Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IDT71V432S8PFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | 100 | TQFP | Parallel | 3.63V | 3.135V | 1 Mb | CMOS | 1 | e3 | MATTE TIN | QUAD | GULL WING | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 100 | COMMERCIAL | 0.65mm | Not Qualified | 3-STATE | 8 ns | RAM, SRAM | 15b | 32KX32 | 32 | Synchronous | 32b | YES | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70261L20PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 315mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.01A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||
 |
IDT70824L25PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 80-LQFP | Surface Mount | -40°C~85°C TA | SARAM | IDT70824 | 80-TQFP (14x14) | 25ns | 64Kb 4K x 16 | Volatile | 4.5V~5.5V | RAM | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H8M16LFBF-5:K TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2012 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 60-VFBGA | Surface Mount | 0°C~70°C TA | SDRAM - Mobile LPDDR | MT46H8M16 | 5ns | 128Mb 8M x 16 | Volatile | 1.7V~1.95V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q80BWSNIG | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2012 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 8542.32.00.51 | 1 | DUAL | 1.8V | 8 | YES | 1.27mm | R-PDSO-G8 | 1.65V | Not Qualified | 1.8V | 1.95V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 1.65V~1.95V | 8MX1 | 1 | 8388608 bit | 80MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI | 800μs | |||||||||||||||||||||||||||||||||||||||||||||||
 |
FM22LD16-55-BGTR | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | F-RAM™ | Active | 3 (168 Hours) | 48 | EAR99 | 3.3V | 8mm | ROHS3 Compliant | 48 | 48-TFBGA | 4 Mb | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | ASYNCHRONOUS | 1.2mm | 8542.32.00.71 | 1 | 12mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | NOT SPECIFIED | FM22LD16 | 48 | 0.75mm | 2.7V | SRAMs | Not Qualified | 3.6V | 4Mb 256K x 16 | Non-Volatile | 2.7V~3.6V | 256KX16 | 16 | 16b | 0.00015A | 55 ns | 16b | FRAM | Parallel | 110ns | |||||||||||||||||||||||||||||||||||||||||||||
 |
70V261L25PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2001 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 140mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Asynchronous | 0.003A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||
 |
71V3557S80BG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 95MHz | 22mm | 2.15mm | CMOS | 250mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 119 | COMMERCIAL | SRAMs | 3-STATE | 8 ns | RAM, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7025L17J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 1 (Unlimited) | 84 | EAR99 | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 29.21mm | 3.63mm | CMOS | 4.57mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 84 | COMMERCIAL | SRAMs | 5V | 3-STATE | 17 ns | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||
 |
709269L9PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | Active | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 40MHz | 14mm | 1.4mm | 350mA | 9 ns | 32kB | RAM, SDR, SRAM | 28b | Synchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70T3519S133BC8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 2.5V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 2.6V | 2.4V | 9 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 370mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 15 ns | RAM, SRAM | 36b | Synchronous | 0.015A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
71V3559S85BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | FLOW-THROUGH ARCHITECHTURE | Parallel | 3.465V | 3.135V | 4.5 Mb | 91MHz | 13mm | 1.2mm | CMOS | 1 | 225mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 8.5 ns | RAM, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65903S80PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | FLOW-THROUGH | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 95MHz | 1.4mm | 14mm | 1.4mm | 657.000198mg | CMOS | 250mA | 1 | 250mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 8 ns | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 18b | |||||||||||||||||||||||||||||||||||||||||||||||
 |
W25X40CLUXIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-UFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577SA75BQGI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 165-TBGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 7.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49BV002NT-90JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | FLASH | AT49BV002 | 32-PLCC (13.97x11.43) | 90ns | 2Mb 256K x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F32G08ABAAAWP-ITZ:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NAND | MT29F32G08 | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3389S6PRF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 128 | 70°C | 0°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | TQFP | Parallel | 3.45V | 3.15V | 1.1 Mb | 83.3MHz | 14mm | 1.4mm | CMOS | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 6 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||
 |
