Items : %s%s
Full & Half-Bridge Drivers ICs
Contact Plating
- Copper, Tin
- Gold
- Tin
Diode Element Material
- SILICON
ECCN Code
- EAR99
Factory Lead Time
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 29 Weeks
- 3 Weeks
- 30 Weeks
- 32 Weeks
- 36 Weeks
- 39 Weeks
- 4 Weeks
- 41 Weeks
- 42 Weeks
- 44 Weeks
- 46 Weeks
- 48 Weeks
- 5 Weeks
- 52 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 99 Weeks
Feature
- 5V Regulated Output
- 5V Regulated Output, Status Flag
- Auto Restart
- Auto Restart, Bootstrap Circuit
- Auto Restart, Bootstrap Circuit, Status Flag
- Auto Restart, Charge Pump
- Auto Restart, Slew Rate Controlled
- Auto Restart, Status Flag
- Bootstrap Circuit
- Bootstrap Circuit, 5V Regulated Output
- Bootstrap Circuit, Diode Emulation
- Bootstrap Circuit, Diode Emulation, Status Flag
- Bootstrap Circuit, Internal Oscillator
- Bootstrap Circuit, Latch Function, Status Flag
- Bootstrap Circuit, Status Flag
- Charge Pump
- Charge Pump, Slew Rate Controlled, Status Flag
- Charge Pump, Status Flag
- Diode Emulation, Status Flag
- Internal Oscillator, Status Flag, Watchdog Timer
- Internal Oscillator, Watchdog Timer
- Internal Oscillators
- Latch Function, Slew Rate Controlled, Status Flag
- Slew Rate Controlled
- Slew Rate Controlled, Status Flag
- Status Flag
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e2
- e4
- e6
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 14 hours ago)
- ACTIVE (Last Updated: 16 hours ago)
- ACTIVE (Last Updated: 19 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 20 hours ago)
- ACTIVE (Last Updated: 21 hours ago)
- ACTIVE (Last Updated: 22 hours ago)
- ACTIVE (Last Updated: 23 hours ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- ACTIVE (Last Updated: 8 months ago)
- ACTIVE, NOT REC (Last Updated: 1 week ago)
- ACTIVE, NOT REC (Last Updated: 3 days ago)
- ACTIVE, NOT REC (Last Updated: 4 days ago)
- ACTIVE, NOT REC (Last Updated: 4 hours ago)
- ACTIVE, NOT REC (Last Updated: 5 days ago)
- ACTIVE, NOT REC (Last Updated: 6 days ago)
- LAST SHIPMENTS (Last Updated: 1 month ago)
- LAST SHIPMENTS (Last Updated: 1 week ago)
- LAST SHIPMENTS (Last Updated: 2 days ago)
- LAST SHIPMENTS (Last Updated: 3 days ago)
- LAST SHIPMENTS (Last Updated: 3 weeks ago)
- LAST SHIPMENTS (Last Updated: 4 weeks ago)
- LAST SHIPMENTS (Last Updated: 5 days ago)
- LIFETIME (Last Updated: 1 day ago)
- LIFETIME (Last Updated: 1 week ago)
- LIFETIME (Last Updated: 2 days ago)
- LIFETIME (Last Updated: 2 weeks ago)
- LIFETIME (Last Updated: 3 days ago)
- LIFETIME (Last Updated: 5 days ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 day ago)
- OBSOLETE (Last Updated: 1 week ago)
- OBSOLETE (Last Updated: 2 days ago)
- OBSOLETE (Last Updated: 2 weeks ago)
- OBSOLETE (Last Updated: 20 hours ago)
- OBSOLETE (Last Updated: 3 days ago)
- OBSOLETE (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 2 weeks ago)
Manufacturer Package Identifier
- SO20-SO20MEC
- VFQFPN
Max Operating Temperature
- 125°C
- 150°C
- 70°C
- 80°C
- 85°C
- 90°C
- 95°C
Min Operating Temperature
- -20°C
- -25°C
