Items : %s%s
Microcontrollers
Connector Type
- IDC
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Gold
- Gold, Tin
- Lead, Tin
- Tin
Core Size
- 16-Bit
- 16-Bit Dual-Core
- 16/32-Bit
- 32-Bit
- 32-Bit 10-Core
- 32-Bit 12-Core
- 32-Bit 16-Core
- 32-Bit 24-Core
- 32-Bit 32-Core
- 32-Bit 6-Core
- 32-Bit 8-Core
- 32-Bit Dual-Core
- 32-Bit Quad-Core
- 32-Bit Single-Core
- 32-Bit Tri-Core
- 4-Bit
- 8-Bit
- 8/16-Bit
ECCN Code
- 3A001.A.2.A
- 3A001.A.3
- 3A991.A.2
- 3A991.A.3
- 5A992
- 5A992.C
- 5A992C
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 27 Weeks
- 28 Weeks
- 29 Weeks
- 3 Weeks
- 30 Weeks
- 32 Weeks
- 4 Weeks
- 5 Weeks
- 56 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e4
- e8
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 18 hours ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- LIFEBUY (Last Updated: 4 days ago)
- LIFEBUY (Last Updated: 5 days ago)
- NRND (Last Updated: 1 week ago)
- NRND (Last Updated: 2 days ago)
- NRND (Last Updated: 4 days ago)
- NRND (Last Updated: 5 days ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 1 week ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 3 months ago)
- PRODUCTION (Last Updated: 3 weeks ago)
Manufacturer Package Identifier
- 100A (REV C)
- 32M1-A
- 40P6 (REV B)
- 44J – PLCC
- 44J-B
- 51-85079 *F
- 5B_ME
- 64A
- 8S2
- AT89C51CC02CA-RATUM
- ATMEGA1284P-AU
- ATMEGA32U4-AU
- ATMEGA644V-10PU
- LQFP144-1A
- PIC16(L)F1826/27
- UFBGA132-A0G8
- UFBGA176+25-A0E7
- UFQFPN28-A0B0
- UFQFPN48-A0B9_ME
- YA_ME
Max Operating Temperature
- 105°C
- 125°C
- 70°C
- 85°C
Min Operating Temperature
- -40°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 2 (1 Year)
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4 (72 Hours)
- 6 (Time on Label)
- Not Applicable
Mount
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Surface Mount, Wettable Flank
- Through Hole
Number of Pins
- 10
- 100
- 112
- 113
- 12
- 121
- 124
- 128
- 132
- 14
- 144
- 15
- 16
- 169
- 176
- 179
- 18
- 2
- 20
- 201
- 208
- 216
- 217
- 24
- 256
- 28
- 30
- 32
- 36
- 38
- 40
- 44
- 45
- 48
- 49
- 516
- 52
- 56
- 6
- 63
- 64
- 65
- 68
- 72
- 8
- 80
- 81
- 84
Number of Terminations
- 10
- 100
- 112
- 113
- 121
- 124
- 128
- 132
- 14
- 143
- 144
- 15
- 16
- 160
- 169
- 176
- 179
- 18
- 196
- 20
- 201
- 208
- 216
- 217
- 24
- 256
- 28
- 292
- 30
- 32
- 35
- 36
- 38
- 40
- 44
- 45
- 48
- 49
- 516
- 52
- 56
- 6
- 63
- 64
- 68
- 72
- 8
- 80
- 81
- 84
Operating Temperature
- -10°C~85°C TA
- -20°C~85°C TA
- -30°C~85°C TA
- -40°C~105°C TA
- -40°C~105°C TJ
- -40°C~125°C
- -40°C~125°C TA
- -40°C~125°C TJ
- -40°C~150°C TA
- -40°C~80°C TA
- -40°C~85°C
- -40°C~85°C TA
- -55°C~125°C TA
- 0°C~70°C TA
- 0°C~95°C TJ
Package / Case
- 10-VFDFN Exposed Pad
- 100-BQFP
- 100-LBGA
- 100-LFBGA
- 100-LQFP
- 100-LQFP Exposed Pad
- 100-TFBGA
- 100-TQFP
- 100-TQFP Exposed Pad
- 100-UFBGA
- 100-VFBGA
- 112-LFBGA
- 113-VFBGA
- 121-LFBGA
- 121-TFBGA
- 124-VFTLA Dual Rows, Exposed Pad
- 128-LQFP
- 128-TQFP
- 132-UFBGA
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 14-TSSOP (0.173, 4.40mm Width)
- 144-BQFP
- 144-LBGA
- 144-LFBGA
- 144-LQFP
- 144-LQFP Exposed Pad
- 144-TFBGA
- 144-TQFP
- 144-TQFP Exposed Pad
- 144-UFBGA
- 16-SOIC (0.154, 3.90mm Width)
- 16-TSSOP (0.173, 4.40mm Width)
- 16-UQFN Exposed Pad
- 16-VQFN Exposed Pad
- 169-UFBGA
- 176-LFBGA
- 176-LQFP
- 176-LQFP Exposed Pad
- 18-DIP (0.300, 7.62mm)
- 18-SOIC (0.295, 7.50mm Width)
- 196-LBGA
- 20-DIP (0.300, 7.62mm)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-UFQFN Exposed Pad
