V | 64MX16 | 16 | 800MHz | 0.014A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25256T2-10TI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 20-TSSOP (0.173, 4.40mm Width) | Surface Mount | -40°C~85°C TA | AT25256 | 256Kb 32K x 8 | Non-Volatile | 2.7V~5.5V | 3MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53D512M32D2NP-062 WT ES:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Obsolete | 1 (Unlimited) | 200-WFBGA | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR4 | 16Gb 512M x 32 | Volatile | 1.1V | 1600MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71V124SA12YGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2013 | yes | Active | 3 (168 Hours) | 32 | 85°C | -40°C | 3.3V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | INDUSTRIAL | YES | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32160F-6TLI | ISSI, Integrated Silicon Solution Inc | 11.7509 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | 86 | PROGRAMMABLE CAS LATENCY; AUTO/SELF REFRESH | 86-TFSOP (0.400, 10.16mm Width) | 8mm | Surface Mount | -40°C~85°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | BOTTOM | 3.3V | YES | 0.8mm | R-PBGA-B90 | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | 512Mb 16M x 32 | Volatile | 0.245mA | 3V~3.6V | 16MX32 | 32 | 536870912 bit | 167MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC32GAPALNA-AIT ES TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | e•MMC™ | Active | 100-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 256Gb 32G x 8 | Non-Volatile | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25LD20CEIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-XFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 1.65V~2V | 50MHz | FLASH | SPI - Dual I/O | 97μs, 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67603S133BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | PIPELINED ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 133MHz | 13mm | 1.2mm | CMOS | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
709079L12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM | 30b | Synchronous | 0.005A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
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7006L20PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 320mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 5V | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V |
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