Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Organization | Memory Width | Memory Density | Sync/Async | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | I/O Type | Standby Voltage-Min |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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71T75802S150BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2012 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 2.5V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 150MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 235mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.8 ns | RAM, SRAM | 20b | Synchronous | 0.045A | 18b | COMMON | 2.38V | |||||||||||||||||||||||
 |
70T659S10BCI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | Parallel | 2.6V | 2.4V | 4.5 Mb | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 445mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 10 ns | RAM, SRAM | 17b | Asynchronous | 36b | COMMON | ||||||||||||||||||||||||||
 |
7006S17PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | 310mA | 17 ns | 16kB | RAM, SDR, SRAM | 26b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||
 |
71V124SA15YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 3.3V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3V | 1 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | 100mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 3-STATE | 15 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | 3V | |||||||||||||||||||||||||||
 |
71V3579S85PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Through Hole | 2005 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW THROUGH ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 8.5 ns | 87MHz | 512kB | RAM, SDR, SRAM | 18b | 0.035A | COMMON | ||||||||||||||||||||||||||
 |
70T651S12DRI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 2.5V | 2 | 28mm | RoHS Compliant | Contains Lead | No | 208 | PQFP | Parallel | 2.6V | 2.4V | 9 Mb | 28mm | 3.5mm | CMOS | 4.1mm | 1 | 395mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 2.5V | 20 | 208 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 12 ns | 1.1MB | RAM, SDR, SRAM | 18b | Asynchronous | 36b | COMMON | ||||||||||||||||||||||||
 |
71V016SA10BFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 48 | 70°C | 0°C | 3.3V | 1 | 7mm | RoHS Compliant | Lead Free | No | 48 | Parallel | 3.6V | 3.15V | 1 Mb | 7mm | 1.4mm | CMOS | 1 | 160mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 48 | COMMERCIAL | 0.75mm | SRAMs | 3-STATE | 10 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | COMMON | |||||||||||||||||||||||||||
 |
70V3599S133BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1.7mm | 1 | 400mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 34b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||
 |
70V3579S4BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2008 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OUTPUT MODE, SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 30b | Synchronous | 36b | COMMON | |||||||||||||||||||||||||
 |
70V26S55J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | EAR99 | 70°C | 0°C | 3.3V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 3.6V | 3V | 256 kb | 29.21mm | 3.63mm | 140mA | 84 | 55 ns | 32kB | RAM, SDR, SRAM | 28b | Asynchronous | 16b | |||||||||||||||||||||||||||||||||||||||||
 |
IDT71T75702S85BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.225mA | 512KX36 | 36 | 18874368 bit | 90MHz | 0.04A | 8.5 ns | COMMON | 2.38V | |||||||||||||||||||||||||
 |
7006L25PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 220mA | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | 64 | COMMERCIAL | 0.8mm | 25 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 8b | |||||||||||||||||||||||||||
 |
7140LA25JI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | Active | 85°C | -40°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 19mm | 3.63mm | 220mA | 25 ns | 1kB | RAM, SDR, SRAM | 20b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||
.png "7130LA55L48B") |