- 20-VFQFN Exposed Pad
- 20-VQFN Exposed Pad
- 20-WFQFN Exposed Pad
- 201-UFBGA
- 208-BFQFP
- 208-LQFP
- 216-TFBGA
- 24-UFQFN Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 256-LBGA
- 28-DIP (0.300, 7.62mm)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-SOIC (0.295, 7.50mm Width)
- 28-SSOP (0.209, 5.30mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-UFQFN
- 28-UFQFN Exposed Pad
- 28-UQFN Exposed Pad
- 28-VFQFN Exposed Pad
- 28-VQFN Exposed Pad
- 292-LFBGA
- 30-LSSOP (0.240, 6.10mm Width)
- 32-LQFP
- 32-TQFP
- 32-UFQFN Exposed Pad
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 32-WFQFN Exposed Pad
- 36-VFQFN Exposed Pad
- 36-VFTLA Exposed Pad
- 38-TFSOP (0.173, 4.40mm Width)
- 38-TSSOP (0.240, 6.10mm Width)
- 40-DIP (0.600, 15.24mm)
- 40-UFQFN Exposed Pad
- 40-VFQFN Exposed Pad
- 40-WFQFN Exposed Pad
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 44-TQFP
- 44-VFQFN Exposed Pad
- 44-VFTLA Exposed Pad
- 44-VQFN Exposed Pad
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-TQFP
- 48-TQFP Exposed Pad
- 48-UFQFN Exposed Pad
- 48-VFQFN Exposed Pad
- 49-UFBGA, WLCSP
- 49-VFBGA
- 52-LCC (J-Lead)
- 52-QFP
- 56-UFQFN Exposed Pad
- 64-LQFP
- 64-LQFP Exposed Pad
- 64-QFP
- 64-TFBGA
- 64-TQFP
- 64-TQFP Exposed Pad
- 64-UFBGA
- 64-UFBGA, WLCSP
- 64-VFQFN Exposed Pad
- 68-LCC (J-Lead)
- 68-VFQFN Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- 8-VDFN Exposed Pad
- 8-VFDFN Exposed Pad
- 80-BQFP
- 80-LQFP
- 80-QFP
- 80-TQFP
- 80-VFBGA
- 84-LCC (J-Lead)
- LQFP
- SOT-23-6
- TQFP
Packaging
- Bulk
- Cut Tape (CT)
- Digi-Reel®
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- no
- yes
Published
- 1995
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
- 2018
Resistance
- 128Ohm
Series
- 56F8xxx
- 80C
- 87C
- 89C
- 89LP
- AURIX™
- Automotive, AEC-Q100, AVR® ATmega
- Automotive, AEC-Q100, AVR® ATtiny
- Automotive, AEC-Q100, C2000™ C28x Piccolo™
- Automotive, AEC-Q100, dsPIC™ 33EP
- Automotive, AEC-Q100, dsPIC™ 33EV
- Automotive, AEC-Q100, dsPIC™ 33F
- Automotive, AEC-Q100, Hercules™ TMS570 ARM® Cortex®-R
- Automotive, AEC-Q100, PIC® 24EP
- Automotive, AEC-Q100, PIC® 24H
- Automotive, AEC-Q100, PIC® 32MX
- Automotive, AEC-Q100, PIC® 32MZ
- AVR® ATmega
- AVR® ATtiny
- C16xx
- C2000™ C28x Delfino™
- C2000™ C28x Piccolo™
- dsPIC™ 30F
- dsPIC™ 33EP
- dsPIC™ 33EV
- dsPIC™ 33F
- Gecko
- HCS12
- Kinetis K10
- Kinetis K20
- Kinetis K60
- Kinetis KL1
- Kinetis KV
- Leopard Gecko
- M16C™ M16C/60/62P
- MAXQ®
- megaAVR® 0
- MicroConverter® ADuC7xxx
- MicroConverter® ADuC8xx
- MPC57xx
- MSP430F2xx
- MSP430F5xx
- MSP430F6xx
- MSP430G2xx
- MSP430x1xx
- MSP430x4xx
- MSP430™ FRAM
- PIC® 10F
- PIC® 12C
- PIC® 12F
- PIC® 16C
- PIC® 16F
- PIC® 17C
- PIC® 18C
- PIC® 18F
- PIC® 18J
- PIC® 24EP
- PIC® 24F
- PIC® 24H
- PIC® 32MM
- PIC® 32MX
- PIC® 32MZ
- PIC® XLP™ 16F
- PIC® XLP™ 18J
- PIC® XLP™ 18K
- PIC® XLP™ 18Q
- PIC® XLP™ 24F
- PIC® XLP™ mTouch™ 16F
- PSOC® 3 CY8C32xx
- PSOC® 3 CY8C34xx
- PSOC® 3 CY8C36xx
- PSOC® 3 CY8C38xx
- PSOC®1 CY8C21xxx
- PSOC®1 CY8C24xxx
- RL78/G13
- RX600
- S08
- S12 MagniV
- S32K
- SAM D20J
- SAM E70
- SAM L11
- SAM S70
- SAM3S
- SAM4L
- SAM4S
- STM32F0
- STM32F1
- STM32F2
- STM32F3
- STM32F4
- STM32F7
- STM32H7
- STM32L0
- STM32L1
- STM32L4
- STM8L EnergyLite
- STM8S
- Tiny Gecko
- tinyAVR™ 1
- Tiva™ C
- Wonder Gecko
- XC16x
- XC8xx
- XE16x
- XMC1000
- XMC4000
- XS1
- Zero Gecko
Supplier Device Package
- 100-TFBGA (9x9)
- 100-TQFP (14x14)
- 14-PDIP
- 14-SOIC
- 144-LQFP (20x20)
- 16-QFN (4x4)
- 18-SOIC
- 20-QFN (4x4)
