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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

CPLDs

Additional Feature

  • 1 EXTERNAL CLOCK
  • 10 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK; VARIABLE PRODUCT TERMS
  • 10 MACROCELLS; VARIABLE PRODUCT TERMS
  • 128 MACROCELLS; SHARED INPUT/CLOCK; SHARED PRODUCT TERMS
  • 192 MACROCELLS; SHARED INPUT/CLOCK
  • 216 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • 256 MACROCELLS
  • 256 MACROCELLS; 16 LABS; CONFIGURABLE I/O OPERATION WITH 2.5 OR 3.3
  • 256 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 36 MACROCELLS
  • 484 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 512 MACROCELLS
  • 512 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 580 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 64 MACROCELLS; 4 LABS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 676 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 72 MACROCELLS
  • 72 MACROCELLS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 772 FLIP FLOPS; CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • 8 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • ALSO OPERATES WITH 3.3V SUPPLY VOLTAGE
  • CAN ALSO OPERATE WITH A 3.3V SUPPLY
  • CONFIGURABLE I/O OPERATION WITH 3.3V OR 5V
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.25
  • CONFIGURABLE I/O OPERATION WITH 3.3V+/-0.3 OR 5V+/-0.5
  • FOR SHIPPING METHOD CONTACT SALES
  • IN SYSTEM PROGRAMMABLE
  • IN-SYSTEM PROGRAMMABLE; 4 EXTERNAL CLOCKS
  • IT ALSO OPERATE WITH 2.5 TO 5.5, 2.3 TO 5.5V
  • IT ALSO OPERATE WITH 2.5 TO 5.5,2.3 TO 5.5 V
  • IT ALSO OPERATE WITH 4.5 TO 5.5 V AND 3 TO 3.6V
  • IT CAN ALSO HAVE AN INPUT VOLTAGE OF 3.3V
  • IT CAN ALSO OPERATE AT 3.3V
  • LABS INTERCONNECTED BY PIA; 12 LABS; 192 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 4 LABS; 64 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • LABS INTERCONNECTED BY PIA; 8 LABS; 128 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • MACROCELLS INTERCONNECTED BY PIA; 1 LAB; 32 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • NO
  • PAL
  • PAL BLOCKS INTERCONNECTED BY PIA; 2 PAL BLOCKS; 4 EXTERNAL CLOCKS; SHARED INPUT/CLOCK
  • PAL WITH MACROCELLS; 24 MACROCELLS; 1 EXTERNAL CLOCK; SHARED INPUT/CLOCK
  • POWER -UP RESET; SECURITY FUSE
  • PROGRAMMABLE OUTPUT POLARITY
  • REAL DIGITAL DESIGN TECHNOLOGY
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00225-1
  • REAL DIGITAL DESIGN TECHNOLOGY, XILIK00255-1
  • REGISTER PRELOAD; POWER-ON RESET
  • REGISTER PRELOAD; POWER-UP RESET
  • USE IPLSI2032VE-300 FOR NEW DESIGNS
  • USE ISPLSI 2128VE-250 FOR NEW DESIGNS
  • YES

Contact Plating

  • Copper, Silver, Tin
  • Gold, Tin
  • Lead, Tin
  • Tin

ECCN Code

  • 3A001.A.2.C
  • 3A001.A.7.A
  • 3A991
  • 3A991.D
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 3 Weeks
  • 37 Weeks
  • 4 Weeks
  • 41 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 99 Weeks

HTS Code

  • 8542.31.00.01
  • 8542.39.00.01

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e3/e4
  • e4
  • e6

JTAG BST

  • YES

Manufacturer Package Identifier

  • EPM3064ATI44-10N
  • EPM9320ARI208-10

Max Operating Temperature

  • 100°C
  • 105°C
  • 125°C
  • 130°C
  • 70°C
  • 75°C
  • 85°C
  • 90 °C
  • 90°C

Min Operating Temperature

  • -40°C
  • -55°C
  • 0 °C
  • 0°C

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 2
  • 2 (1 Year)
  • 3
  • 3 (168 Hours)
  • 4 (72 Hours)
  • 5
  • 5 (48 Hours)
  • 6 (Time on Label)

