Items : %s%s
FIFOs Memory
Additional Feature
- 64X9 DUAL PORT RAM
- ALSO REQURIES 1.8 V
- ALTERNATIVE MEMORY WIDTH 10
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS MODE ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH 9; ASYNCHRONOUS OPERATION ALSO POSSIBLE
- ALTERNATIVE MEMORY WIDTH: 10 AND 20
- ASYNCHRONOUS OPERATION ALSO POSSIBLE
- AUTO POWER DOWN
- BYPASS REGISTER
- BYPASS XCVR
- BYPASS-XCVR
- CAN ALSO BE CONFIGURED AS 131,072 X 10 X 4
- CAN ALSO BE CONFIGURED AS 16384 X 9
- CAN ALSO BE CONFIGURED AS 65536 X 9
- EASILY EXPANDABLE IN DEPTH AND WIDTH
- FALL THRU 25NS
- FALL THRU 28NS
- FALL THRU 30NS
- FALL THRU 34NS
- FALL THRU 40NS
- FALL THRU 65NS
- IT CAN ALSO BE CONFIGURED AS 128K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 16K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 32K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 4K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 64K X 9; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- IT CAN ALSO BE CONFIGURED AS 8K X 9; RETRANSMIT; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- MAIL BOX
- MAIL BOX BYPASS REGISTER
- MAIL BOX BYPASS REGISTER; PARITY GENERATOR/CHECKER
- MAIL BOX; PARITY GENERATOR/CHECKER
- MAIL BOX; RETRANSMIT
- MAILBOX
- MAILBOX BYPASS REGISTER
- MAILBOX; PARITY GENERATOR/CHECKER
- PARITY GENERATOR/CHECKER, MAILBOX
- PARITY GENERATOR/CHECKER; MAILBOX
- PORTA/PORTB:PARALLEL/SERIAL
- PORTB:36 OR 18 OR 9; MAILBOX; AUTO POWER DOWN
- REGISTER BASED; BUBBLE BACK 2.7US
- REGISTER BASED; BUBBLE BACK 3US
- REGISTER BASED; BUBBLE BACK 750NS
- RETRANSMIT
- RETRANSMIT; AUTO POWER DOWN
- RETRANSMIT; AUTO POWER DOWN; ASYNCHRONOUS MODE IS ALSO POSSIBLE
- RETRANSMIT; AUTO POWER DOWN; EASY EXPANDABLE IN DEPTH AND WIDTH
- RETRANSMIT; AUTO POWER-DOWN
- RETRANSMIT; MAILBOX
- RETRANSMIT; PARITY CHECKER; MAILBOX
- RETRANSMIT; PARITY GENERATOR/CHECKER; MAILBOX
Contact Plating
- Copper, Silver, Tin
- Gold
- Gold, Tin
- Lead, Tin
- Tin
ECCN Code
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 20 Weeks
- 26 Weeks
- 35 Weeks
- 4 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
HTS Code
- 8542.32.00.71
- 8542.39.00.01
JESD-609 Code
- e0
- e1
- e3
- e3/e4
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- LIFEBUY (Last Updated: 1 day ago)
- LIFEBUY (Last Updated: 1 week ago)
- LIFEBUY (Last Updated: 2 days ago)
- LIFEBUY (Last Updated: 3 months ago)
- LIFEBUY (Last Updated: 6 days ago)
Max Operating Temperature
- 125°C
- 70°C
- 85°C
Max Power Dissipation
- 100mW
Min Operating Temperature
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 2 (1 Year)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Number of Terminations
- 100
- 120
- 121
- 128
- 132
- 144
- 16
- 20
- 208
- 209
- 24
- 240
- 256
- 28
- 32
- 324
- 44
- 56
- 64
- 68
- 80
- 84
Operating Temperature
- -40°C~125°C
- -40°C~85°C
- -55°C~125°C
- -55°C~125°C TA
- 0°C~70°C
Package / Case
- 100
- 100-LBGA
- 100-LFBGA
- 120-LQFP
- 120-LQFP Exposed Pad
- 121-BBGA
- 128-LQFP
- 132-BQFP Bumpered
- 132-QFP
- 144-BGA
- 144-QFP
- 16-CDIP (0.300, 7.62mm)
- 16-DIP (0.300, 7.62mm)
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.209, 5.30mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 18-DIP (0.300, 7.62mm)
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 208-BGA