- 20-SSOP
- 20-TSSOP
- 28-DIP
- 28-PDIP
- 28-QFN (6x6)
- 28-QFN-S (6x6)
- 28-SOIC
- 28-SPDIP
- 28-SSOP
- 32-QFN (5x5)
- 32-VQFN (5x5)
- 40-PDIP
- 44-PLCC (16.59x16.59)
- 44-PLCC (16.6x16.6)
- 44-QFN (8x8)
- 44-TQFP (10x10)
- 44-TSSOP
- 48-LQFP (7x7)
- 48-QFN (7x7)
- 64-QFN (9x9)
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 8-MSOP
- 80-TQFP (12x12)
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Gold (Ni/Au)
- Nickel/Palladium/Gold (Ni/Pd/Au)
- Nickel/Palladium/Gold/Silver (Ni/Pd/Au/Ag)
- TIN
- Tin (Sn)
- TIN COPPER
- TIN LEAD
- TIN SILVER COPPER
- Tin/Copper/Silver (Sn/Cu/Ag)
- Tin/Lead (Sn/Pb)
- Tin/Silver (Sn/Ag)
- Tin/Silver/Copper (Sn/Ag/Cu)
- Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
- Tin/Silver/Copper - with Nickel barrier
- Tin/Silver/Copper/Nickel (Sn/Ag/Cu/Ni)
Termination
- SMD/SMT
- Through Hole
Weight
- 1.290414g
- 1.319103g
- 1.620005g
- 1.896186g
- 103.986051mg
- 117.310327mg
- 117.508773mg
- 123.008581mg
- 138.005479mg
- 139.989945mg
- 140.30179mg
- 150.507618mg
- 181.692094mg
- 188.609377mg
- 190.990737mg
- 191.387631mg
- 2.214806g
- 2.26799g
- 203.804722mg
- 206.29948mg
- 22.679619g
- 227.391525mg
- 249.10726mg
- 274.706879mg
- 337.812918mg
- 338.011364mg
- 342.689036mg
- 360.605934mg
- 37.393021mg
- 4.190003g
- 4.535924g
- 43.204673mg
- 45.387587mg
- 456.087128mg
- 46.011276mg
- 465.697616mg
- 500.709277mg
- 503.487531mg
- 510.007921mg
- 53.693997mg
- 540.001716mg
- 57.09594mg
- 57.209338mg
- 60.186038mg
- 600.301152mg
- 639.990485mg
- 657.000198mg
- 665.986997mg
- 677.610302mg
- 69.994973mg
- 70.788759mg
- 71.809342mg
- 72.206235mg
- 72.801575mg
- 730.794007mg
- 76.997305mg
- 773.99868mg
- 800.987426mg
- 810.002575mg
- 9.071791g
- 9.071847g
- 925.810377mg
- 928.191737mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Length | RoHS Status | Additional Feature | Package / Case | Reach Compliance Code | Width | Mounting Type | Operating Temperature | Technology | Height Seated (Max) | HTS Code | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Speed | Oscillator Type | Screening Level | Core Processor | RAM Size | Number of I/O | Address Bus Width | Supply Current-Max | Boundary Scan | Low Power Mode | External Data Bus Width | Format | Barrel Shifter | uPs/uCs/Peripheral ICs Type | Peripherals | Clock Frequency | RAM (words) | Number of External Interrupts | Bit Size | Has ADC | DMA Channels | PWM Channels | DAC Channels | ROM Programmability | On Chip Data RAM Width | Voltage - Supply (Vcc/Vdd) | Number of Timers | ROM (words) | RAM (bytes) | On Chip Program ROM Width | CPU Family | Internal Bus Architecture | EEPROM Size | Program Memory Type | Connectivity | Core Size | Program Memory Size | Data Converter |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
MKW35Z512VHT4 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-QFN | 7mm | Surface Mount | QUAD | NO LEAD | 260 | 3V | 40 | YES | 0.5mm | 1.71V | 3.6V | 48 MHz | 25 | MICROCONTROLLER, RISC | 32MHz | 32 | YES | YES | YES | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LPC1830FBD144K | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | 2006 | LPC18xx | Active | 3 (168 Hours) | 144 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~85°C TA | CMOS | 1.6mm | QUAD | GULL WING | NOT SPECIFIED | NOT SPECIFIED | LPC1830 | 144 | YES | 0.5mm | S-PQFP-G144 | Microcontrollers | Not Qualified | 2.5/3.3V | 180MHz | Internal | ARM® Cortex®-M3 | 200K x 8 | 83 | 24 | 32 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, POR, PWM, WDT | 32 | YES | YES | YES | YES | FLASH | 2.2V~3.6V | CORTEX-M3 | ROMless | CANbus, EBI/EMI, Ethernet, I2C, IrDA, Microwire, SD, SPI, SSI, SSP, UART/USART, USB, USB OTG | 32-Bit | A/D 8x10b; D/A 1x10b | |||||||||||||||||||||||||||||