Mount

  • Surface Mount
  • Surface Mount, Through Hole
  • Through Hole

Mounting Type

  • Surface Mount
  • Through Hole

Number of Pins

  • 100
  • 128
  • 132
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 24
  • 240
  • 256
  • 28
  • 280
  • 292
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 372
  • 388
  • 40
  • 44
  • 472
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 84

Number of Terminals

  • 100
  • 144
  • 44
  • 49

Number of Terminations

  • 100
  • 120
  • 128
  • 132
  • 14
  • 144
  • 160
  • 169
  • 176
  • 192
  • 20
  • 208
  • 22
  • 24
  • 240
  • 256
  • 272
  • 28
  • 280
  • 304
  • 32
  • 320
  • 324
  • 352
  • 356
  • 388
  • 40
  • 44
  • 48
  • 484
  • 49
  • 56
  • 64
  • 672
  • 676
  • 68
  • 69
  • 8
  • 84

Operating Temperature

  • -40°C~100°C TJ
  • -40°C~105°C TA
  • -40°C~105°C TJ
  • -40°C~125°C TA
  • -40°C~125°C TJ
  • -40°C~130°C TJ
  • -40°C~85°C
  • -40°C~85°C TA
  • -55°C~125°C TA
  • -55°C~125°C TC
  • 0°C~70°C TA
  • 0°C~75°C TA
  • 0°C~85°C TJ
  • 0°C~90°C TJ

Package / Case

  • 100-BQFP
  • 100-LBGA
  • 100-LFBGA
  • 100-LQFP
  • 100-TFBGA
  • 100-TQFP
  • 12-UFQFN
  • 12-WFDFN Exposed Pad
  • 120-BQFP
  • 128-BQFP
  • 128-LQFP
  • 132-LFBGA, CSPBGA
  • 132-TFBGA, CSPBGA
  • 132-VFBGA
  • 14-UFQFN
  • 144-BGA
  • 144-LQFP
  • 144-TFBGA
  • 144-TFBGA, CSPBGA
  • 16-UFQFN Exposed Pad
  • 160-BPGA
  • 160-BQFP
  • 160-LQFP
  • 169-LFBGA
  • 176-LQFP
  • 192-BPGA
  • 20-DIP (0.300, 7.62mm)
  • 20-LCC (J-Lead)
  • 20-TSSOP (0.173, 4.40mm Width)
  • 20-UFQFN
  • 208-BFQFP
  • 208-BFQFP Exposed Pad
  • 208-BGA
  • 22-UFQFN
  • 24-CDIP (0.300, 7.62mm)
  • 24-DIP (0.300, 7.62mm)
  • 24-SOIC (0.295, 7.50mm Width)
  • 24-TSSOP (0.173, 4.40mm Width)
  • 240-BFQFP Exposed Pad
  • 256-BBGA
  • 256-BGA
  • 256-LBGA
  • 256-TFBGA
  • 272-BBGA
  • 28-CLCC
  • 28-LCC (J-Lead)
  • 28-SSOP (0.209, 5.30mm Width)
  • 280-TFBGA, CSPBGA
  • 292-BGA
  • 304-BFQFP
  • 32-VFQFN Exposed Pad
  • 324-BBGA
  • 324-BGA
  • 324-LBGA
  • 352-LBGA
  • 352-LBGA Exposed Pad, Metal
  • 356-LBGA
  • 388-BBGA
  • 40-CDIP (0.600, 15.24mm)
  • 40-CDIP (0.600, 15.24mm) Window
  • 40-DIP (0.600, 15.24mm)
  • 44-CLCC (J-Lead)
  • 44-CLCC, Window (J-Lead)
  • 44-LCC (J-Lead)
  • 44-LQFP
  • 44-TQFP
  • 48-FBGA, CSPBGA
  • 48-LQFP
  • 48-TQFP
  • 48-VFQFN Exposed Pad
  • 484-BBGA
  • 49-LFBGA
  • 56-LFBGA, CSPBGA
  • 64-TFBGA
  • 64-TFBGA, CSPBGA
  • 64-TQFP
  • 64-TQFP Exposed Pad
  • 64-VFBGA, CSPBGA
  • 672-BBGA
  • 676-BBGA
  • 68-LCC (J-Lead)
  • 68-TFBGA
  • 8-UFQFN
  • 8-WFDFN Exposed Pad
  • 84-LCC (J-Lead)
  • A
  • BGA
  • CDIP
  • CLCC
  • DIP
  • FBGA
  • FCBGA
  • J
  • LCC
  • LQFP
  • PDIP
  • PLCC
  • PQFP
  • Q
  • QFP
  • S
  • SOIC
  • TFBGA
  • TQFP

