Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Self Refresh | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
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W25X32VZEIG T&R | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH | 8-WSON (8x6) | 32Mb 4M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS2704G+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2007 | yes | Active | 1 (Unlimited) | 6 | EAR99 | ROHS3 Compliant | No | 6 | 6-WDFN Exposed Pad | Serial | 1.3 kb | Surface Mount | -30°C~85°C TA | CMOS | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 30 | DS2704 | 6 | YES | 0.95mm | 2.5V | 3/5V | 5.5V | 2μs | 1.25Kb 32Bytes x 5 pages | Non-Volatile | 0.00075mA | 2.5V~5.5V | 128X8 | 8 | 0.000002A | 10 | 50000 Write/Erase Cycles | SOFTWARE | EEPROM | 1-Wire® | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS62WV6416BLL-55TLI | ISSI, Integrated Silicon Solution Inc | 1.6433 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | yes | Active | 3 (168 Hours) | 44 | 3.3V | 1 | ROHS3 Compliant | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 10 | 44 | 0.8mm | 2.5V | 3.6V | 3-STATE | 1Mb 64K x 16 | Volatile | 16b | 2.5V~3.6V | 16 | Asynchronous | 0.000005A | 55 ns | 16b | COMMON | SRAM | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24AA014H-I/MS | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | 2-Wire, I2C, Serial | No SVHC | 1 kb | 850μm | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 24AA014H | 8 | 0.65mm | 1.7V | 900ns | 1Kb 128 x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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HTEE25608D | Honeywell Aerospace | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 19 Weeks | Tube | 2013 | Active | 1 (Unlimited) | 56 | 38.1mm | RoHS Compliant | 56 | 56-BCPGA | Parallel, Serial | 19.05mm | Through Hole | -55°C~225°C TA | CMOS | SYNCHRONOUS | 6.8mm | 1 | PERPENDICULAR | 5V | NO | 2.54mm | 4.75V | 5.25V | 150ns | 256Kb 32K x 8 | Non-Volatile | 4.75V~5.25V | 32KX8 | 8 | 262144 bit | 5MHz | 5V | EEPROM | Parallel, SPI | 90ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC16BH-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2008 | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 10.16mm | ROHS3 Compliant | Tin | No | 8 | 8-DIP (0.300, 7.62mm) | I2C, Serial | No SVHC | 16 kb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 5V | 24LC16BH | 8 | 2.54mm | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 16KX1 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| BR93G46FJ-3AGTE2 | ROHM Semiconductor | 0.5300 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Cut Tape (CT) | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | IT ALSO OPERATES AT 1MHZ AT 1.7 MIN | 8-SOIC (0.154, 3.90mm Width) | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.65mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 4.5V | 5.5V | 1Kb 64 x 16 | Non-Volatile | 1.7V~5.5V | 64X16 | 16 | 1024 bit | SERIAL | 3MHz | 5ms | 3-WIRE | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MR0A08BCYS35 | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Active | 3 (168 Hours) | 44 | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 55mA | 1.2mm | 8542.32.00.71 | 1 | 70mA | DUAL | 3.3V | 44 | 0.8mm | 3V | 3.6V | 1Mb 128K x 8 | Non-Volatile | 3V~3.6V | 128KX8 | 8 | 8b | 0.007A | 35 ns | 8b | RAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT53B256M64D2TG-062 XT:C | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | -30°C~105°C TC | SDRAM - Mobile LPDDR4 | 16Gb 256M x 64 | Volatile | 1.1V | 1600MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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RMLV0414EGSB-4S2#HA0 | Renesas Electronics America | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | yes | Discontinued | 3 (168 Hours) | 44 | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 1 | DUAL | 3V | RMLV0414 | 44 | YES | R-PDSO-G44 | 2.7V | 3.6V | 4Mb 256K x 16 | Volatile | 2.7V~3.6V | 256KX16 | 16 | 4194304 bit | 45 ns | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SM661GE4-AC | Silicon Motion, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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TC58CVG0S3HRAIG | Kioxia America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Last Time Buy | 3 (168 Hours) | RoHS Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | 8-WSON (6x8) | 155μs | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT41J256M8DA-107:K | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2012 | Obsolete | 3 (168 Hours) | 78 | EAR99 | 1.5V | 1 | 10.5mm | ROHS3 Compliant | Lead Free | No | 78 | AUTO/SELF REFRESH | 78-TFBGA | 2 Gb | Surface Mount | 0°C~95°C TC | SDRAM - DDR3 | 1.2mm | 8542.32.00.36 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 1.5V | MT41J256M8 | 78 | 0.8mm | 1.425V | 1.575V | 3-STATE | 20ns | 2Gb 256M x 8 | Volatile | 18b | 0.19mA | 1.425V~1.575V | 256MX8 | 8 | 8b | 933MHz | 0.012A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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FT24C08A-UDR-B | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2010 | Discontinued | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | 8-DIP (0.300, 7.62mm) | 2-Wire, I2C, Serial | 1MHz | Through Hole | -40°C~85°C | EEPROM | 8-DIP | 550ns | 8Kb 1K x 8 | Non-Volatile | 1.8V~5.5V | 1MHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V67603S166BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 3.465V | 3.135V | 9 Mb | 166MHz | 1.2mm | 13mm | 1.2mm | 340mA | 340mA | 3.5 ns | 166MHz | 1.1MB | RAM, SDR, SRAM | 18b | Synchronous | 36b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7005S35PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 64 kb | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) | QUAD | GULL WING | 260 | 5V | 64 | COMMERCIAL | YES | 35 