 |
MC9S12DP256BMPV | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1998 | HCS12 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 112-LQFP | Surface Mount | -40°C~125°C TA | MC9S12DP256 | 25MHz | Internal | 12K x 8 | 91 | PWM, WDT | 2.35V~5.25V | 4K x 8 | FLASH | CANbus, I2C, SCI, SPI | 16-Bit | 256KB 256K x 8 | A/D 16x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SPC5742PK1AMMM8 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | MPC57xx | Active | 3 (168 Hours) | ROHS3 Compliant | 257-LFBGA | Surface Mount | -40°C~125°C TA | 180MHz | Internal | e200z4 | 192K x 8 | DMA, LVD, POR, WDT | 3.15V~5.5V | FLASH | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | A/D 64x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MKE18F512VLH16 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2016 | Kinetis KE1xF | Active | 3 (168 Hours) | ROHS3 Compliant | 64-LQFP | Surface Mount | -40°C~105°C TA | 64-LQFP (10x10) | 168MHz | Internal | ARM® Cortex®-M4F | 64K x 8 | 58 | DMA, LVD, PWM, WDT | 2.7V~5.5V | 68K x 8 | FLASH | CANbus, FlexIO, I2C, SPI, UART/USART | 32-Bit | 512KB 512K x 8 | A/D 16x12b; D/A 1x12b | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MKL27Z256VMP4 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 13 Weeks | Tray | 2002 | Kinetis KL2 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | 5mm | ROHS3 Compliant | DIFFERENTIAL ANALOG CHANNEL INPUTS: 2-CH 16-BIT | 64-LFBGA | 5mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 40 | YES | 0.5mm | S-PBGA-B64 | 1.71V | 3.6V | 48MHz | Internal | ARM® Cortex®-M0+ | 32K x 8 | 50 | MICROCONTROLLER, RISC | DMA, I2S, LVD, POR, PWM, WDT | 48MHz | 32 | YES | YES | YES | YES | 1.71V~3.6V | FLASH | I2C, SPI, UART/USART, USB | 32-Bit | 256KB 256K x 8 | A/D 16x16b; D/A 1x12b | ||||||||||||||||||||||||||||||
 |
MC908GZ60VFJE | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | HC08 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 32-LQFP | Surface Mount | -40°C~105°C TA | CMOS | MC908GZ60 | 8MHz | Internal | 2K x 8 | 21 | MICROCONTROLLER | LVD, POR, PWM | 3V~5.5V | FLASH | CANbus, SCI, SPI | 8-Bit | 60KB 60K x 8 | A/D 24x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S9KEAZN8AMTG | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | Tube | 2013 | Kinetis KEA | Active | 3 (168 Hours) | 24 | 3A991.A.2 | 4mm | ROHS3 Compliant | 16-TSSOP (0.173, 4.40mm Width) | 4mm | Surface Mount | -40°C~125°C TA | CMOS | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | NO LEAD | 260 | 3V | 40 | YES | 0.5mm | R-XQCC-N24 | 2.7V | 5.5V | 48MHz | Internal | ARM® Cortex®-M0+ | 1K x 8 | 14 | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 24MHz | 32 | YES | NO | YES | YES | 2.7V~5.5V | FLASH | I2C, LINbus, SPI, UART/USART | 32-Bit | 8KB 8K x 8 | A/D 12x12b | |||||||||||||||||||||||||||||||
 |
S9KEAZN8AVFK | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | Tray | Kinetis KEA | Active | 3 (168 Hours) | 24 | 4mm | ROHS3 Compliant | 24-VFQFN Exposed Pad | 4mm | Surface Mount | -40°C~105°C TA | CMOS | 0.92mm | QUAD | NO LEAD | 3V | YES | 0.5mm | S-XQCC-N24 | 2.7V | 5.5V | 48MHz | Internal | ARM® Cortex®-M0+ | 1K x 8 | 22 | YES | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 24MHz | 1024 | 1 | 32 | YES | NO | YES | YES | 8 | 2.7V~5.5V | 4 | 8192 | 1024 | 8 | FLASH | I2C, LINbus, SPI, UART/USART | 32-Bit | 8KB 8K x 8 | A/D 12x12b | |||||||||||||||||||||||||||||