- -30°C
- -40°C
- -55°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- Not Applicable
Mount
- PCB, Through Hole
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 17
- 18
- 19
- 20
- 21
- 22
- 23
- 24
- 25
- 27
- 28
- 29
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 38
- 40
- 41
- 44
- 48
- 5
- 56
- 6
- 7
- 8
- 9
Number of Terminations
- 10
- 11
- 12
- 13
- 14
- 15
- 16
- 18
- 19
- 2
- 20
- 21
- 22
- 23
- 24
- 25
- 27
- 28
- 30
- 31
- 32
- 33
- 34
- 35
- 36
- 37
- 39
- 40
- 41
- 43
- 44
- 48
- 5
- 54
- 56
- 6
- 68
- 7
- 8
- 9
Operating Temperature
- -10°C~100°C
- -10°C~70°C TA
- -20°C~100°C TA
- -20°C~100°C TJ
- -20°C~125°C TJ
- -20°C~150°C TJ
- -20°C~60°C TA
- -20°C~70°C TA
- -20°C~75°C TA
- -20°C~80°C TA
- -20°C~85°C TA
- -20°C~90°C TA
- -25°C~125°C TJ
- -25°C~150°C TJ
- -25°C~75°C TA
- -25°C~85°C
- -30°C~100°C TA
- -30°C~110°C TA
- -30°C~150°C TJ
- -30°C~75°C TA
- -30°C~80°C TA
- -30°C~85°C TA
- -30°C~90°C TA
- -30°C~95°C TA
- -35°C~85°C TA
- -40°C~100°C TA
- -40°C~105°C TA
- -40°C~110°C TJ
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TC
- -40°C~125°C TJ
- -40°C~150°C TA
- -40°C~150°C TJ
- -40°C~165°C TJ
- -40°C~170°C TJ
- -40°C~175°C TJ
- -40°C~85°C TA
- -40°C~85°C TJ
- -40°C~90°C TA
- -40°C~95°C TA
- -55°C~150°C
- -55°C~150°C TA
- -55°C~150°C TJ
- -55°C~175°C TJ
- 0°C~125°C TJ
- 0°C~150°C TJ
- 0°C~70°C
- 125°C TJ
- 150°C TJ
- 175°C TJ
Package / Case
- 10-LSOP (0.173, 4.40mm Width)
- 10-PowerDIP Module
- 10-PowerVFDFN
- 10-SIP
- 10-SOP (0.154, 3.90mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 10-UFDFN
- 10-UFDFN Exposed Pad
- 10-VDFN Exposed Pad
- 10-VFBGA
- 10-WFDFN Exposed Pad
- 12-BSOP (0.295, 7.50mm Width) Exposed Pad
- 12-Power LFDFN
- 12-PowerDIP, Module
- 12-PowerSIP
- 12-PowerSIP, Formed Leads
- 12-PowerTFDFN
- 12-SIP
- 12-SIP, 11 Leads
- 12-VFDFN Exposed Pad
- 14-LSOP (0.173, 4.40mm Width)
- 14-LSSOP (0.173, 4.40mm Width) + 2 Heat Tabs
- 14-SOIC (0.154, 3.90mm Width)
- 14-SOIC (0.173, 4.40mm Width)
- 14-SOP (0.173, 4.40mm Width)
- 14-TSSOP (0.154, 3.90mm Width) Exposed Pad
- 14-VFQFN Exposed Pad
- 15-UFBGA, CSPBGA
- 16-DIP (0.300, 7.62mm)
- 16-LSOP (0.213, 5.40mm Width) + 4 Heat Tabs
- 16-LSSOP (0.173, 4.40mm Width)
- 16-SIP Formed Leads
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width) Exposed Pad
- 16-SOIC (0.173, 4.40mm Width)
- 16-SOIC (0.209, 5.30mm Width)
- 16-SOIC (0.295, 7.50mm Width)
- 16-SOIC (0.295, 7.50mm Width) Exposed Pad
- 16-SSIP, 13 Leads, Exposed Pad, Formed Leads
- 16-TQFN Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 16-UFBGA, WLCSP
- 16-UFQFN Exposed Pad
- 16-VFQFN
- 16-VFQFN Exposed Pad
- 17-PowerVQFN
- 17-VFBGA, CSPBGA
- 18-DIP (0.300, 7.62mm)
- 18-DIP Module
- 18-PowerTFDFN
- 18-PowerWFDFN
- 18-VFBGA
- 18-VFQFN Exposed Pad
- 19-SSIP Formed Leads
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-LSSOP (0.154, 3.90mm Width)
- 20-LSSOP (0.173, 4.40mm Width)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SOIC (0.433, 11.00mm Width) Exposed Pad
- 20-TSSOP (0.173, 4.40mm Width)
- 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 20-VFSOP (0.173, 4.40mm Width)