- 209-BGA
- 24-DIP (0.300, 7.62mm)
- 24-SOIC (0.295, 7.50mm Width)
- 240-BGA
- 256-BBGA
- 28-BSOJ (0.300, 7.62mm Width)
- 28-CDIP (0.300, 7.62mm)
- 28-CDIP (0.600, 15.24mm)
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOIC (0.345, 8.77mm Width)
- 32-CLCC
- 32-LCC (J-Lead)
- 32-LQFP
- 32-TQFP
- 324-BGA
- 44-LCC (J-Lead)
- 56-BSSOP (0.295, 7.50mm Width)
- 56-TFSOP (0.240, 6.10mm Width)
- 64-LQFP
- 64-QFP
- 64-TQFP
- 68-LCC (J-Lead)
- 80-BQFP
- 80-LQFP
- 84-CPGA
- BGA
- CDIP
- CLCC
- DIP
- FBGA
- LCC
- LQFP
- PDIP
- PLCC
- PQFP
- SOIC
- TFSOP
- TQFP
- TSSOP
Packaging
- Bulk
- Cut Tape (CT)
- Rail/Tube
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
Series
- 4000B
- 7200
- 72T
- 72V
- 74ABT
- 74ACT
- 74ALS
- 74ALVC
- 74F
- 74HC
- 74HCT
- 74S
- 74V
- CY7C
Subcategory
- FIFOs
Supplier Device Package
- 100-BGA MICROSTAR (10.1x10.1)
- 100-CABGA (11x11)
- 120-HLQFP (14x14)
- 120-TQFP (14x14)
- 128-LQFP (14x20)
- 128-TQFP (14x20)
- 132-BQFP (24.54x24.54)
- 144-PBGA (13x13)
- 16-DIP
- 16-PDIP
- 16-SO
- 16-SOIC
- 16-SSOP
- 20-PDIP
- 20-PLCC (9x9)
- 20-SOIC
- 208-PBGA (17x17)
- 209-FBGA (14x22)
- 24-PDIP
- 240-PBGA (19x19)
- 28-CerDip
- 28-DIP
- 28-PDIP
- 28-SOIC
- 28-SOJ
- 32-PLCC (11.43x13.97)
- 32-PLCC (14x11.46)
- 32-TQFP (7x7)
- 324-PBGA (19x19)
- 44-PLCC (16.58x16.58)
- 56-SSOP
- 56-TSSOP
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 68-PLCC (24.23x24.23)
- 80-LQFP (12x12)
- 80-LQFP (14x14)
- 80-QFP (14x20)
- 80-TQFP (14x14)
Surface Mount
- NO
- YES
Technology
- BICMOS
- CMOS
- TTL
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- MATTE TIN/NICKEL PALLADIUM GOLD
- NICKEL PALLADIUM
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- TIN LEAD
- TIN SILVER COPPER
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.1991g
- 1.713814g
- 141.690917mg
- 2.214806g
- 2.265694g
- 274.706879mg
- 360.605934mg
- 4.190003g
- 4.608697g
- 4.869796g
- 420.395078mg
- 465.697616mg
- 503.487531mg
- 513.60831mg
- 614.986205mg
- 624.398247mg
- 639.990485mg
- 694.790113mg
- 72.801575mg
- 722.005655mg
- 730.794007mg
- 740.007602mg
- 830.300833mg
- 951.693491mg
- 955.690774mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Number of Pins | Additional Feature | Package / Case | Max Supply Voltage | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Terminal Pitch | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Data Rate | Element Configuration | Supplier Device Package | Access Time | Bus Directional | FWFT Support | Programmable Flags Support | Retransmit Capability | Frequency (Max) | Memory Size | Function | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory IC Type | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Word Size | Output Enable | Expansion Type | Cycle Time | Current - Supply (Max) |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
CYF0072V18L-133BGXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2009 | Obsolete | 3 (168 Hours) | 209 | EAR99 | 1.8V | 22mm | ROHS3 Compliant | Lead Free | Copper, Silver, Tin | 209 | 209-BGA | 72 Mb | Surface Mount | -40°C~85°C | CMOS | 1.96mm | 8542.32.00.71 | 133MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 1.5V | 30 | CYF0072V18 | 1mm | 1.425V | FIFOs | 1.575V | Dual | 10ns | Uni-Directional | No | Yes | 72M 2M x 36 | Synchronous | 0.6mA | 1.7V~1.9V | 2MX36 | 36 | OTHER FIFO | 36b | PARALLEL | YES | Width | 7.5 ns | ||||||||||||||||||||||||||||||