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST26VF016BT-104I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2014 | SST26 SQI® | Active | 1 (Unlimited) | 8 | 3A991.B.1.A | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 16 Mb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 3V | 40 | SST26VF016B | YES | 1.27mm | 2.7V | 3.6V | 16Mb 2M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 16MX1 | 1 | 104MHz | 0.000025A | 100 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 256B | SPI | NO | FLASH | SPI - Quad I/O | 1.5ms | BOTTOM/TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V07S55G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | Parallel | 3.6V | 3V | 256 kb | 29.46mm | 3.68mm | CMOS | 1 | 140mA | e0 | Tin/Lead (Sn/Pb) | PERPENDICULAR | PIN/PEG | 240 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 55 ns | RAM, SRAM | 30b | Asynchronous | 0.006A | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25X80VDAIZ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2007 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | EAR99 | 9.14mm | ROHS3 Compliant | Lead Free | SYNCHRONOUS MODE ALSO POSSIBLE | 8-DIP (0.300, 7.62mm) | SPI, Serial | unknown | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | ASYNCHRONOUS | 4.45mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | NO | 2.54mm | R-PDIP-T8 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 0.025mA | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | 75MHz | 0.00001A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | SPI | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GD25LQ128DSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 1.65V~2V | 120MHz | FLASH | SPI - Quad I/O | 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ16CNIGR | GigaDevice Semiconductor (HK) Limited | 3.2523 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-UDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 1.65V~2.1V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W19B320ABT7H | Winbond Electronics | 1.1169 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2005 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | Lead Free | No | 48 | 48-TFSOP (0.724, 18.40mm Width) | 32 Mb | 70GHz | 12mm | Surface Mount | -20°C~85°C TA | CMOS | 1.2mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | 260 | 3V | 40 | 48 | YES | 0.5mm | 2.7V | 3/3.3V | 3.6V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 0.045mA | 2.7V~3.6V | 2MX16 | 16 | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 863 | YES | YES | FLASH | Parallel | 70ns | 8K64K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W948D2FBJX5E TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | -25°C~85°C TC | SDRAM - Mobile LPDDR | 5ns | 256Mb 8M x 32 | Volatile | 1.7V~1.95V | 200MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| GD25LQ64CWIGR | GigaDevice Semiconductor (HK) Limited | 0.8339 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | 6mm | ROHS3 Compliant | 8-WDFN Exposed Pad | 5mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-N8 | 1.65V | 2V | 64Mb 8M x 8 | Non-Volatile | 1.65V~2V | 64MX1 | 1 | 67108864 bit | SERIAL | 120MHz | 1.8V | FLASH | SPI - Quad I/O | 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ16LIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 1 (Unlimited) | 8 | 2.525mm | ROHS3 Compliant | 8-XFBGA, WLCSP | 1.511mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 0.5mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 0.5mm | R-PBGA-B8 | 1.65V | 2V | 16Mb 2M x 8 | Non-Volatile | 1.65V~2.1V | 16MX1 | 1 | 16777216 bit | SERIAL | 104MHz | 1.8V | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S32400F-7BL | ISSI, Integrated Silicon Solution Inc | 4.4354 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 90 | EAR99 | 3.3V | 1 | 13mm | ROHS3 Compliant | No | 90 | AUTO/SELF REFRESH | 90-TFBGA | 128 Mb | Surface Mount | 0°C~70°C TA | SDRAM | 1.2mm | 8542.32.00.02 | 1 | 100mA | BOTTOM | 3.3V | 90 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 128Mb 4M x 32 | Volatile | 14b | 3V~3.6V | 4MX32 | 32 | 32b | 143MHz | 0.002A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS42S16400J-7TLI | ISSI, Integrated Silicon Solution Inc | 2.6521 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | Active | 3 (168 Hours) | 54 | EAR99 | 3.3V | 1 | 22.42mm | ROHS3 Compliant | Tin | No | 54 | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | No SVHC | 64 Mb | 1.2mm | 10.29mm | Surface Mount | -40°C~85°C TA | SDRAM | 90mA | IS42S16400J-7TLI | 1 | 90mA | e3 | DUAL | 3.3V | 54 | 0.8mm | 3V | 3.6V | 3-STATE | 5.4ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 4MX16 | 16b | 143MHz | COMMON | NO | 4096 | YES | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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11LC161-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 16 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | 5mA | e3 | DUAL | 260 | 5V | 40 | 11LC161 | 8 | 1.27mm | 2.5V | Not Qualified | 3/5V | 5.5V | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 100kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 10ms | 1-WIRE | EEPROM | Single Wire | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1270W-100IND | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 36 | Non-RoHS Compliant | 36-DIP Module (0.600, 15.24mm) | unknown | Through Hole | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1 | e0 | TIN LEAD | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 36 | NO | R-XDMA-P36 | 3V | COMMERCIAL | 3.6V | 16Mb 2M x 8 | Non-Volatile | 3V~3.6V | 2MX8 | 8 | 16777216 bit | 100 ns | NVSRAM | Parallel | 100ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V24S55J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 84-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V24 | 84-PLCC (29.21x29.21) | 55ns | 64Kb 4K x 16 | Volatile | 3V~3.6V | SRAM | Parallel | 55ns |
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