.png "P60D080MX1G/9C021J") |
P60D080MX1G/9C021J | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MC9S12XDT512VAL | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | HCS12X | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 112-LQFP | Surface Mount | -40°C~105°C TA | 9S12XDT512 | 80MHz | External | 20K x 8 | 91 | LVD, POR, PWM, WDT | 2.35V~5.5V | 4K x 8 | FLASH | CANbus, EBI/EMI, I2C, IrDA, LINbus, SCI, SPI | 16-Bit | 512KB 512K x 8 | A/D 16x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
SPC5604SF2VLQ6R | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tape & Reel (TR) | 2008 | MPC56xx Qorivva | Active | 3 (168 Hours) | 144 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | QUAD | GULL WING | 5V | SPC5604 | YES | 0.5mm | S-PQFP-G144 | 4.5V | Microcontrollers | Not Qualified | 3.3/5V | 5.5V | 64MHz | Internal | AEC-Q100 | e200z0h | 48K x 8 | 105 | 180mA | MICROCONTROLLER | DMA, LCD, POR, PWM, WDT | 16MHz | 32 | YES | YES | YES | 3V~5.5V | 524288 | 64K x 8 | FLASH | CANbus, I2C, LINbus, QSPI, SCI, SPI | 32-Bit | 512KB 512K x 8 | A/D 16x10b | |||||||||||||||||||||||||||||
|
FS32K142HRT0MLHT | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | S32K | Active | 3 (168 Hours) | 64 | 10mm | ROHS3 Compliant | 64-LQFP | 10mm | Surface Mount | -40°C~125°C TA | QUAD | GULL WING | 260 | 5V | 40 | YES | 0.5mm | 2.7V | 5.5V | 80MHz | Internal | ARM® Cortex®-M4F | 32K x 8 | 89 | MICROCONTROLLER, RISC | POR, PWM, WDT | 40MHz | 32 | YES | YES | YES | 2.7V~5.5V | 4K x 8 | FLASH | CANbus, FlexIO, I2C, LINbus, SPI, UART/USART | 32-Bit | 256KB 256K x 8 | A/D 16x12b SAR; D/A1x8b | |||||||||||||||||||||||||||||||||||||||
 |
MC56F8357MPYE | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | 1998 | 56F8xxx | Active | 3 (168 Hours) | 160 | 3A991.A.2 | 24mm | ROHS3 Compliant | ALSO REQUIRES 3.3V SUPPLY | 160-LQFP | 24mm | Surface Mount | -40°C~125°C TA | CMOS | 1.6mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 2.5V | 40 | MC56F8357 | YES | 0.5mm | S-PQFP-G160 | 2.25V | Microcontrollers | Not Qualified | 2.53.3V | 2.75V | 60MHz | External | 56800E | 10K x 16 | 76 | 24 | YES | YES | 16 | FIXED POINT | YES | DIGITAL SIGNAL PROCESSOR, OTHER | POR, PWM, Temp Sensor, WDT | 120MHz | 16 | 2.25V~3.6V | 262144 | MULTIPLE | FLASH | CANbus, EBI/EMI, SCI, SPI | 16-Bit | 256KB 128K x 16 | A/D 16x12b | |||||||||||||||||||||
 |
MKE06Z128VQH4 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 20 Weeks | Tray | 2002 | Kinetis KE06 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | 14mm | ROHS3 Compliant | 64-QFP | 14mm | Surface Mount | -40°C~105°C TA | CMOS | 2.45mm | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 3V | 40 | YES | 0.8mm | S-PQFP-G64 | 2.7V | 5.5V | 48MHz | Internal | ARM® Cortex®-M0+ | 16K x 8 | 58 | MICROCONTROLLER, RISC | LVD, PWM, WDT | 24MHz | 32 | YES | NO | YES | NO | 2.7V~5.5V | 131072 | 16384 | 8 | FLASH | CANbus, I2C, SPI, UART/USART | 32-Bit | 128KB 128K x 8 | A/D 16x12b; D/A 2x6b | |||||||||||||||||||||||||||
 |
