Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Serial Bus Type | I2C Control Byte | Reverse Pinout | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "7038L20PFGI8") |
7038L20PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 1.1 Mb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 360mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 5V | 30 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | RAM, SRAM | 32b | 64KX18 | Asynchronous | 0.003A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67603S150BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 2.15mm | 22mm | 2.15mm | CMOS | 325mA | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | YES | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | 0.07A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67703S85BQI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | 9 Mb | 13mm | 1.2mm | CMOS | 1 | e0 | TIN LEAD | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | INDUSTRIAL | YES | SRAMs | 3.465V | 3-STATE | RAM, SRAM | 18b | 256KX36 | 87MHz | 0.07A | 8.5 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR25H40CDF | Everspin Technologies Inc. | 16.7577 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2014 | Active | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 4 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 0.9mm | 1 | 42mA | DUAL | 260 | 3.3V | 40 | 8 | 1.27mm | 3V | 3.3V | 3.6V | 600mW | 9 ns | 4Mb 512K x 8 | Non-Volatile | 3V~3.6V | 8 | 8b | 40MHz | 0.0004A | 8b | RAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
3138321 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W972GG6KB-18 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 84-TFBGA | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 350ps | 2Gb 128M x 16 | Volatile | 1.7V~1.9V | 533MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA64F-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2002 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 64 kb | 1.5mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24AA64F | 8 | 1.27mm | 1.7V | Not Qualified | 900ns | 64Kb 8K x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL256SDPMFIG10 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2015 | FL-S | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | No | 16 | ALSO CONFIGURABLE AS 256M X 1 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 256 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.65mm | 8542.32.00.51 | 1 | 75mA | DUAL | 3V | 1.27mm | 2.7V | 3/3.3V | 3.6V | 8 ns | 256Mb 32M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 32MX8 | 8 | Synchronous | 8b | 66MHz | 0.0001A | 1b | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 500ms | 3V | SPI | FLASH | SPI - Quad I/O | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC160B-I/PG | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2007 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 9.271mm | ROHS3 Compliant | Lead Free | No | 8 | 8-DIP (0.300, 7.62mm) | SPI, Serial | 16 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 5.334mm | 1 | e3 | Matte Tin (Sn) | DUAL | 5V | 25LC160B | 8 | NO | 2.54mm | 2.5V | 3/5V | 5.5V | 100 ns | 16Kb 2K x 8 | Non-Volatile | 0.006mA | 2.5V~5.5V | 8 | 10MHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
25AA160D-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2004 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 9.271mm | ROHS3 Compliant | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | SPI, Serial | 16 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 5.334mm | 1 | 5mA | e3 | DUAL | 5V | 25AA160D | 8 | 2.54mm | 160 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7133LA35FB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Bulk | 2013 | no | Active | 1 (Unlimited) | 68 | 125°C | -55°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | Parallel | 32 kb | 24mm | 2mm | CMOS | 1 | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 240 | 5V | 68 | MILITARY | YES | SRAMs | 5V | 3-STATE | MIL-PRF-38535 | RAM, SRAM | 22b | 0.004A | 35 ns | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28F008B5VG-8 T | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2002 | no | Obsolete | 1 (Unlimited) | 40 | EAR99 | 18.4mm | Non-RoHS Compliant | 100,000 ERASE CYCLES; TOP BOOT BLOCK | 40-TFSOP (0.724, 18.40mm Width) | not_compliant | 10mm | Surface Mount | 0°C~70°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 235 | 5V | 30 | MT28F008B5 | 40 | YES | 0.5mm | R-PDSO-G40 | 4.5V | Not Qualified | 5V | 5.5V | 8Mb 1M x 8 | Non-Volatile | 0.055mA | 4.5V~5.5V | 1MX8 | 8 | 8388608 bit | 0.000005A | 80 ns | 5V | NO | NO | YES | 1217 | FLASH | Parallel | 80ns | 16K8K96K128K | TOP | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT93C86-10SC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | 0°C~70°C TA | AT93C86 | 16Kb 2K x 8 1K x 16 | Non-Volatile | 4.5V~5.5V | 2MHz | EEPROM | SPI | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S34ML02G200BHB003 | SkyHigh Memory Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 9mm | CMOS | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 3V | NOT SPECIFIED | INDUSTRIAL | YES | 0.8mm | R-PBGA-B63 | 2.7V | 105°C | -40°C | 3.6V | AEC-Q100 | 256MX8 | 8 | 2147483648 bit | FLASH | PARALLEL | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
