Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IDT71T75802S166PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2015 | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | Non-RoHS Compliant | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | not_compliant | 2.375V | 18 Mb | 166MHz | CMOS | 1 | 265mA | e0 | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 3.5 ns | RAM, SRAM | 20b | 18 | Synchronous | 0.045A | 18b | COMMON | 2.38V | |||||||||||||||||||||||||||||
 |
IDT71V67602S166PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 166MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.34mA | 256KX36 | 36 | 9437184 bit | 0.05A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
70121L25JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | yes | Active | 1 (Unlimited) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Lead Free | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | ASYNCHRONOUS | 4.57mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | NOT SPECIFIED | 52 | COMMERCIAL | YES | SRAMs | Not Qualified | 5V | 3-STATE | 25 ns | 2.3kB | RAM, SDR, SRAM | 22b | 0.005A | COMMON | 2V | ||||||||||||||||||||||||
 |
IDT71V3577SA80BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | unknown | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e1 | TIN SILVER COPPER | BOTTOM | BALL | 3.3V | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | Not Qualified | 3.465V | RAM, SRAM | 128KX36 | 36 | 4718592 bit | 8 ns | |||||||||||||||||||||||||||||||||||||
 |
71T75602S150PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 150MHz | 14mm | 1.4mm | CMOS | 1 | 235mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 3.8 ns | 150MHz | 2.3MB | RAM, SDR, SRAM | 19b | Synchronous | 0.06A | 36b | COMMON | 2.38V | ||||||||||||||||||||||
 |
71V67603S166BQG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | 2009 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 166MHz | 13mm | 1.2mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | YES | SRAMs | 3-STATE | 3.5 ns | 166MHz | 1.1MB | RAM, SDR, SRAM | 18b | 0.34mA | 256KX36 | 0.05A | COMMON | ||||||||||||||||||||||||||
.png "IDT70824L25G") |
IDT70824L25G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 84 | EAR99 | 70°C | 0°C | 27.94mm | Non-RoHS Compliant | 84 | Parallel | not_compliant | 27.94mm | CMOS | ASYNCHRONOUS | 5.207mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | NOT SPECIFIED | 5V | NOT SPECIFIED | 84 | COMMERCIAL | NO | 2.54mm | 4.5V | Other Memory ICs | Not Qualified | 5V | 5.5V | RAM | 0.31mA | 4KX16 | 16 | 65536 bit | 5A | 25 ns | |||||||||||||||||||||||||||||||||
 |
70V25S20PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | Active | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | 200mA | 20 ns | 16kB | RAM, SDR, SRAM | 26b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||||||
 |
7130SA25J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||
 |
IDT70824L35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 14mm | Non-RoHS Compliant | LQFP | Parallel | not_compliant | 14mm | CMOS | ASYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | YES | 0.65mm | S-PQFP-G80 | 4.5V | Other Memory ICs | Not Qualified | 5V | 5.5V | RAM | 0.29mA | 4KX16 | 16 | 65536 bit | 0.0015A | 35 ns | |||||||||||||||||||||||||||||||
 |
IDT71V256SA15PZI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 28 | EAR99 | 85°C | -40°C | 1 | 11.8mm | Non-RoHS Compliant | TSSOP | Parallel | not_compliant | 8mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 240 | 3.3V | 20 | 28 | INDUSTRIAL | YES | 0.55mm | R-PDSO-G28 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.085mA | 32KX8 | 8 | 262144 bit | 0.002A | 15 ns | YES | COMMON | 3V | |||||||||||||||||||||||||||
 |
70T659S10DR | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 28mm | RoHS Compliant | Contains Lead | No | 208 | PQFP | Parallel | 2.6V | 2.4V | 4.5 Mb | 28mm | 3.5mm | CMOS | 4.1mm | 1 | 405mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 20 | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 10 ns | RAM, SRAM | 34b | Asynchronous | 0.01A | 36b | COMMON | ||||||||||||||||||||||||||
 |
71V65703S75BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | FLOW-THROUGH ARCHITECTURE | Parallel | 3.465V | 3.135V | 9 Mb | 100MHz | 13mm | 1.2mm | CMOS | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.04A | 36b | COMMON | |||||||||||||||||||||||||
 |
70V9089S12PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 512 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 240mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | RAM, SRAM | 32b | 64KX8 | Synchronous | 0.005A | 8b | COMMON | 3V | |||||||||||||||||||||
 |
7007S25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 305mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||
 |