 |
72V03L15JG | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 72V | Active | 3 (168 Hours) | ROHS3 Compliant | 32-LCC (J-Lead) | Surface Mount | 0°C~70°C | 72V03 | 40MHz | 15ns | Uni-Directional | No | Yes | 18K 2K x 9 | Asynchronous | 3V~3.6V | Depth, Width | 60mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V273L7-5PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 | 80 | EAR99 | 85°C | -40°C | 3.3V | 14mm | RoHS Compliant | Lead Free | Tin | 80 | TQFP | 3.45V | 3.15V | 288 kb | 133.3MHz | 14mm | 1.4mm | CMOS | 35mA | 1.6mm | 8542.32.00.71 | 1 | e3 | QUAD | GULL WING | 260 | 3.3V | 30 | 80 | INDUSTRIAL | 0.65mm | FIFOs | Not Qualified | Dual | 5 ns | Unidirectional | Yes | 133.3MHz | 16KX18 | OTHER FIFO | Synchronous | PARALLEL | 0.015A | YES | ||||||||||||||||||||||||||||||
 |
7204L12TPG | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tube | 7200 | Active | 1 (Unlimited) | ROHS3 Compliant | 28-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C | 7204 | 50MHz | 28-PDIP | 12ns | Uni-Directional | No | No | Yes | 36K 4K x 9 | Asynchronous | 4.5V~5.5V | Depth, Width | 120mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7205L35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 1 | 32 | EAR99 | 70°C | 0°C | 5V | 13.97mm | RoHS Compliant | Contains Lead | Lead, Tin | 32 | RETRANSMIT | PLCC | 5.5V | 4.5V | 72 kb | 11.43mm | 2.79mm | CMOS | 120mA | 3.556mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 32 | COMMERCIAL | 1.27mm | FIFOs | 5V | Dual | 35 ns | Unidirectional | No | Yes | 8KX9 | OTHER FIFO | Asynchronous | PARALLEL | 22.2MHz | 0.008A | 9b | NO | 45 ns | |||||||||||||||||||||||||||
|
7207L15JG | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 7200 | Active | 3 (168 Hours) | ROHS3 Compliant | 32-LCC (J-Lead) | Surface Mount | 0°C~70°C | 7207 | 40MHz | 15ns | Uni-Directional | No | Yes | 288K 32K x 9 | Asynchronous | 4.5V~5.5V | Depth, Width | 120mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "72V2113L6PF8") |
72V2113L6PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 3.3V | 14mm | RoHS Compliant | Contains Lead | Lead, Tin | 80 | TQFP | 3.45V | 3.15V | 4.5 Mb | 166MHz | 14mm | 1.4mm | 35mA | 35mA | Dual | 4 ns | Unidirectional | Yes | 166MHz | Synchronous | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
72215LB25J | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 7200 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C | 72215 | 40MHz | 15ns | Uni-Directional | Yes | No | 9K 512 x 18 | Synchronous | 4.5V~5.5V | Depth, Width | 60mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7207L25JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 1 | 32 | EAR99 | 85°C | -40°C | 5V | 13.97mm | RoHS Compliant | Contains Lead | Lead, Tin | 32 | RETRANSMIT | PLCC | 5.5V | 4.5V | 288 kb | 11.43mm | 2.79mm | CMOS | 120mA | 3.556mm | 1 | 120mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 32 | INDUSTRIAL | 1.27mm | FIFOs | 5V | Dual | 25 ns | Unidirectional | No | Yes | OTHER FIFO | Asynchronous | PARALLEL | 28.5MHz | 0.008A | 9b | NO | 35 ns | ||||||||||||||||||||||||||||
 |