7024L15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 260mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 15 ns | 8kB | RAM, SDR, SRAM | 24b | 4KX16 | Asynchronous | 0.0015A | 16b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||
 |
IS42S16160D-6BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | yes | Obsolete | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 13mm | RoHS Compliant | No | 54 | AUTO/SELF REFRESH | 54-TFBGA | 256 Mb | Surface Mount | -40°C~85°C TA | SDRAM | 1.2mm | 1 | 180mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 40 | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 256Mb 16M x 16 | Volatile | 15b | 3V~3.6V | 16MX16 | 16 | 16b | 166MHz | 0.003A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | |||||||||||||||||||||||||||||||||||||||||||||
.png "N25Q064A13ESED0F TR") |
N25Q064A13ESED0F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 64Mb 16M x 4 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI | 8ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F64G08CBEFBL94C3WC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | Vendor Undefined | ROHS3 Compliant | Die | Surface Mount | 0°C~70°C TA | FLASH - NAND (MLC) | 64Gb 8G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W631GG6KB-12 | Winbond Electronics | 3.2229 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2016 | Obsolete | 3 (168 Hours) | 96 | EAR99 | 1.5V | 1 | 13mm | ROHS3 Compliant | 96 | AUTO/SELF REFRESH | 96-TFBGA | 1 Gb | Surface Mount | 0°C~85°C TC | SDRAM - DDR3 | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | 280mA | BOTTOM | NOT SPECIFIED | 1.5V | NOT SPECIFIED | 96 | 0.8mm | 1.425V | Not Qualified | 1.575V | 3-STATE | 20ns | 1Gb 64M x 16 | Volatile | 13b | 1.425V~1.575V | 64MX16 | 16 | 16b | 800MHz | 0.014A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||
 |
RC28F640P33B85A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2007 | StrataFlash™ | Obsolete | 3 (168 Hours) | 85°C | -40°C | Non-RoHS Compliant | 64 | 64-TBGA | Parallel, Serial | 3.6V | 2.3V | 64 Mb | Surface Mount | -40°C~85°C TC | FLASH - NOR | 28mA | 28F640P33 | 64-EasyBGA (8x10) | 85ns | 64Mb 4M x 16 | Non-Volatile | 22b | 2.3V~3.6V | Asynchronous | 52MHz | 16b | FLASH | Parallel | 85ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS42VS16100C1-10TLI-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 2 (1 Year) | 85°C | -40°C | RoHS Compliant | 50 | 50-TSOP (0.400, 10.16mm Width) | Parallel | 1.9V | 1.7V | 100MHz | Surface Mount | -40°C~85°C TA | SDRAM | 100MHz | 50-TSOP II | 7ns | 16Mb 1M x 16 | Volatile | 1.7V~1.9V | 16b | 100MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C66B-I/ST | Microchip Technology | 0.3421 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.5mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | Serial | 4 kb | 1.05mm | 3.1mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 93C66B | 8 | 0.65mm | 5V | 250 ns | 4Kb 256 x 16 | Non-Volatile | 4.5V~5.5V | 2MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 2ms | MICROWIRE | EEPROM | SPI | 2ms | ||||||||||||||||||||||||||||||||||||||||||||
|
IS61VPS102418A-250B3I | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Active | 3 (168 Hours) | 165 | 3A991.B.2.A | 15mm | ROHS3 Compliant | 165 | PIPELINED ARCHITECTURE | 165-TBGA | 13mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 2.5V | NOT SPECIFIED | 165 | YES | 1mm | 2.375V | Not Qualified | 2.5V | 2.625V | 3-STATE | 2.6ns | 18Mb 1M x 18 | Volatile | 0.5mA | 2.375V~2.625V | 1MX18 | 18 | 18874368 bit | 250MHz | 0.125A | COMMON | 2.38V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F384G08EBHBBJ4-3RES:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 132-VBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 384Gb 48G x 8 | Non-Volatile | 2.5V~3.6V | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS62C1024AL-35QI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | no | Obsolete | 2 (1 Year) | 32 | EAR99 | 5V | 1 | 20.495mm | Non-RoHS Compliant | No | 32 | 32-SOIC (0.445, 11.30mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 3.05mm | 1 | 30mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 5V | 32 | 5V | 3-STATE | 1Mb 128K x 8 | Volatile | 17b | 4.5V~5.5V | 8 | Asynchronous | 35 ns | 8b | COMMON | 2V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F4G01ABAFD12-IT:F TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 4Gb 4G x 1 | Non-Volatile | 2.7V~3.6V | FLASH | SPI |
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IDT71V432S8PFG Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 1 Mb kb 20mm mm 32b b
Price: 0.0000
RFQ -
70261L20PFI8 Integrated Device Technology (IDT)
5V V Surface Mount 100 Pin Memory IC 256 kb kb 14mm mm 315mA mA 16b b
Price: 0.0000
RFQ -
-
-
W25Q80BWSNIG Winbond Electronics
1.8V V SpiFlash® 8 Pin Memory IC SpiFlash® Series 4.9mm mm
Price: 0.0000
RFQ -
FM22LD16-55-BGTR Cypress Semiconductor Corp
Surface Mount F-RAM™ 48 Pin Memory IC F-RAM™ Series FM22LD16 4 Mb kb 8mm mm 12mA mA 16b b
Price: 0.0000
RFQ -
70V261L25PF Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 256 kb kb 14mm mm 140mA mA 16b b
Price: 0.0000
RFQ -
71V3557S80BG Integrated Device Technology (IDT)
Surface Mount 119 Pin Memory IC 4.5 Mb kb 14mm mm 250mA mA 36b b
Price: 0.0000
RFQ -
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