Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Type | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Halogen Free | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24C02CT-I/MC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-VFDFN Exposed Pad | I2C, Serial | 2 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 24C02C | 8 | 0.5mm | 5V | 900ns | 2Kb 256 x 8 | Non-Volatile | 4.5V~5.5V | 8 | 400kHz | 0.00005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 1ms | I2C | 1010DDDR | EEPROM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709369L7PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2010 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 288 kb | 45.45MHz | 14mm | 1.4mm | 465mA | 18 ns | RAM, SRAM | 14b | Synchronous | 18b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS25LQ025B-JBLE | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Active | 3 (168 Hours) | 8 | ROHS3 Compliant | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | 3V | YES | 1.27mm | 2.3V | 3.6V | 256Kb 32K x 8 | Non-Volatile | 2.3V~3.6V | 256KX1 | 1 | 262144 bit | 104MHz | 3V | FLASH | SPI - Quad I/O | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S34ML01G100TFI503 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MX29LV800CBXBI-70G") |
MX29LV800CBXBI-70G | Macronix | 4.0261 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2012 | yes | Active | 48 | 3A991.B.1.A | 8mm | Non-RoHS Compliant | 6mm | CMOS | ASYNCHRONOUS | 1.3mm | 8542.32.00.51 | 1 | NOR TYPE | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3V | 40 | 48 | INDUSTRIAL | YES | 0.8mm | R-PBGA-B48 | 2.7V | 85°C | -40°C | Flash Memories | Not Qualified | 3/3.3V | 3.6V | 0.03mA | 8MX16 | 16 | 134217728 bit | FLASH | PARALLEL | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 12115 | YES | YES | 16K8K32K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C010E-12FM/883 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 23 Weeks | Surface Mount | Tube | 1998 | no | Active | 3 (168 Hours) | 32 | 5V | 20.8mm | Non-RoHS Compliant | Contains Lead | Lead, Tin | 32 | AUTOMATIC WRITE | 32-CFlatpack | 1 Mb | 120GHz | 12.15mm | Surface Mount | -55°C~125°C TC | CMOS | ASYNCHRONOUS | 3.05mm | 1 | 80mA | DUAL | 5V | AT28C010 | 1.27mm | Not Qualified | 3-STATE | 120ns | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | 128KX8 | 8 | 5V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX66U51235FMI-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tube | Not For New Designs | 3 (168 Hours) | 16 | 10.3mm | Non-RoHS Compliant | Lead Free | ALSO IT CAN BE CONFIGURED AS 512M X 1 BIT | 7.52mm | CMOS | SYNCHRONOUS | 2.65mm | 1 | NOR TYPE | e3 | Matte Tin (Sn) | DUAL | GULL WING | 260 | 1.8V | 40 | INDUSTRIAL | YES | 1.27mm | R-PDSO-G16 | 1.65V | 85°C | -40°C | Flash Memories | Not Qualified | 1.8V | 2V | 0.04mA | 128MX4 | 4 | 536870912 bit | FLASH | SERIAL | 108MHz | 0.00004A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
709289L12PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | 12ns | 1Mb 64K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H16M16LFBF-75:H | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2012 | Obsolete | 3 (168 Hours) | 54 | 1.8V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 54 | AUTO/SELF REFRESH | 54-VFBGA | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPSDR | 1mm | 1 | 80mA | BOTTOM | 1.8V | MT48H16M16 | 0.8mm | 1.7V | 1.95V | 3-STATE | 5.4ns | 256Mb 16M x 16 | Volatile | 15b | 1.7V~1.95V | 16MX16 | 16 | 16b | 133MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761SA166BQI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V25761 | 165-CABGA (13x15) | 3.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 166MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
DS1250BL-100 | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2000 | no | Obsolete | 1 (Unlimited) | 34 | 3A991.B.2.A | Non-RoHS Compliant | Contains Lead | 34 | 34-LPM | not_compliant | 100GHz | Surface Mount | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8542.32.00.41 | 1 | e0 | TIN LEAD | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | DS1250BL | YES | 4.75V | SRAMs | Not Qualified | 5V | 5.25V | 4Mb 512K x 8 | Non-Volatile | 0.085mA | 4.75V~5.25V | 512KX8 | 8 | 4194304 bit | 0.005A | 100 ns | NVSRAM | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC32M8A2P-6A:D | Micron Technology Inc. | 2.3403 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2007 | yes | Obsolete | 2 (1 Year) | 54 | EAR99 | 3.3V | 1 | 22.22mm | ROHS3 Compliant | Lead Free | No | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 256 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 1.2mm | 1 | 135mA | e3 | MATTE TIN | DUAL | 260 | 3.3V | 30 | MT48LC32M8A2 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 256Mb 32M x 8 | Volatile | 15b | 3V~3.6V | 32MX8 | 8 | 8b | 167MHz | COMMON | 8192 | DRAM | Parallel | 12ns | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25L12836EZNI-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | MX25xxx35/36 - MXSMIO™ | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 8mm | RoHS Compliant | ALSO IT CAN BE CONFIGURED AS 128M X 1 BIT | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.71 | 1 | e3 | MATTE TIN (800) | DUAL | 260 | 3V | 40 | YES | 1.27mm | R-PDSO-N8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 128Mb 16M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 32MX4 | 4 | 134217728 bit | SERIAL | 104MHz | 0.00004A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | SPI | FLASH | SPI | 300μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IS42S16160G-6BI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 54-TFBGA | Surface Mount | -40°C~85°C TA | SDRAM | 5.4ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C11681KV18-450BZXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 165 | 15mm | ROHS3 Compliant | PIPELINED ARCHITECTURE | 165-LBGA | unknown | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR II+ | 1.4mm | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 20 | 165 | YES | 1mm | R-PBGA-B165 | 1.7V | COMMERCIAL | 1.9V | 18Mb 1M x 18 | Volatile | 1.7V~1.9V | 1MX18 | 18 | 18874368 bit | 450MHz | 0.45 ns | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42S32160D-7BL-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | yes | Active | 3 (168 Hours) | 90 | 1 | 13mm | ROHS3 Compliant | 90 | AUTO/SELF REFRESH | 90-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | MATTE TIN | BOTTOM | 225 | 3.3V | NOT SPECIFIED | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | 512Mb 16M x 32 | Volatile | 0.3mA | 3V~3.6V | 16MX32 | 32 | 536870912 bit | 32b | 143MHz | 0.004A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL256LDPNFN013 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | FL-L | Active | 3 (168 Hours) | 8 | 8mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X 1 | 8-WDFN Exposed Pad | 6mm | Surface Mount | -40°C~125°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 1 | DUAL | 3V | YES | 1.27mm | R-PDSO-N8 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | SERIAL | 66MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7024L35PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 64Kb 4K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39LF402C-55-4C-B3KE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 26 Weeks | Surface Mount | Tape & Reel (TR) | 2014 | SST39 MPF™ | Active | 3 (168 Hours) | 48 | 3.3V | ROHS3 Compliant | No | 48 | 48-TFBGA | 4 Mb | Surface Mount | 0°C~70°C TA | CMOS | 18mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 3.3V | SST39LF402C | 0.8mm | 55ns | 4Mb 256K x 16 | Non-Volatile | 1b | 3V~3.6V | 256KX16 | 16 | Asynchronous | 0.00002A | 16b | YES | YES | YES | 128 | YES | YES | FLASH | Parallel | 10μs | 2K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C256C-MAHL-E | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2012 | Active | 3 (168 Hours) | 8 | 3mm | Non-RoHS Compliant | ALSO OPERATES 1.7V AT 400 KHZ | 8-UFDFN Exposed Pad | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 8542.32.00.51 | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 2.5V | 40 | AT24C256C | YES | 0.5mm | R-PDSO-N8 | 1.7V | 5.5V | 550ns | 256Kb 32K x 8 | Non-Volatile | 1.7V~5.5V | 32KX8 | 8 | 262144 bit | SERIAL | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC56AT-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 2 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 93LC56A | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 250 ns | 2Kb 256 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S99AL008J70TFI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Last Time Buy | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65603S150BQG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel | 2007 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 13mm | 1.2mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | YES | SRAMs | 3-STATE | 6.7 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 0.325mA | 256KX36 | 0.04A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25V4006EM1I-13G | Macronix | 0.3538 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tube | 2010 | MX25xxx05/06 | Not For New Designs | 3 (168 Hours) | 8 | 3A991.B.1.B.1 | 3.6V | 4.9mm | ROHS3 Compliant | Lead Free | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 4 Mb | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 8 | YES | 1.27mm | R-PDSO-G8 | 2.35V | Not Qualified | 2.5/3.3V | 4Mb 512K x 8 | Non-Volatile | 0.02mA | 2.35V~3.6V | 2MX2 | 2 | 75MHz | 0.00001A | 1 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 3-WIRE | FLASH | SPI | 50μs, 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE24512AQF-AH | ON Semiconductor | 3.8562 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | ACTIVE (Last Updated: 2 days ago) | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 2mm | ROHS3 Compliant | Lead Free | No | 8 | 8-WFDFN Exposed Pad | 2-Wire, I2C, Serial | 512 kb | 750μm | 3mm | Surface Mount | -40°C~85°C TA | 8 | Halogen Free | 900ns | 512Kb 64K x 8 | Non-Volatile | 1.7V~3.6V | 400kHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53D1G64D8NW-062 WT:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24G64FJ-3GTE2 | ROHM Semiconductor | 0.2417 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | Tin | 8 | SEATED HT-CALCULATED | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | Unknown | 64 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | DUAL | NOT SPECIFIED | NOT SPECIFIED | BR24G64 | 1.27mm | 1.6V | 5.5V | 900 ns | 64Kb 8K x 8 | Non-Volatile | 1.6V~5.5V | 8 | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT93C66-10PI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | Not Applicable | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | EEPROM | AT93C66 | 8-PDIP | 4Kb 512 x 8 256 x 16 | Non-Volatile | 2.7V~5.5V | 2MHz | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
SST39LF020-45-4C-B3KE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | SST39 MPF™ | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.3V | ROHS3 Compliant | No | 48 | 48-TFBGA | 2 Mb | Surface Mount | 0°C~70°C TA | CMOS | 8542.32.00.51 | 20mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3.3V | 40 | SST39LF020 | 0.8mm | 45ns | 2Mb 256K x 8 | Non-Volatile | 18b | 3V~3.6V | 256KX8 | 8 | Asynchronous | 8b | 0.000015A | 8b | YES | YES | YES | 64 | FLASH | Parallel | 20μs | 4K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS43R83200F-6TLI | ISSI, Integrated Silicon Solution Inc | 4.5947 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Active | 3 (168 Hours) | 66 | 2.5V | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | 256 Mb | Surface Mount | -40°C~85°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | YES | 0.65mm | R-PDSO-G66 | 2.3V | 2.7V | 700ps | 256Mb 32M x 8 | Volatile | 13b | 2.3V~2.7V | 32MX8 | 8 | 166MHz | DRAM | Parallel | 15ns |
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