Packaging

  • Bulk
  • Tape & Reel
  • Tape & Reel (TR)
  • Tape and Reel
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Not For New Designs
  • Obsolete

Pbfree Code

  • icon-pbfree yes
  • no
  • yes

Published

  • 1994
  • 1995
  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2012
  • 2013
  • 2014
  • 2016

Series

  • ATF15xx
  • ATF2500C(L)
  • ATF750C(L)
  • ATF750LVC
  • ATV2500B(L) and BQ(L)
  • CoolRunner II
  • CoolRunner XPLA3
  • Delta 39K™ ISR™
  • GAL®16LV8
  • GAL®16V8
  • GAL®18V10
  • GAL®20RA10
  • GAL®20V8
  • GAL®22LV10
  • GAL®22V10
  • GAL®26CV12
  • GAL®26V12
  • ispGAL™22LV10
  • ispGAL™22V10
  • ispLSI® 1000
  • ispLSI® 1000E
  • ispLSI® 1000EA
  • ispLSI® 2000A
  • ispLSI® 2000E
  • ispLSI® 2000VE
  • ispLSI® 3000
  • ispLSI® 5000VA
  • ispLSI® 5000VE
  • ispMACH® 4000B
  • ispMACH® 4000C
  • ispMACH® 4000V
  • ispMACH® 4000Z
  • ispMACH® 4000ZE
  • ispMACH® 4A
  • ispMACH™ 5000VG
  • ispXPLD® 5000MB
  • ispXPLD® 5000MC
  • ispXPLD® 5000MV
  • LA-ispMACH
  • LA-MachXO
  • MACH® 4
  • MACH® 5
  • MAX® 3000A
  • MAX® 7000
  • MAX® 7000A
  • MAX® 7000B
  • MAX® 7000S
  • MAX® 9000
  • MAX® 9000A
  • MAX® II
  • MAX® V
  • Ultra37000™
  • Ultralogic™
  • XA9500XL XA
  • XC9500
  • XC9500XL
  • XC9500XV

Subcategory

  • Field Programmable Gate Arrays
  • Programmable Logic Devices

Supplier Device Package

  • 0402-3P
  • 100-FBGA (11x11)
  • 100-PQFP (14x20)
  • 100-PQFP (20x14)
  • 100-TQFP (14x14)
  • 128-TQFP (14x14)
  • 144-TQFP (20x20)
  • 160-PQFP (28x28)
  • 160-TQFP (24x24)
  • 169-UBGA (11x11)
  • 176-TQFP (24x24)
  • 208-PQFP (28x28)
  • 208-RQFP (28x28)
  • 24-PDIP
  • 24-SO
  • 240-RQFP (32x32)
  • 256-BGA (27x27)
  • 256-FBGA (17x17)
  • 256-FPBGA (17x17)
  • 256-FTBGA (17x17)
  • 256-MBGA (11x11)
  • 256-PBGA (27x27)
  • 256-SBGA (27x27)
  • 28-PLCC (11.51x11.51)
  • 28-PLCC (11.5x11.5)
  • 304-RQFP (40x40)
  • 352-MBGA (35x35)
  • 352-SBGA (35x35)
  • 388-BGA (30x30)
  • 40-Cerdip
  • 40-PDIP
  • 44-PLCC (16.51x16.51)
  • 44-PLCC (16.58x16.58)
  • 44-PLCC (16.59x16.59)
  • 44-PLCC (16.6x16.6)
  • 44-TQFP (10x10)
  • 44-VQFP (10x10)
  • 48-CSBGA (7x7)
  • 48-TQFP
  • 48-TQFP (7x7)
  • 484-FPBGA (23x23)
  • 49-UBGA (7x7)
  • 56-CSBGA (6x6)
  • 676-FPBGA (31x31)
  • 68-PLCC (24.23x24.23)
  • 68-PLCC (24x24)
  • 84-PLCC (29.31x29.31)