71V016SA12BFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 48 | 85°C | -40°C | 3.3V | 1 | 7mm | RoHS Compliant | Lead Free | No | 48 | Parallel | 3.6V | 3V | 1 Mb | 7mm | 1.4mm | CMOS | 1 | 160mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 48 | INDUSTRIAL | 0.75mm | SRAMs | 3-STATE | 12 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | COMMON | 3V | |||||||||||||||||||||||||||
 |
70121S25J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | YES | SRAMs | 5V | 5V | 3-STATE | 25 ns | 2.3kB | RAM, SDR, SRAM | 22b | 0.015A | COMMON | |||||||||||||||||||||||||||
|
7143LA25G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2013 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | Parallel | 5.5V | 4.5V | 32 kb | 29.46mm | 3.68mm | CMOS | 1 | 270mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 4kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 16b | COMMON | 2V | |||||||||||||||||||||||||
 |
71V65803S150BQI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 13mm | 1.2mm | CMOS | 1 | 345mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | INDUSTRIAL | SRAMs | 3-STATE | 3.8 ns | RAM, SRAM | 19b | Synchronous | 0.06A | 18b | COMMON | ||||||||||||||||||||||||||||
 |
71321LA55PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | TQFP | Parallel | 5.5V | 4.5V | 16 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.8mm | SRAMs | 5V | 3-STATE | 55 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||
 |
IDT71V3559SA75BQGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | RoHS Compliant | 165 | Parallel | RAM, SRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA75BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.275mA | 128KX36 | 36 | 4718592 bit | 100MHz | 0.04A | 7.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
70T3339S166BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2010 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 2.5V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 166MHz | 15mm | 1.4mm | CMOS | 1 | 450mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 19b | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||
 |
70V07S35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 35 ns | 32kB | RAM, SDR, SRAM | 15b | Asynchronous | 0.006A | 8b | COMMON | 3V | ||||||||||||||||||||||
 |
70V3389S4BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 460mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||
 |
70V05L20PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 3.6V | 3V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 195mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 20 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | Asynchronous | 0.005A | 8b | COMMON | 3V | ||||||||||||||||||||||
 |
IDT6116LA25SO | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 1 | 15.4mm | Non-RoHS Compliant | SOIC | Parallel | not_compliant | 7.5mm | CMOS | 2.65mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 30 | 24 | COMMERCIAL | YES | 1.27mm | R-PDSO-G24 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 3-STATE | RAM, SRAM - Asynchronous | 0.11mA | 2KX8 | 8 | 16384 bit | 0.00002A | 25 ns | YES | COMMON | 2V | |||||||||||||||||||||||||||
 |
71V256S10YG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | 70°C | 0°C | 3.3V | 1 | RoHS Compliant | No | 28 | Parallel | 256 kb | RAM, SRAM - Asynchronous | 15b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
70V06S20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 20 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.005A | 8b | COMMON | 2V | ||||||||||||||||||||||||
 |
71V256SA12YG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 28 | EAR99 | 70°C | 0°C | 3.3V | 1 | 17.9mm | RoHS Compliant | Lead Free | No | 28 | Parallel | 3.6V | 3V | 256 kb | 7.6mm | 2.67mm | CMOS | 1 | 90mA | e3 | MATTE TIN | DUAL | J BEND | 260 | 3.3V | 28 | COMMERCIAL | SRAMs | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 0.002A | 8b | COMMON | 3V |
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IDT71T75802S166PFI Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 18 Mb kb 20mm mm 265mA mA 18b b
Price: 0.0000
RFQ -
IDT71V67602S166PF Integrated Device Technology (IDT)
2.53.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
70121L25JG8 Integrated Device Technology (IDT)
5V V 52 Pin Memory IC 18 kb kb 19mm mm
Price: 0.0000
RFQ -
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71T75602S150PFGI Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 18 Mb kb 20mm mm 235mA mA 36b b
Price: 0.0000
RFQ -
71V67603S166BQG8 Integrated Device Technology (IDT)
165 Pin Memory IC 9 Mb kb 15mm mm
Price: 0.0000
RFQ -
-
70V25S20PF8 Integrated Device Technology (IDT)
Surface Mount Memory IC 128 kb kb 14mm mm 200mA mA 16b b
Price: 0.0000
RFQ -
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70V06S20J Integrated Device Technology (IDT)
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