MCF53011CQT240 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2010 | MCF5301x | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 208-LQFP | Surface Mount | -40°C~85°C TA | MCF53011 | 240MHz | Internal | Coldfire V3 | 128K x 8 | 61 | DMA, PWM, WDT | 1.08V~3.6V | ROMless | EBI/EMI, Ethernet, I2C, Memory Card, SPI, SSI, UART/USART, USB OTG | 32-Bit | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S912XEP100AVAG | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tray | 1996 | HCS12X | Active | 3 (168 Hours) | 144 | 20mm | ROHS3 Compliant | 144-LQFP | 20mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | QUAD | GULL WING | 1.8V | YES | 0.5mm | S-PQFP-G144 | 1.72V | Microcontrollers | Not Qualified | 3.3/5V | 1.98V | 50MHz | External | AEC-Q100 | 64K x 8 | 119 | 23 | 100mA | 16 | MICROCONTROLLER, RISC | LVD, POR, PWM, WDT | 40MHz | 16 | YES | YES | YES | 1.72V~5.5V | 1048576 | 65536 | CPU12 | 4K x 8 | FLASH | CANbus, EBI/EMI, I2C, IrDA, SCI, SPI | 16-Bit | 1MB 1M x 8 | A/D 24x12b | |||||||||||||||||||||||||||
|
MK20DX128VLH7 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tray | 2002 | Kinetis K20 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | 10mm | ROHS3 Compliant | 64-LQFP | 10mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | e3 | MATTE TIN | QUAD | GULL WING | 260 | 3.3V | 40 | MK20DX128 | YES | 0.5mm | S-PQFP-G64 | 1.71V | Microcontrollers | Not Qualified | 1.8/3.3V | 3.6V | 72MHz | Internal | ARM® Cortex®-M4 | 32K x 8 | 40 | MICROCONTROLLER | DMA, I2S, LVD, POR, PWM, WDT | 50MHz | 32 | YES | YES | YES | YES | 1.71V~3.6V | 131072 | CORTEX-M4 | 2K x 8 | FLASH | CANbus, EBI/EMI, I2C, IrDA, SPI, UART/USART, USB, USB OTG | 32-Bit | 128KB 128K x 8 | A/D 24x16b; D/A 1x12b | |||||||||||||||||||||||
|
SP5742PFK1AMLQ9R | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tape & Reel (TR) | MPC57xx | Active | 3 (168 Hours) | ROHS3 Compliant | 144-LQFP | Surface Mount | -40°C~125°C TA | 200MHz | Internal | e200z4 | 192K x 8 | DMA, LVD, POR, WDT | 3.15V~5.5V | FLASH | CANbus, Ethernet, FlexRay, LINbus, SPI, UART/USART | 32-Bit Dual-Core | 1.5MB 1.5M x 8 | A/D 64x12b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S9S12G128ACLL | NXP USA Inc. | 3.8034 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | HCS12 | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | 25MHz | Internal | 12V1 | 8K x 8 | 86 | LVD, POR, PWM, WDT | 3.13V~5.5V | 4K x 8 | FLASH | CANbus, IrDA, LINbus, SCI, SPI | 16-Bit | 128KB 128K x 8 | A/D 12x10b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S9S12G240F0VLF | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | 2008 | HCS12 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-LQFP | 7mm | Surface Mount | -40°C~105°C TA | CMOS | 8542.31.00.01 | QUAD | GULL WING | 5V | YES | 0.5mm | S-PQFP-G48 | 3.13V | Microcontrollers | Not Qualified | 3.3/5V | 5.5V | 25MHz | Internal | AEC-Q100 | 12V1 | 11K x 8 | 40 | 23.5mA | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | 16 | YES | NO | YES | 3.13V~5.5V | 245760 | 11264 | CPU12 | 4K x 8 | FLASH | CANbus, IrDA, LINbus, SCI, SPI | 16-Bit | 240KB 240K x 8 | A/D 16x10b | |||||||||||||||||||||||||||
 |
MCHC11F1CFNE2 | NXP USA Inc. | 247.6659 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 1993 | HC11 | Not For New Designs | 3 (168 Hours) | 68 | EAR99 | 24.23mm | ROHS3 Compliant | 68-LCC (J-Lead) | 24.23mm | Surface Mount | -40°C~85°C TA | CMOS | 8542.31.00.01 | e3 | Matte Tin (Sn) | QUAD | J BEND | 250 | 5V | 30 | MCHC11 | YES | 1.27mm | S-PQCC-J68 | 4.75V | Not Qualified | 5.25V | 2MHz | Internal | 1K x 8 | 30 | 16 | 8 | MICROCONTROLLER | POR, WDT | 16MHz | 8 | YES | NO | NO | NO | EEPROM | 4.75V~5.25V | 512 x 8 | ROMless | SCI, SPI | 8-Bit | A/D 8x8b | ||||||||||||||||||||||||||
 |