Surface Mount

  • NO
  • YES

Technology

  • CMOS
  • TTL

Terminal Finish

  • GOLD
  • MATTE TIN
  • MATTE TIN (472) OVER COPPER
  • Matte Tin (Sn)
  • Matte Tin (Sn) - annealed
  • Matte Tin/Copper (Sn/Cu)
  • MATTE TIN/NICKEL PALLADIUM GOLD
  • Nickel/Palladium/Gold (Ni/Pd/Au)
  • TIN BISMUTH
  • TIN LEAD
  • TIN SILVER COPPER
  • Tin/Bismuth (Sn/Bi)
  • Tin/Lead (Sn/Pb)
  • Tin/Lead (Sn/Pb) - hot dipped
  • Tin/Lead (Sn63Pb37)
  • Tin/Lead (Sn85Pb15)
  • Tin/Silver/Copper (Sn/Ag/Cu)
  • Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5)
  • Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

Terminal Position

  • BOTTOM
  • DUAL
  • PERPENDICULAR
  • QUAD

Termination

  • SMD/SMT
  • Through Hole

Weight

  • 1.182714g
  • 1.319103g
  • 1.758804g
  • 1.764389g
  • 2.386605g
  • 3.740011g
  • 5.953513g
  • 503.487531mg
  • 6.777889g
  • 657.000198mg
  • 9.071791g
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    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Published Number of Terminations Length RoHS Status Additional Feature Width Technology Height Seated (Max) HTS Code JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Temperature Grade Surface Mount Terminal Pitch JESD-30 Code Supply Voltage-Min (Vsup) Operating Temperature (Max) Subcategory Qualification Status Power Supplies Supply Voltage-Max (Vsup) Number of Outputs Propagation Delay Number of Inputs Number of I/O Organization Architecture Clock Frequency Output Function Number of Macro Cells JTAG BST Number of Dedicated Inputs In-System Programmable Number of Product Terms Programmable Logic Type
    PAL16L8-5JC PAL16L8-5JC AMD 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2013 20 8.9662mm Non-RoHS Compliant PAL 8.9662mm TTL 4.57mm 8542.39.00.01 e0 Tin/Lead (Sn/Pb) QUAD J BEND NOT SPECIFIED 5V NOT SPECIFIED 20 COMMERCIAL EXTENDED YES 1.27mm S-PQCC-J20 4.75V 75°C Programmable Logic Devices Not Qualified 5V 5.25V 8 6.5 ns 16 6 10 DEDICATED INPUTS, 6 I/O PAL-TYPE COMBINATORIAL 10 64 OT PLD
    MACH1115JC MACH1115JC AMD 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 44 16.5862mm Non-RoHS Compliant PAL BLOCKS INTERCONNECTED BY PIA; 2 PAL BLOCKS; 4 EXTERNAL CLOCKS; SHARED INPUT/CLOCK 16.5862mm CMOS 4.57mm 8542.39.00.01 e0 Tin/Lead (Sn/Pb) QUAD J BEND NOT SPECIFIED 5V NOT SPECIFIED 44 COMMERCIAL YES 1.27mm S-PQCC-J44 4.75V 70°C Programmable Logic Devices Not Qualified 5V 5.25V 7.5 ns 32 2 DEDICATED INPUTS, 32 I/O 143MHz MACROCELL 32 NO 2 NO EE PLD
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