- 20-WFQFN Exposed Pad
- 22-PowerLFDFN
- 22-PowerWFQFN
- 22-SIP, 18 Leads, Formed Leads
- 23-DIP Module
- 23-PowerDIP Module (0.551, 14.00mm)
- 23-PowerSMD Module, Gull Wing
- 23-SIP Formed Leads
- 23-SIP, 19 Leads, Formed Leads
- 24-BSOP (0.295, 7.50mm Width) Exposed Pad
- 24-LSSOP (0.154, 3.90mm Width) Exposed Pad
- 24-PowerBSOP (0.295, 7.50mm Width)
- 24-PowerDIP (0.300, 7.62mm)
- 24-PowerSMD Module (0.425, 10.80mm Width), 17 Leads
- 24-PowerTFQFN
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSIP Exposed Pad, Formed Leads
- 24-SSIP Formed Leads
- 24-SSOP (0.154, 3.90mm Width)
- 24-TFSOP (0.173, 4.40mm Width)
- 24-TSSOP (0.154, 3.90mm Width) Exposed Pad
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFBGA
- 24-WFQFN Exposed Pad
- 25-PowerVFQFN
- 25-SOP (0.213, 5.40mm Width) + 2 Heat Tabs
- 27-PowerVQFN
- 28-LCC (J-Lead)
- 28-LSSOP (0.220, 5.60mm Width)
- 28-PowerVQFN
- 28-SOIC (0.295, 7.50mm Width)
- 28-SOP (0.295, 7.50mm Width)
- 28-SOP (0.295, 7.50mm Width) + 2 Heat Tabs
- 28-SOP (0.449, 11.40mm Width), 23 Leads
- 28-VFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 29-PowerWFQFN
- 29-SSIP Module, 21 Leads, Formed Leads
- 30-PowerTFQFN
- 30-PowerVFQFN
- 30-SDMP
- 31-PowerVFQFN
- 31-PowerVQFN
- 31-PowerWFQFN
- 32-BSSOP (0.295, 7.50mm Width) Exposed Pad
- 32-PowerDIP Module, 23 Leads
- 32-PowerQFN
- 32-PowerSMD Module, 23 Leads
- 32-PowerVFQFN
- 32-PowerWFQFN
- 32-PowerWFQFN, Module
- 32-SSOP (0.295, 7.50mm Width) Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 32-WFBGA, WLBGA
- 32-WFQFN Exposed Pad
- 33-PowerDIP (1.307, 33.20mm)
- 33-PowerDIP (1.307, 33.20mm) Exposed Pad
- 34-PowerWFQFN
- 35-SSIP, 25 Leads
- 35-SSIP, 25 Leads, Formed Leads
- 35-VFBGA
- 36-BFSOP (0.295, 7.50mm Width) Exposed Pad
- 36-BSSOP (0.295, 7.50mm Width) Exposed Pad
- 36-BSSOP (0.433, 11.00mm Width) Exposed Pad
- 36-FSOP (0.295, 7.50mm Width) Exposed Pad
- 36-PowerBFSOP (0.295, 7.50mm Width)
- 36-PowerFSOP (0.295, 7.50mm Width)
- 36-PowerVQFN
- 36-PowerWFQFN
- 36-SMD Module
- 36-SOP (0.295, 7.50mm Width) + 2 Heat Tabs
- 36-VFQFN Exposed Pad
- 38-DIP Module, 24 Leads
- 38-SDIP Module, 24 Leads, Formed
- 39-PowerVFQFN
- 40-DIP (0.657, 16.70mm), 29 Leads
- 40-PowerTFQFN
- 40-PowerWFQFN Module
- 40-TFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 41-PowerTFQFN
- 44-BSSOP (0.433, 11.00mm Width) Exposed Pad
- 44-DIP Module, 37 Leads
- 44-TSSOP (0.244, 6.20mm Width) Exposed Pad
- 44-VSOP (0.295, 7.50mm Width) Exposed Pad
- 46-PowerVFQFN
- 48-LQFP
- 48-TQFP
- 48-VFQFN Exposed Pad
- 54-SOP (0.449, 11.40mm Width) Exposed Pad
- 54-SOP (0.449, 11.40mm Width), 23 Leads
- 54-SOP (0.449, 11.40mm Width), 36 Leads
- 54-VSSOP (0.295, 7.50mm Width) Exposed Pad
- 56-PowerWFQFN Module
- 56-VFQFN Exposed Pad
- 6-UFBGA, CSPBGA
- 64-LQFP
- 64-PowerQFP
- 64-TQFP Exposed Pad
- 68-VFQFN Exposed Pad
- 8-PowerVFDFN
- 8-SMD, Flat Lead
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.154, 3.90mm Width) Exposed Pad
- 8-SOIC (0.173, 4.40mm Width)
- 8-TFSOJ (0.069, 1.75mm Width)