6116LA120TDB | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tray | Active | 1 (Unlimited) | Non-RoHS Compliant | 24-CDIP (0.300, 7.62mm) | Through Hole | -55°C~125°C TA | SRAM - Asynchronous | IDT6116 | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 120ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3389S5PRF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 128-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3389 | 128-TQFP (14x20) | 5ns | 1.125Mb 64K x 18 | Volatile | 3.15V~3.45V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
71321LA55PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29VZZZAC8FQKSL-053 W.G8F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 26 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25U4032EMI-12G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tube | 2008 | MXSMIO™ | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 1.65V~2V | 80MHz | FLASH | SPI | 30μs, 1ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM24V10-GTR | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | F-RAM™ | Active | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 1 Mb | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 1.75mm | 1 | 1mA | e3 | Tin (Sn) | DUAL | 260 | 3.3V | 30 | FM24V10 | 8 | 1.27mm | 2V | SRAMs | Not Qualified | 2.5/3.3V | 3.6V | 130ns | 1Mb 128K x 8 | Non-Volatile | 2V~3.6V | 8 | 8b | 3.4MHz | 0.00015A | 8b | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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11LC161-E/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 9.271mm | ROHS3 Compliant | Tin | 8 | 8-DIP (0.300, 7.62mm) | Serial | 16 kb | 7.62mm | Through Hole | -40°C~125°C TA | CMOS | SYNCHRONOUS | 5.334mm | 1 | 5mA | e3 | DUAL | NOT APPLICABLE | 5V | NOT APPLICABLE | 11LC161 | 8 | 2.54mm | 2.5V | Not Qualified | 3/5V | 5.5V | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 100kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 10ms | 1-WIRE | EEPROM | Single Wire | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75602S133PFG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71T75 | 4.2ns | 18Mb 512K x 36 | Volatile | 2.375V~2.625V | 133MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24C02CT-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | DATA RETENTION > 200 YEARS, 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 2 kb | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 24C02C | 8 | YES | 1.27mm | 5V | 3500ns | 2Kb 256 x 8 | Non-Volatile | 4.5V~5.5V | 8 | 100kHz | 0.00005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 1.5ms | I2C | 1010DDDR | EEPROM | I2C | 1.5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61QDPB42M36A2-500M3L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 17mm | ROHS3 Compliant | 165 | 165-LBGA | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QUADP | 1.4mm | 1 | BOTTOM | 1.8V | YES | 1mm | 1.71V | Not Qualified | 1.8V | 1.89V | 3-STATE | 8.4ns | 72Mb 2M x 36 | Volatile | 1.2mA | 1.71V~1.89V | 2MX36 | 36 | 75497472 bit | 500MHz | 0.36A | SEPARATE | 1.71V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V05L15J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V05 | 64Kb 8K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT40A1G8WE-075E:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | Obsolete | 78 | 1 | 12mm | Non-RoHS Compliant | AUTO/SELF REFRESH | 78-TFBGA | 8mm | Surface Mount | 0°C~95°C TC | SDRAM - DDR4 | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.2V | YES | 0.8mm | R-PBGA-B78 | 1.14V | 1.26V | 8Gb 1G x 8 | Volatile | 1.14V~1.26V | 1GX8 | 8 | 8589934592 bit | 1.33GHz | MULTI BANK PAGE BURST | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CYD09S72V18-167BBXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 484 | 23mm | ROHS3 Compliant | PIPELINED OR FLOW-THROUGH ARCHITECTURE, IT CAN ALSO OPERATES AT 1.8V | 256-LBGA | unknown | 23mm | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | 2.16mm | 1 | BOTTOM | 1.5V | 484 | YES | 1mm | S-PBGA-B484 | 1.42V | COMMERCIAL | 1.58V | 4ns | 9Mb 128K x 72 | Volatile | 1.42V~1.58V 1.7V~1.9V | 128KX72 | 72 | 9437184 bit | 167MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA04H-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2008 | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | I2C, Serial | 4 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.1mm | 1 | 3mA | e3 | DUAL | 260 | 40 | 24AA04H | 8 | 0.65mm | 1.7V | OPEN-DRAIN | 900ns | ISO/TS-16949 | 4Kb 256 x 8 x 2 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | YES | 16words | I2C | 1010XXMR | NO | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR4A08BYS35R | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2014 | yes | Active | 3 (168 Hours) | 44 | EAR99 | 18.41mm | ROHS3 Compliant | 44 | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.71 | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 44 | YES | 0.8mm | 3V | Not Qualified | 3.3V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.17mA | 3V~3.6V | 2MX8 | 8 | 16777216 bit | 8b | 0.014A | 35 ns | RAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S25FL512SDPMFI013 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | FL-S | Active | 3 (168 Hours) | 16 | 10.3mm | ROHS3 Compliant | 16 | IT ALSO HAVE MEMORY WIDTH X1 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 8542.32.00.51 | 1 | DUAL | 3V | YES | 1.27mm | 2.7V | Not Qualified | 3/3.3V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 0.075mA | 2.7V~3.6V | 64MX8 | 8 | 512753664 bit | 8b | 66MHz | 0.0001A | 1 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | SPI | FLASH | SPI - Quad I/O |
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