Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | Reverse Pinout | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MT46H64M32LFBQ-48 IT:C | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | 2015 | yes | Active | 3 (168 Hours) | 90 | EAR99 | 1 | 13mm | ROHS3 Compliant | AUTO/SELF REFRESH | 90-VFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.36 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | 90 | YES | 0.8mm | R-PBGA-B90 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 2Gb 64M x 32 | Volatile | 0.09mA | 1.7V~1.95V | 64MX32 | 32 | 2147483648 bit | 208MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 14.4ns | 24816 | 24816 | |||||||||||||||||||||||||||||||||||||||||||
 |
AT27C512R-70PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 28-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | EPROM - OTP | AT27C512 | 28-PDIP | 70ns | 512Kb 64K x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C04C-SSHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 3 (168 Hours) | 8 | 4.92mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | No SVHC | 4 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 3mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 40 | AT24C04 | 1.27mm | 1.7V | 5.5V | 550ns | 4Kb 512 x 8 | Non-Volatile | 1.7V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR256A08BCMA35R | Everspin Technologies Inc. | 6.6047 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tape & Reel (TR) | 2011 | Active | 3 (168 Hours) | 48 | EAR99 | 8mm | ROHS3 Compliant | 48 | 48-LFBGA | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | ASYNCHRONOUS | 1.35mm | 8542.32.00.71 | 1 | BOTTOM | 260 | 3.3V | 40 | 48 | YES | 0.75mm | 3V | Not Qualified | 3.3V | 3.6V | 256Kb 32K x 8 | Non-Volatile | 0.065mA | 3V~3.6V | 32KX8 | 8 | 262144 bit | 8b | 0.007A | 35 ns | RAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q32FVDAIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3589S133DR | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 208-BFQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V3589 | 208-PQFP (28x28) | 4.2ns | 2Mb 64K x 36 | Volatile | 3.15V~3.45V | 133MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V3389S4BF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 16b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F1T208ECHBBJ4-3R:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 132-VBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 1.125Tb 144G x 8 | Non-Volatile | 2.5V~3.6V | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC014H-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2008 | yes | Active | 2 (1 Year) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | No SVHC | 1 kb | 950μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 4.5V | 40 | 24LC014H | 8 | 0.65mm | 400ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V27L20PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 230mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | 64kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.006A | 16b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
7054L35PRF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2001 | no | Active | 3 (168 Hours) | 128 | EAR99 | 70°C | 0°C | 5V | 4 | 20mm | RoHS Compliant | Contains Lead | No | 128 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 5V | 128 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 35 ns | RAM, SRAM | 12b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA166BQG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE | FBGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 13mm | 1.2mm | CMOS | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | RAM, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
93AA66BX-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2003 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 4 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 2mA | e3 | DUAL | 260 | 2.5V | 40 | 93AA66B | 8 | 1.27mm | 2/5V | 5.5V | 250 ns | 4Kb 256 x 16 | Non-Volatile | 1.8V~5.5V | 256X16 | 16 | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||
 |
70V9199L9PF8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Synchronous | IDT70V9199 | 9ns | 1.125Mb 128K x 9 | Volatile | 3V~3.6V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
AT93C46DN-SH-B | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Surface Mount | Tube | 1997 | yes | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | Lead Free | Gold, Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | No SVHC | 1 kb | 1.75mm | 3.99mm | Surface Mount | -40°C~85°C TA | CMOS | C04-057-SN | 1 | 500μA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 40 | AT93C46 | 1.27mm | 2/5V | 5.5V | 1Kb 128 x 8 64 x 16 | Non-Volatile | 1.8V~5.5V | 64X16 | 2MHz | 0.000001A | 100 | 1000000 Write/Erase Cycles | SOFTWARE | 5ms | MICROWIRE | NO | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||
 |
71016S15PHG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | IDT71016 | 1Mb 64K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W97AH6KBVX2E | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 134 | 1 | 11.5mm | ROHS3 Compliant | 134 | SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | 134-VFBGA | 10mm | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR2 | SYNCHRONOUS | 1mm | 1 | BOTTOM | 1.2V | YES | 0.65mm | 1.14V | 1.3V | 1Gb 64M x 16 | Volatile | 1.14V~1.95V | 64MX16 | 16 | 1073741824 bit | 400MHz | MULTI BANK PAGE BURST | DRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25R2035FM1IL0 | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | 2017 | Active | 8 | 4.9mm | RoHS Compliant | IT IS ALSO CONFIGURED AS 2M X 1 | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 1.65V | 3.6V | 2Mb 256K x 8 | Non-Volatile | 1.65V~3.6V | 512KX4 | 4 | 2097152 bit | SERIAL | 33MHz | 2 | 3V | FLASH | SPI | 100μs, 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V9099L6PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 3.6V | 3V | 1 Mb | 100MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 280mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 34b | Synchronous | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S85BQI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Tray | Active | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 165-CABGA (13x15) | 8.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 87MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25Q64CSJG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~105°C TA | FLASH - NOR | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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S25FL129P0XNFI013M | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | FL-P | Obsolete | 1 (Unlimited) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8-WSON (6x8) | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 5μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71T75602S166PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 166MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.245mA | 512KX36 | 36 | 18874368 bit | 0.04A | 3.5 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||
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7008L20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2010 | no | Active | 1 (Unlimited) | 84 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 512 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 285mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 64kB | RAM, SDR, SRAM | 32b | 64KX8 | Asynchronous | 0.005A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT29F3T08EUHBBM4-3RES:B TR") |
MT29F3T08EUHBBM4-3RES:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 0°C~70°C TA | FLASH - NAND | 3Tb 384G x 8 | Non-Volatile | 2.5V~3.6V | 333MHz | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA100BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
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709159L6PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2009 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 52.6MHz | 14mm | 1.4mm | 430mA | 6 ns | 9kB | RAM, SDR, SRAM | 26b | Synchronous | 9b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V416L10BE | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2013 | no | Active | 4 (72 Hours) | 48 | 70°C | 0°C | 3.3V | 1 | 9mm | RoHS Compliant | Contains Lead | No | 48 | TFBGA | Parallel | 3.6V | 3V | 4 Mb | 9mm | 1.2mm | CMOS | 1 | 180mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 48 | COMMERCIAL | 0.75mm | SRAMs | 3-STATE | 10 ns | 512kB | RAM, SDR, SRAM - Asynchronous | 18b | Asynchronous | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
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70V7339S133BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2010 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 9 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | 645mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 25 ns | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.03A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28GU01GAAA2EGC-0SIT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tube | Automotive, AEC-Q100 | yes | Obsolete | 1 (Unlimited) | 64 | 10mm | ROHS3 Compliant | 64-TBGA | 8mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | YES | 1mm | R-PBGA-B64 | 1.7V | 2V | 96ns | 1Gb 64M x 16 | Non-Volatile | 1.7V~2V | 64MX16 | 16 | 1073741824 bit | 133MHz | 1.8V | FLASH | Parallel |
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AT24C04C-SSHM-T Microchip Technology
Surface Mount Memory IC AT24C04 4 kb kb 4.92mm mm 3mA mA
Price: 0.0000
RFQ -
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70V3389S4BF8 Integrated Device Technology (IDT)
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AT93C46DN-SH-B Microchip Technology
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Price: 0.0000
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70V9099L6PF8 Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 1 Mb kb 14mm mm 280mA mA 8b b
Price: 0.0000
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IDT71T75602S166PF8 Integrated Device Technology (IDT)
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MT28GU01GAAA2EGC-0SIT Micron Technology Inc.
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