- 8-TSSOP (0.173, 4.40mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-UFDFN Exposed Pad
- 8-VSSOP, 8-MSOP (0.118, 3.00mm Width)
- 9-SIP
- 9-SIP, 7 Leads
- 9-SMD Module
- DFN
- LQFP
- LSOP
- Module
- Multiwatt-11 (Vertical, Bent and Staggered Leads)
- Multiwatt-15 (Horizontal, Bent and Staggered Leads)
- Multiwatt-15 (Vertical, Bent and Staggered Leads)
- PowerPAK® MLP4535-22L
- PowerPAK® MLP55-31L
- QFN
- QFN EP
- SIP
- SOIC
- SSOP
- TO-220-5
- TO-220-7
- TO-263-18 (15 Leads + 3 Tabs)
- TO-263-8, D2Pak (7 Leads + Tab), TO-263CA
- TO-3-8
- TSSOP
Packaging
- Box
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Tape & Box (TB)
- Tape & Reel
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 1.2Ohm
- 1.53Ohm
- 1.5Ohm
- 100mOhm
- 145mOhm
- 160mOhm
- 1Ohm
- 300mOhm
- 340MOhm
- 3Ohm
- 500mOhm
- 50mOhm
- 600MOhm
- 60mOhm
- 6mOhm
- 740mOhm
- 800mOhm
Series
- Apex Precision Power®
- ASPM™
- ASPM™, FastSwitch™
- Automotive, AEC-Q100
- BridgeSwitch
- CoreControl™
- HiperLCS™
- Intelli-Phase™
- NexFET™
- NovalithIC™
- OMNIFET III™, VIPower™
- OMNIFET II™, VIPower™
- PowerTrench®
- PowerTrench®, SyncFET™
- PowIRstage®
- STSPIN2
- TrilithIC™
- VIPower™
- VRPower®
- XS™ DrMOS
- µIPM™
- µIPM™-DIP
Supplier Device Package
- 10-BGA (2.9x1.1)
- 10-MFPSK
- 10-SIP
- 10-SOIC
- 12-POWER SIP
- 12-PowerDip
- 12-SIP
- 14-MFPS
- 14-SOIC
- 14-SOIC / 14MFPS
- 16-DIP
- 16-FCQFN (6x3.75)
- 16-MFP
- 16-PDIP
- 16-QFN (3x3)
- 16-QFN (6x3.75)
- 16-SIP
- 16-SO
- 16-SSOP
- 16-WLCSP (1.96x1.96)
- 16MFPFS
- 17-PQFN (5x6)
- 17-WLCSP (2.41x1.91)
- 18-BGA (2.41x1.91)
- 18-FCTQFN-EP (5x5)
- 19-SIP
- 19-WLCSP (2.41x1.91)
- 20-HSOP
- 20-PLCC (9x9)
- 20-SSOP
- 20-TSSOP
- 21-SIP
- 22-SIP
- 23-DIP
- 23-SIP
- 24-EQFN-LE (4x4)
- 24-HQFN (4x4)
- 24-QFN (4x4)
- 24-SO
- 24-TSSOP
- 24-VQFN (5x5)
- 28-SO
- 29-FC-TQFN (4x6)
- 30-SDMP
- 32-QFN (5x5)
- 32-WLP (2.47x2.47)
- 34-TQFN (6x6)
- 35-SIP
- 40-PQFN (6x6)
- 40-QFN (5x5)
- 40-QFN (6x6)
- 44-DIP
- 48-SQFP (7x7)
- 56-HVQFN (8x8)
- 56-Power88™
- 64-PowerQFP
- 64-TQFP (10x10)
- 8-MSOP
- 8-SOIC
- 8-SON (2x2)
- 8-SOP
- 9-SIP, 7 Leads
- Module
- P-DSO-28
- P-TO263-15-1
- PG-DSO-8
- PG-TO263-7
- PG-TO263-7-2
- Power66
- PowerPAK® MLP39-65
- POWERPAK® MLP4535-22L
- PowerPAK® MLP55-31L
- PowerPAK® MLP66-40
- SOT-28FL/ECH8
- SOT-28FL/VEC8
- TO-3-8
Surface Mount
- NO
- YES
Terminal Finish
- BRIGHT TIN
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel (Ni)
- NICKEL PALLADIUM GOLD
- Nickel/Gold/Palladium (Ni/Au/Pd)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- Nickel/Tin (Ni/Sn)
- NOT SPECIFIED
- Pure Matte Tin (Sn)
- SILVER
- TIN
- Tin (Sn)
- TIN LEAD
- Tin/Bismuth (Sn/Bi)
- Tin/Copper (Sn/Cu)
- Tin/Copper (Sn97.5Cu2.5)
- Tin/Lead (Sn/Pb)
- Tin/Nickel (Sn/Ni)
- Tin/Nickel/Copper (Sn/Ni/Cu)
- Tin/Silver/Copper (Sn/Ag/Cu)
- TIN/TIN COPPER
Termination
- SMD/SMT
- Through Hole
Transistor Element Material
- GALLIUM NITRIDE
Type
- Integrated Circuit (IC)
Weight
- 1.053808g
- 1.31247g
- 1.930007g
- 121.33333mg
- 144mg
- 145.646mg
- 193.06667mg
- 2.174692g
- 205mg
- 224mg
- 234mg
- 368.798946mg
- 4.535924g
- 426mg
- 43mg
- 540.001716mg
- 57.09594mg
- 639.990485mg