LPC845M301JHI33E | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | 2010 | LPC84x | Active | 3 (168 Hours) | ROHS3 Compliant | 32-VFQFN Exposed Pad | Surface Mount | -40°C~105°C TA | 30MHz | Internal/External | ARM® Cortex®-M0+ | 16K x 8 | 29 | Brown-out Detect/Reset, Cap Sense, DMA, POR, PWM, WDT | 1.8V~3.6V | FLASH | I2C, SPI, UART/USART | 32-Bit | 64KB 64K x 8 | A/D 12x12b; D/A 1x10b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S9S12GNA32F0MLF | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | 2008 | HCS12 | Active | 3 (168 Hours) | 48 | 7mm | ROHS3 Compliant | 48-LQFP | 7mm | Surface Mount | -40°C~150°C TA | CMOS | 8542.31.00.01 | QUAD | GULL WING | 5V | YES | 0.5mm | S-PQFP-G48 | 3.13V | Microcontrollers | Not Qualified | 3.3/5V | 5.5V | 25MHz | Internal | AEC-Q100 | 12V1 | 1K x 8 | 40 | 17mA | MICROCONTROLLER | LVD, POR, PWM, WDT | 16MHz | 16 | YES | NO | YES | 3.13V~5.5V | 32768 | 2048 | CPU12 | 512 x 8 | FLASH | IrDA, LINbus, SCI, SPI | 16-Bit | 16KB 16K x 8 | A/D 8x12b | ||||||||||||||||||||||||||||
|
MKL17Z128VMP4R | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tape & Reel (TR) | 2011 | Kinetis KL1 | Active | 3 (168 Hours) | 64 | 3A991.A.2 | 5mm | ROHS3 Compliant | 64-LFBGA | 5mm | Surface Mount | -40°C~105°C TA | CMOS | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3V | 40 | YES | 0.5mm | S-PBGA-B64 | 1.71V | 3.6V | 48MHz | Internal | ARM® Cortex®-M0+ | 32K x 8 | 54 | MICROCONTROLLER, RISC | Brown-out Detect/Reset, DMA, I2S, LVD, POR, PWM, WDT | 48MHz | 32 | YES | YES | YES | YES | 1.71V~3.6V | FLASH | I2C, LINbus, SPI, UART/USART | 32-Bit | 128KB 128K x 8 | A/D 20x16b; D/A 1x12b | |||||||||||||||||||||||||||||||
|
MC9S08RE32CFJE | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2014 | S08 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-LQFP | unknown | Surface Mount | -40°C~85°C TA | CMOS | 8542.31.00.01 | MC9S08RE32 | 8MHz | Internal | 2K x 8 | 25 | MICROCONTROLLER | LVD, POR, PWM, WDT | 1.8V~3.6V | FLASH | SCI | 8-Bit | 32KB 32K x 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||
|
P60D041PX36/9D08AJ | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
P5CC081XS/S1ALZ42J | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MC9S08GT8AMFDE | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2006 | S08 | Active | 3 (168 Hours) | 48 | EAR99 | 7mm | ROHS3 Compliant | 48-VFQFN Exposed Pad | 7mm | Surface Mount | -40°C~125°C TA | CMOS | 1mm | 8542.31.00.01 | QUAD | NO LEAD | 260 | 3V | 40 | MC9S08GT8 | YES | 0.5mm | S-XQCC-N48 | 1.8V | Microcontrollers | Not Qualified | 1.8/3.6V | 3.6V | 40MHz | Internal | 1K x 8 | 39 | 7mA | MICROCONTROLLER | LVD, POR, PWM, WDT | 40MHz | 16 | YES | NO | YES | NO | 1.8V~3.6V | 8192 | FLASH | I2C, SCI, SPI | 8-Bit | 8KB 8K x 8 | A/D 8x10b | ||||||||||||||||||||||||||
|
SPC5745BK1AVMH2 | NXP USA Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | MPC57xx | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LBGA | Surface Mount | -40°C~105°C TA | 120MHz | Internal | e200z4 | 256K x 8 | 65 | DMA, LVD, POR, WDT | 3.15V~5.5V | 64K x 8 | FLASH | CANbus, Ethernet, I2C, LINbus, SAI, SPI, USB, USB OTG | 32-Bit | 2MB 2M x 8 | A/D 36x10b, 16x12b |
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-
LPC1830FBD144K NXP USA Inc.
ROMless ARM® Cortex®-M3 32-Bit Microcontroller LPC18xx Series LPC1830 144-LQFP
Price: 0.0000
RFQ -
MC9S12DP256BMPV NXP USA Inc.
256KB 256K x 8 FLASH 16-Bit Microcontroller HCS12 Series MC9S12DP256 112-LQFP
Price: 0.0000
RFQ -
SPC5742PK1AMMM8 NXP USA Inc.
1.5MB 1.5M x 8 FLASH e200z4 32-Bit Dual-Core Microcontroller MPC57xx Series 257-LFBGA
Price: 0.0000
RFQ -
MKE18F512VLH16 NXP USA Inc.