7130LA55L48B | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Bulk | 2013 | Active | 125°C | -55°C | 5V | 2 | 14.2mm | RoHS Compliant | Contains Lead | No | 48 | BQFN | Parallel | 8 kb | 14.22mm | 1.78mm | RAM, SRAM | 20b | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V124SA10YG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2013 | yes | Active | 3 (168 Hours) | 32 | 70°C | 0°C | 3.3V | 1 | 20.9mm | RoHS Compliant | Lead Free | No | 32 | Parallel | 3.6V | 3.15V | 1 Mb | 10.2mm | 2.2mm | CMOS | 3.683mm | 1 | 145mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 32 | COMMERCIAL | SRAMs | 3-STATE | 10 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 17b | Asynchronous | 8b | COMMON | |||||||||||||||||||||||||||
 |
71V016SA10YG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | yes | Active | 3 (168 Hours) | 44 | 70°C | 0°C | 3.3V | 1 | 28.6mm | RoHS Compliant | Lead Free | No | 44 | Parallel | 3.6V | 3.15V | 1 Mb | 10.2mm | 2.9mm | CMOS | 3.683mm | 1 | 160mA | e3 | Matte Tin (Sn) - annealed | DUAL | J BEND | 260 | 3.3V | 30 | 44 | COMMERCIAL | SRAMs | 3-STATE | 10 ns | 128kB | RAM, SDR, SRAM - Asynchronous | 16b | Asynchronous | 16b | COMMON | |||||||||||||||||||||||||||
 |
6116LA25TPG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2013 | yes | Active | 1 (Unlimited) | 24 | EAR99 | 70°C | 0°C | 5V | 1 | 31.75mm | RoHS Compliant | Lead Free | No | 24 | PDIP | Parallel | 5.5V | 4.5V | 16 kb | 7.62mm | 3.3mm | CMOS | 1 | 95mA | e3 | MATTE TIN | DUAL | 260 | 5V | 24 | COMMERCIAL | 2.54mm | SRAMs | 5V | 3-STATE | 25 ns | 2kB | RAM, SDR, SRAM - Asynchronous | 11b | 2KX8 | Asynchronous | 0.00003A | 8b | COMMON | 2V | ||||||||||||||||||||||
 |
IDT71V2576YS150PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | 150MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.295mA | 128KX36 | 36 | 4718592 bit | 0.03A | 3.8 ns | COMMON | 3.14V | |||||||||||||||||||||||||
 |
IDT71V546S133PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | no | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.3mA | 128KX36 | 36 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||
 |
IDT71V3557SA85BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | RoHS Compliant | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | unknown | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.235mA | 128KX36 | 36 | 4718592 bit | 90MHz | 0.045A | 8.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
IDT71T75602S200BGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 119 | 3A991.B.2.A | 85°C | -40°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 200MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 119 | INDUSTRIAL | YES | 1.27mm | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 512KX36 | 36 | 18874368 bit | 3.2 ns | COMMON | 2.38V | |||||||||||||||||||||||||||
 |
IDT71V35761YSA200BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | not_compliant | 200MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.36mA | 128KX36 | 36 | 4718592 bit | 0.03A | 3.1 ns | COMMON | 3.14V | ||||||||||||||||||||||||||
 |
70261L25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | 265mA | 25 ns | 32kB | RAM, SDR, SRAM | 28b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||
 |
71V321L35PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 3.6V | 3V | 16 kb | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 64 | INDUSTRIAL | YES | 35 ns | 2kB | RAM, SDR, SRAM | 22b | ||||||||||||||||||||||||||||||||
 |
IDT71V65802S150BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 150MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.325mA | 512KX18 | 18 | 9437184 bit | 0.04A | 3.8 ns | COMMON | |||||||||||||||||||||||||||
 |
IDT71T75602S200BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2010 | 3 (168 Hours) | 119 | 3A991.B.2.A | 70°C | 0°C | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | BGA | Parallel | not_compliant | 200MHz | 14mm | CMOS | SYNCHRONOUS | 2.36mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 119 | COMMERCIAL | YES | 1.27mm | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.275mA | 512KX36 | 36 | 18874368 bit | 0.04A | 3.2 ns | COMMON | 2.38V | |||||||||||||||||||||||||
 |
IDT71V416S10Y8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 44 | 3A991.B.2.A | 70°C | 0°C | 1 | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 3.3V | 44 | COMMERCIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.2mA | 256KX16 | 16 | 4194304 bit | 0.02A | 10 ns | YES | COMMON | 3V | ||||||||||||||||||||||||||||
 |