72200L10TPG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2009 | 70°C | 0°C | 34.3mm | RoHS Compliant | Lead Free | Tin | 28 | DIP | 7.62mm | 3.3mm | 40mA | 6.5 ns | Unidirectional | No | No | No | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72T3685L4-4BB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | no | Discontinued | 3 | 208 | EAR99 | 70°C | 0°C | 2.5V | 17mm | RoHS Compliant | Contains Lead | Lead, Tin | 208 | BGA | 2.625V | 2.375V | 576 kb | 17mm | 1.76mm | 830.300833mg | CMOS | 70mA | 1.97mm | 8542.32.00.71 | 1 | 70mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 208 | COMMERCIAL | 1mm | FIFOs | Not Qualified | Dual | 3.4 ns | Unidirectional | Yes | 225MHz | 16KX36 | OTHER FIFO | Asynchronous | PARALLEL | 0.01A | 36b | YES | 4.4 ns | |||||||||||||||||||||||||||
|
72V04L25JGI | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | 72V | Active | 3 (168 Hours) | ROHS3 Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C | 72V04 | 28.5MHz | 25ns | Uni-Directional | No | Yes | 36K 4K x 9 | Asynchronous | 3V~3.6V | Depth, Width | 60mA | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V291L10PF8 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 72V | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | 0°C~70°C | 72V291 | 100MHz | 64-TQFP (14x14) | 6.5ns | Uni-Directional | Yes | Yes | Yes | 1.125M 128K x 9 | Synchronous | 3V~3.6V | Depth, Width | 55mA | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
72V81L15PAG8 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | 72V | Active | 1 (Unlimited) | ROHS3 Compliant | 56-TFSOP (0.240, 6.10mm Width) | Surface Mount | 0°C~70°C | 72V81 | 40MHz | 56-TSSOP | 15ns | Bi-Directional | No | No | Yes | 9K 512 x 9 x 2 | Asynchronous | 3V~3.6V | Depth, Width | 100mA |
-
CYF0072V18L-133BGXI Cypress Semiconductor Corp
209 Terminations1.8V 209 Pin CYF0072V18 FIFO memory IC72M 2M x 3610ns
Price: 0.0000
RFQ -
72V03L15JG Renesas Electronics America
72V03 FIFO memory IC72V Series 18K 2K x 915ns
Price: 0.0000
RFQ -
72V273L7-5PFGI Integrated Device Technology (IDT)
80 Terminations3.3V 80 Pin FIFO memory IC5 ns Min 3.15V VMax 3.45V V
Price: 0.0000
RFQ -
7204L12TPG Renesas Electronics America
7204 FIFO memory IC7200 Series 36K 4K x 912ns
Price: 0.0000
RFQ -
7205L35J8 Integrated Device Technology (IDT)
32 Terminations5V 32 Pin FIFO memory IC35 ns Min 4.5V VMax 5.5V V
Price: 0.0000
RFQ -
7207L15JG Renesas Electronics America
7207 FIFO memory IC7200 Series 288K 32K x 915ns
Price: 0.0000
RFQ -
72V2113L6PF8 Integrated Device Technology (IDT)
3.3V 80 Pin FIFO memory IC4 ns Min 3.15V VMax 3.45V V
Price: 0.0000
RFQ -
72215LB25J Renesas Electronics America
72215 FIFO memory IC7200 Series 9K 512 x 1815ns
Price: 0.0000
RFQ -
7207L25JI Integrated Device Technology (IDT)
32 Terminations5V 32 Pin FIFO memory IC25 ns Min 4.5V VMax 5.5V V
Price: 0.0000
RFQ -
-
72T3685L4-4BB Integrated Device Technology (IDT)
208 Terminations2.5V 208 Pin FIFO memory IC3.4 ns Min 2.375V VMax 2.625V V
Price: 0.0000
RFQ -
72V04L25JGI Renesas Electronics America
72V04 FIFO memory IC72V Series 36K 4K x 925ns
Price: 0.0000
RFQ -
72V291L10PF8 Renesas Electronics America
72V291 FIFO memory IC72V Series 1.125M 128K x 96.5ns
Price: 0.0000
RFQ -
72V81L15PAG8 Renesas Electronics America
72V81 FIFO memory IC72V Series 9K 512 x 9 x 215ns
Price: 0.0000
RFQ
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