- 700mg
- 850.995985mg
- 951.693491mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Package / Case | Interface | REACH SVHC | Height | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Number of Channels | Subcategory | Qualification Status | Supply Voltage-Max (Vsup) | Consumer IC Type | Number of Outputs | Output Current | Analog IC - Other Type | Output Current per Channel | Applications | Supply Voltage1-Nom | Output Configuration | Supply Current-Max | Voltage - Supply | Fault Protection | Supply Voltage1-Min | Supply Voltage1-Max | Voltage - Load | Load Type | Rds On (Typ) | Drive Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BA6897FP-E2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 1999 | Active | 1 (Unlimited) | 28 | 18.5mm | ROHS3 Compliant | 28-SOP (0.295, 7.50mm Width) + 2 Heat Tabs | Logic | 7.5mm | Surface Mount | -35°C~85°C TA | Bipolar | 2.41mm | 8542.39.00.01 | DUAL | GULL WING | BA6897 | 28 | 0.8mm | R-PDSO-G28 | 4.5V | Not Qualified | 9V | CONSUMER CIRCUIT | 50mA | DC Motors, General Purpose, Voltage Regulators | Half Bridge (8) | 14mA | 6V~9V | Over Temperature | 6V~9V | Inductive | ||||||||||||||||||||||||||||
 |
BD6220HFP-TR | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tape & Reel (TR) | 2014 | yes | Not For New Designs | 1 (Unlimited) | 7 | EAR99 | 9.395mm | ROHS3 Compliant | Lead Free | No | 8 | TO-263-8, D2Pak (7 Leads + Tab), TO-263CA | Logic | Surface Mount | -40°C~85°C TA | Power MOSFET | 2.005mm | 1 | 2.5mA | SINGLE | GULL WING | 12V | BD622* | 7 | R-PSSO-G7 | 6V | Motion Control Electronics | 1 | 500mA | BRUSH DC MOTOR CONTROLLER | 500mA | DC Motors, General Purpose | Half Bridge (2) | 6V~15V | Current Limiting, Over Temperature, Over Voltage, UVLO | 6V~15V | Inductive | 1.5 Ω | ||||||||||||||||||||||||
 |
BD7755RFV-E2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Surface Mount | Tape & Reel (TR) | 2010 | yes | Active | 3 (168 Hours) | 54 | 150°C | -20°C | 18.5mm | ROHS3 Compliant | VSSOP | Logic | 7.5mm | 1mm | 8542.39.00.01 | 1 | DUAL | GULL WING | NOT SPECIFIED | 12V | NOT SPECIFIED | 54 | OTHER | 0.65mm | R-PDSO-G54 | 10.8V | 9 | Not Qualified | 13.2V | 1A | 5V | Over Temperature | 4.3V | 13.2V | WINCHESTER | ||||||||||||||||||||||||||
 |
BD6222FP-E2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tape & Reel (TR) | 2005 | yes | Active | 1 (Unlimited) | 25 | SMD/SMT | EAR99 | 13.6mm | ROHS3 Compliant | Lead Free | No | 25 | 25-SOP (0.213, 5.40mm Width) + 2 Heat Tabs | Logic | No SVHC | 1.9mm | 5.4mm | Surface Mount | -40°C~85°C TA | Power MOSFET | 1 | 2.5mA | DUAL | GULL WING | 12V | BD622* | 25 | 0.8mm | 6V | Motion Control Electronics | 1 | 2A | BRUSH DC MOTOR CONTROLLER | 2A | DC Motors, General Purpose | Half Bridge (2) | 6V~15V | Current Limiting, Over Temperature, Over Voltage, UVLO | 6V~15V | Inductive | 1 Ω |
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BD6222FP-E2 datasheet pdf and PMIC - Full, Half-Bridge Drivers product details from ROHM Semiconductor stock available at HK JDW
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