512KB 512K x 8 FLASH ARM® Cortex®-M4F 32-Bit Microcontroller Kinetis KE1xF Series 64-LQFP
Price: 0.0000
RFQ -
MKL27Z256VMP4 NXP USA Inc.
256KB 256K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KL2 Series 3.3V 64-LFBGA
Price: 0.0000
RFQ -
MC908GZ60VFJE NXP USA Inc.
60KB 60K x 8 FLASH 8-Bit Microcontroller HC08 Series MC908GZ60 32-LQFP
Price: 0.0000
RFQ -
S9KEAZN8AMTG NXP USA Inc.
8KB 8K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KEA Series 3V 16-TSSOP (0.173, 4.40mm Width)
Price: 0.0000
RFQ -
S9KEAZN8AVFK NXP USA Inc.
8KB 8K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KEA Series 3V 24-VFQFN Exposed Pad
Price: 0.0000
RFQ -
-
MC9S12XDT512VAL NXP USA Inc.
512KB 512K x 8 FLASH 16-Bit Microcontroller HCS12X Series 9S12XDT512 112-LQFP
Price: 0.0000
RFQ -
SPC5604SF2VLQ6R NXP USA Inc.
512KB 512K x 8 FLASH e200z0h 32-Bit Microcontroller MPC56xx Qorivva Series SPC5604 5V 144-LQFP
Price: 0.0000
RFQ -
FS32K142HRT0MLHT NXP USA Inc.
256KB 256K x 8 FLASH ARM® Cortex®-M4F 32-Bit Microcontroller S32K Series 5V 64-LQFP
Price: 0.0000
RFQ -
MC56F8357MPYE NXP USA Inc.
256KB 128K x 16 FLASH 56800E 16-Bit Microcontroller 56F8xxx Series MC56F8357 2.5V 160-LQFP
Price: 0.0000
RFQ -
MKE06Z128VQH4 NXP USA Inc.
128KB 128K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KE06 Series 3V 64-QFP
Price: 0.0000
RFQ -
MCF53011CQT240 NXP USA Inc.
ROMless Coldfire V3 32-Bit Microcontroller MCF5301x Series MCF53011 208-LQFP
Price: 0.0000
RFQ -
S912XEP100AVAG NXP USA Inc.
1MB 1M x 8 FLASH 16-Bit Microcontroller HCS12X Series 1.8V 144-LQFP
Price: 0.0000
RFQ -
MK20DX128VLH7 NXP USA Inc.
128KB 128K x 8 FLASH ARM® Cortex®-M4 32-Bit Microcontroller Kinetis K20 Series MK20DX128 3.3V 64-LQFP
Price: 0.0000
RFQ -
SP5742PFK1AMLQ9R NXP USA Inc.
1.5MB 1.5M x 8 FLASH e200z4 32-Bit Dual-Core Microcontroller MPC57xx Series 144-LQFP
Price: 0.0000
RFQ -
S9S12G128ACLL NXP USA Inc.
128KB 128K x 8 FLASH 12V1 16-Bit Microcontroller HCS12 Series 100-LQFP
Price: 3.8034
RFQ -
S9S12G240F0VLF NXP USA Inc.
240KB 240K x 8 FLASH 12V1 16-Bit Microcontroller HCS12 Series 5V 48-LQFP
Price: 0.0000
RFQ -
MCHC11F1CFNE2 NXP USA Inc.
ROMless 8-Bit Microcontroller HC11 Series MCHC11 5V 68-LCC (J-Lead)
Price: 247.6659
RFQ -
LPC845M301JHI33E NXP USA Inc.
64KB 64K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller LPC84x Series 32-VFQFN Exposed Pad
Price: 0.0000
RFQ -
S9S12GNA32F0MLF NXP USA Inc.
16KB 16K x 8 FLASH 12V1 16-Bit Microcontroller HCS12 Series 5V 48-LQFP
Price: 0.0000
RFQ -
MKL17Z128VMP4R NXP USA Inc.
128KB 128K x 8 FLASH ARM® Cortex®-M0+ 32-Bit Microcontroller Kinetis KL1 Series 3V 64-LFBGA
Price: 0.0000
RFQ -
MC9S08RE32CFJE NXP USA Inc.
32KB 32K x 8 FLASH 8-Bit Microcontroller S08 Series MC9S08RE32 32-LQFP
Price: 0.0000
RFQ -
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-
MC9S08GT8AMFDE NXP USA Inc.
8KB 8K x 8 FLASH 8-Bit Microcontroller S08 Series MC9S08GT8 3V 48-VFQFN Exposed Pad
Price: 0.0000
RFQ -
SPC5745BK1AVMH2 NXP USA Inc.
2MB 2M x 8 FLASH e200z4 32-Bit Microcontroller MPC57xx Series 100-LBGA
Price: 0.0000
RFQ
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