IDT71V67603S133PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | Non-RoHS Compliant | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | not_compliant | 3.135V | 9 Mb | 133MHz | CMOS | 1 | 280mA | e0 | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 4.2 ns | RAM, SRAM | 18b | 256KX36 | 36 | Synchronous | 0.07A | 36b | COMMON | ||||||||||||||||||||||||||||
 |
IDT71T75802S133PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.215mA | 1MX18 | 18 | 18874368 bit | 0.045A | 4.2 ns | COMMON | 2.38V | ||||||||||||||||||||||||
 |
70V3399S133PRFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 128 | 85°C | -40°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | TQFP | Parallel | 3.45V | 3.15V | 2.3 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 480mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 18b | COMMON |
-
71T75802S150BGI8 Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 18 Mb kb 14mm mm 235mA mA 18b b
Price: 0.0000
RFQ -
70T659S10BCI8 Integrated Device Technology (IDT)
Surface Mount 256 Pin Memory IC 4.5 Mb kb 17mm mm 445mA mA 36b b
Price: 0.0000
RFQ -
7006S17PF Integrated Device Technology (IDT)
Surface Mount Memory IC 128 kb kb 14mm mm 310mA mA 8b b
Price: 0.0000
RFQ -
71V124SA15YG8 Integrated Device Technology (IDT)
Surface Mount 32 Pin Memory IC 1 Mb kb 20.9mm mm 100mA mA 8b b
Price: 0.0000
RFQ -
71V3579S85PFGI Integrated Device Technology (IDT)
Through Hole 100 Pin Memory IC 4.5 Mb kb 20mm mm
Price: 0.0000
RFQ -
70T651S12DRI Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 9 Mb kb 28mm mm 395mA mA 36b b
Price: 0.0000
RFQ -
71V016SA10BFG8 Integrated Device Technology (IDT)
Surface Mount 48 Pin Memory IC 1 Mb kb 7mm mm 160mA mA 16b b
Price: 0.0000
RFQ -
70V3599S133BF8 Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 4.5 Mb kb 15mm mm 400mA mA 36b b
Price: 0.0000
RFQ -
70V3579S4BF8 Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 1.1 Mb kb 15mm mm 460mA mA 36b b
Price: 0.0000
RFQ -
70V26S55J Integrated Device Technology (IDT)
Surface Mount 84 Pin Memory IC 256 kb kb 29.21mm mm 140mA mA 16b b
Price: 0.0000
RFQ -
IDT71T75702S85BG8 Integrated Device Technology (IDT)
2.5V V 119 Pin Memory IC 22mm mm
Price: 0.0000
RFQ -
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Surface Mount 64 Pin Memory IC 128 kb kb 14mm mm 220mA mA 8b b
Price: 0.0000
RFQ -
7140LA25JI Integrated Device Technology (IDT)
Surface Mount Memory IC 8 kb kb 19mm mm 220mA mA 8b b
Price: 0.0000
RFQ -
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71V124SA10YG8 Integrated Device Technology (IDT)
Surface Mount 32 Pin Memory IC 1 Mb kb 20.9mm mm 145mA mA 8b b
Price: 0.0000
RFQ -
71V016SA10YG Integrated Device Technology (IDT)
Surface Mount 44 Pin Memory IC 1 Mb kb 28.6mm mm 160mA mA 16b b
Price: 0.0000
RFQ -
6116LA25TPG Integrated Device Technology (IDT)
5V V Through Hole 24 Pin Memory IC 16 kb kb 31.75mm mm 95mA mA 8b b
Price: 0.0000
RFQ -
IDT71V2576YS150PFG8 Integrated Device Technology (IDT)
2.53.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
IDT71V546S133PF8 Integrated Device Technology (IDT)
3.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
IDT71V3557SA85BGGI Integrated Device Technology (IDT)
3.3V V 119 Pin Memory IC 22mm mm
Price: 0.0000
RFQ -
IDT71T75602S200BGI8 Integrated Device Technology (IDT)
2.5V V 119 Pin Memory IC 22mm mm
Price: 0.0000
RFQ -
IDT71V35761YSA200BQ Integrated Device Technology (IDT)
3.3V V 165 Pin Memory IC 15mm mm
Price: 0.0000
RFQ -
70261L25PF Integrated Device Technology (IDT)
Surface Mount Memory IC 256 kb kb 14mm mm 265mA mA 16b b
Price: 0.0000
RFQ -
71V321L35PFGI8 Integrated Device Technology (IDT)
64 Pin Memory IC 16 kb kb 14mm mm
Price: 0.0000
RFQ -
IDT71V65802S150BG Integrated Device Technology (IDT)
3.3V V 119 Pin Memory IC 22mm mm
Price: 0.0000
RFQ -
IDT71T75602S200BG8 Integrated Device Technology (IDT)
2.5V V 119 Pin Memory IC 22mm mm
Price: 0.0000
RFQ -
IDT71V416S10Y8 Integrated Device Technology (IDT)
3.3V V 44 Pin Memory IC 28.575mm mm
Price: 0.0000
RFQ -
IDT71V67603S133PFI Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 9 Mb kb 20mm mm 280mA mA 36b b
Price: 0.0000
RFQ -
IDT71T75802S133PFI8 Integrated Device Technology (IDT)
2.5V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
70V3399S133PRFI8 Integrated Device Technology (IDT)
Surface Mount 128 Pin Memory IC 2.3 Mb kb 20mm mm 480mA mA 18b b
Price: 0.0000
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