Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Max Junction Temperature (Tj) | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
7130LA20TF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7130 | 8Kb 1K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL01GS10FHI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2015 | GL-S | Active | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | No | 64 | 64-LBGA | 1 Gb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.4mm | 8542.32.00.51 | 1 | 60mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3V | 40 | 1mm | 2.7V | 3/3.3V | 3.6V | 100ns | 1Gb 64M x 16 | Non-Volatile | 26b | 2.7V~3.6V | 16 | Asynchronous | 0.0001A | 16b | 3V | YES | YES | YES | 1K | 32B | YES | YES | FLASH | Parallel | 60ns | 64K | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1383D-133AXCT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2000 | yes | Obsolete | 3 (168 Hours) | 100 | 3.3V | 2 | ROHS3 Compliant | Lead Free | No | 100 | FLOW-THROUGH ARCHITECTURE | 100-LQFP | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1.6mm | 1 | 210mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 260 | 3.3V | 20 | CY7C1383 | 0.65mm | 3.135V | 3.6V | 3-STATE | 6.5ns | 18Mb 1M x 18 | Volatile | 20b | 3.135V~3.6V | 1MX18 | 18 | Synchronous | 133MHz | 0.07A | 18b | COMMON | 3.14V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT53D384M32D2DS-053 AAT ES:C | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 200-WFBGA | Surface Mount | -40°C~105°C TA | SDRAM - Mobile LPDDR4 | 12Gb 384M x 32 | Volatile | 1.1V | 1866MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "CG8090AA") |
CG8090AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC46CT-E/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | Serial | 1 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.1mm | 1 | 2mA | e3 | DUAL | 260 | 3V | 40 | 93LC46C | 8 | 0.65mm | 2.5V | 3/5V | 5.5V | 200 ns | 1Kb 128 x 8 64 x 16 | Non-Volatile | 2.5V~5.5V | 64X16 | 16 | 3MHz | 0.000005A | 8 | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 6ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25H040F-2CE2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Cut Tape (CT) | 2013 | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | 8 | ALSO OPERATES AT 2.5V WITH 5MHZ AND SEATED HT-CALCULATED | 8-SOIC (0.173, 4.40mm Width) | Unknown | 4.4mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.71mm | 1 | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | 4.5V | Not Qualified | 3/5V | 5.5V | 4Kb 512 x 8 | Non-Volatile | 0.004mA | 2.5V~5.5V | 8 | 4096 bit | SERIAL | 10MHz | 0.00001A | 100 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 4ms | SPI | EEPROM | SPI | 4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M27C2001-55C1 | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | 32 | EAR99 | 5V | 13.995mm | ROHS3 Compliant | Contains Lead | 32 | 32-LCC (J-Lead) | 55GHz | 11.4554mm | Surface Mount | 0°C~70°C TA | EPROM - OTP | ASYNCHRONOUS | 3.56mm | 1 | e3 | Matte Tin (Sn) | QUAD | NOT SPECIFIED | 5V | NOT SPECIFIED | M27C2001 | 32 | YES | 1.27mm | OTP ROMs | Not Qualified | 5V | 3-STATE | 55ns | 2Mb 256K x 8 | Non-Volatile | 0.03mA | 4.5V~5.5V | 256KX8 | 8 | 2097152 bit | 0.0001A | COMMON | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BQ4010YMA-200 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | no | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 37.72mm | ROHS3 Compliant | Contains Lead | Tin | No | 28 | 28-DIP Module (0.61, 15.49mm) | 64 kb | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 50mA | 9.53mm | 8542.32.00.41 | 1 | 50mA | DUAL | 5V | BQ4010 | 2.54mm | SRAMs | 5V | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | 8KX8 | 8 | 8b | 0.004A | 200 ns | 8b | NVSRAM | Parallel | 200ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S29GL128S90TFI010 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tray | 2012 | GL-S | Active | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.5mm | ROHS3 Compliant | Lead Free | Tin | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | No SVHC | 128 Mb | 1.05mm | 14.1mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8542.32.00.51 | 1 | 60mA | e3 | DUAL | 260 | 3V | 0.5mm | 2.7V | 3/3.3V | 3.6V | 90ns | 128Mb 8M x 16 | Non-Volatile | 23b | 2.7V~3.6V | 16MX8 | Asynchronous | 16b | 0.0001A | 16b | 3V | YES | YES | YES | 128 | 32B | YES | YES | FLASH | Parallel | 60ns | 64K | BOTTOM/TOP | ||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F4G16ABAEAH4-IT:E TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 9 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 63-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | MT29F4G16 | 4Gb 256M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C010-12JA | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tube | 2016 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~125°C TC | AT28C010 | 120ns | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC8M16A2P-6A:L | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Surface Mount | Bulk | 2003 | Active | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 22.22mm | ROHS3 Compliant | Lead Free | Tin | No | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 128 Mb | 1.2mm | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | 1 | 165mA | e3 | DUAL | 260 | 3.3V | 30 | MT48LC8M16A2 | 54 | 0.8mm | 3V | 3.6V | 70°C | 3-STATE | 85°C | 5.4ns | 128Mb 8M x 16 | Volatile | 14b | 3V~3.6V | 8MX16 | 16b | 167MHz | 0.0025A | COMMON | 4096 | DRAM | Parallel | 12ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7140LA35CB | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Tube | Active | 1 (Unlimited) | Non-RoHS Compliant | 48-DIP (0.600, 15.24mm) | Through Hole | -55°C~125°C TA | SRAM - Dual Port, Asynchronous | IDT7140 | 8Kb 1K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F32G08CBACAWP-Z:C TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA01/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 22 Weeks | Surface Mount | Tube | 1996 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 1 kb | 3.9mm | Surface Mount | 0°C~70°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 24AA01 | 8 | 1.27mm | 2/5V | 5.5V | OPEN-DRAIN | 3500ns | 1Kb 128 x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.00003A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 10ms | I2C | 1010XXXR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M28W160CB100N6T TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | M28W160 | 48-TSOP | 100ns | 16Mb 1M x 16 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BQ4010YMA-85 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | no | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 37.72mm | ROHS3 Compliant | Contains Lead | Tin | No | 28 | 28-DIP Module (0.61, 15.49mm) | 64 kb | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 50mA | 9.53mm | 8542.32.00.41 | 1 | 50mA | DUAL | 5V | BQ4010 | 2.54mm | SRAMs | 5V | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | 8KX8 | 8 | 8b | 0.004A | 85 ns | 8b | NVSRAM | Parallel | 85ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
BQ4010YMA-70N | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | no | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 37.72mm | ROHS3 Compliant | Contains Lead | No | 28 | 28-DIP Module (0.61, 15.49mm) | 64 kb | Through Hole | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | 50mA | 9.53mm | 8542.32.00.41 | 1 | 50mA | DUAL | 5V | BQ4010 | 2.54mm | SRAMs | 5V | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | 8KX8 | 8 | 8b | 0.004A | 70 ns | 8b | NVSRAM | Parallel | 70ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416YS10PHI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | IDT71V416 | 44-TSOP II | 10ns | 4Mb 256K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39VF1681-70-4C-EKE | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tray | 2000 | SST39 MPF™ | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | 3.3V | 12.2mm | ROHS3 Compliant | Lead Free | No | 48 | BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | No SVHC | 16 Mb | 5MHz | 1.05mm | 18.5mm | Surface Mount | 0°C~70°C TA | CMOS | 18mA | 8542.32.00.51 | 1 | 18mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST39VF1681 | 48 | YES | 0.5mm | 2.7V | 3.6V | 70ns | 16Mb 2M x 8 | Non-Volatile | 21b | 2.7V~3.6V | 2MX8 | Asynchronous | 8b | 0.00002A | 8b | 2.7V | YES | YES | YES | 512 | YES | YES | FLASH | Parallel | 10μs | 4K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||
 |
M25P128-VMF6P | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2008 | yes | Obsolete | 3 (168 Hours) | 16 | 3A991.B.1.A | 3.3V | 10.3mm | ROHS3 Compliant | Lead Free | No | 16 | MORE THAN 10000 ERASE/PROGRAM CYCLES MORE THAN 20-YEAR DATA RETENTION | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 128 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.65mm | 8542.32.00.51 | 1 | 8mA | DUAL | 260 | 3V | 30 | M25P128 | 16 | 1.27mm | 2.7V | 3.6V | 8 ns | 128Mb 16M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 50MHz | 0.0001A | 8b | 20 | 10000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 15ms, 7ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC080D-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 8 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 25LC080D | 8 | 1.27mm | 100 ns | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25Q40CSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V37L20PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG | TQFP | Parallel | 3.6V | 3V | 576 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 20 ns | 72kB | RAM, SDR, SRAM | 15b | Asynchronous | 0.003A | 18b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC66BT-I/OT15KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 5 | 2.9mm | SOT-23-6 | compliant | 1.55mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.45mm | 1 | DUAL | 5V | 93LC66B | YES | 0.95mm | R-PDSO-G5 | 2.5V | 5.5V | 4Kb 256 x 16 | Non-Volatile | 2.5V~5.5V | 256X16 | 16 | 4096 bit | SERIAL | 2MHz | 6ms | MICROWIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BR24L01AFVT-WE2 | ROHM Semiconductor | 2.6400 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Copper, Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 1 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.25mm | 1 | e2 | TIN COPPER | DUAL | 260 | 2.5V | 10 | BR24L01A | 8 | 0.65mm | 3.5 μs | 1Kb 128 x 8 | Non-Volatile | 0.002mA | 1.8V~5.5V | 8 | 400kHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W25X40VSNIG T&R | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH | 8-SOIC | 4Mb 512K x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
34LC02-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tube | 2011 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 2 kb | 1.5mm | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 34LC02 | 8 | 1.27mm | 2.2V | Not Qualified | 400ns | 2Kb 256 x 8 | Non-Volatile | 2.2V~5.5V | 1MHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT45DB161E-UUF2B-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 22 Weeks | Surface Mount | Tape & Reel (TR) | 1997 | yes | Active | 1 (Unlimited) | 11 | 3.265mm | ROHS3 Compliant | 11 | 11-UFBGA, WLCSP | SPI, Serial | 128 Mb | 2.085mm | Surface Mount | -40°C~85°C TC | CMOS | SYNCHRONOUS | 0.52mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | NOT SPECIFIED | NOT SPECIFIED | 2.3V | 3.6V | 7 ns | 16Mb 512Bytes x 4096 pages | Non-Volatile | 2.3V~3.6V | 16MX1 | 1 | 85MHz | 2.7V | 512B | FLASH | SPI | 8μs, 4ms |
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34LC02-E/SN Microchip Technology
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RFQ
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