Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | I/O Type | Programming Voltage | Page Size | Serial Bus Type | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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W25X40CLSVIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH | 8-VSOP | 4Mb 512K x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT41K128M16JT-125 M AIT:K TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | Last Time Buy | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | MT41K128M16 | 13.75ns | 2Gb 128M x 16 | Volatile | 1.283V~1.45V | 800MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX25L25835EMI-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tube | MX25xxx35/36 - MXSMIO™ | Obsolete | 3 (168 Hours) | 16 | 10.3mm | RoHS Compliant | 16 | IT ALSO CONFIGURED AS 256M X 1 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 7.52mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.65mm | 1 | DUAL | 3.3V | YES | 1.27mm | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | 104MHz | 2 | 2.7V | FLASH | SPI | 300μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX29GL512GHT2I-10G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | MX29GL | Active | 56 | 18.4mm | Non-RoHS Compliant | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 0.5mm | R-PDSO-G56 | 2.7V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 2.7V~3.6V | 32MX16 | 16 | 536870912 bit | 100 ns | 8 | 3V | FLASH | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS43DR16160A-3DBI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | no | Obsolete | 3 (168 Hours) | 84 | EAR99 | 1.8V | 1 | 12.5mm | Non-RoHS Compliant | 84 | AUTO/SELF REFRESH | 84-TFBGA | not_compliant | 256 Mb | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | SYNCHRONOUS | 1.2mm | 8542.32.00.24 | 1 | 330mA | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | 84 | 0.8mm | 1.7V | Not Qualified | 1.9V | 3-STATE | 450ps | 256Mb 16M x 16 | Volatile | 15b | 1.7V~1.9V | 16MX16 | 16 | 16b | 333MHz | 0.005A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | |||||||||||||||||||||||||||||||||||||||||||
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IS61C6416AL-12TI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | no | Obsolete | 2 (1 Year) | 44 | 5V | 1 | Non-RoHS Compliant | No | 44 | 44-TSOP (0.400, 10.16mm Width) | 1 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 45mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 5V | 44 | YES | 0.8mm | 5V | 5V | 3-STATE | 1Mb 64K x 16 | Volatile | 16b | 4.5V~5.5V | 16 | Asynchronous | 16b | COMMON | SRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42S16400D-7BL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 2 (1 Year) | 60 | EAR99 | 1 | 10.1mm | RoHS Compliant | 60 | AUTO/SELF REFRESH | 60-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 8542.32.00.02 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 40 | 60 | YES | 0.65mm | 3V | Not Qualified | 3.3V | 3.6V | 3-STATE | 5.4ns | 64Mb 4M x 16 | Volatile | 0.13mA | 3V~3.6V | 4MX16 | 16 | 67108864 bit | 16b | 143MHz | 0.001A | COMMON | 4096 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||
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IS61DDPB41M36A-400M3L | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | Active | 3 (168 Hours) | 165 | 17mm | ROHS3 Compliant | 165 | 165-LBGA | 15mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, DDR IIP | 1.4mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | 1.71V | 1.89V | 36Mb 1M x 36 | Volatile | 1.71V~1.89V | 1MX36 | 36 | 37748736 bit | 400MHz | 0.45 ns | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS25WP128-RGLE-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 1.65V | 1.95V | 128Mb 16M x 8 | Non-Volatile | 1.65V~1.95V | 16MX8 | 8 | 134217728 bit | SERIAL | 133MHz | 1.8V | FLASH | SPI - Quad I/O, QPI, DTR | 800μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS42VM16160E-75BLI | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | Discontinued | 3 (168 Hours) | 54 | 1.8V | 1 | 8mm | ROHS3 Compliant | 54 | AUTO/SELF REFRESH | 54-TFBGA | 256 Mb | Surface Mount | -40°C~85°C TA | SDRAM - Mobile | SYNCHRONOUS | 1.2mm | 1 | 60mA | BOTTOM | 1.8V | 0.8mm | 1.7V | Not Qualified | 1.95V | 3-STATE | 6ns | 256Mb 16M x 16 | Volatile | 15b | 1.7V~1.95V | 16MX16 | 16 | 16b | 133MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 1248FP | 1248 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IS61LF102418A-6.5TQL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | yes | Obsolete | 2 (1 Year) | 100 | 3.3V | 2 | RoHS Compliant | No | 100 | PIPELINED ARCHITECTURE, FLOW-THROUGH | 100-LQFP | 18 Mb | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 1.6mm | 1 | 133MHz | e3 | Matte Tin (Sn) - annealed | QUAD | 260 | 3.3V | 40 | 100 | YES | 0.65mm | 3.135V | 3.465V | 3-STATE | 6.5ns | 18Mb 1M x 18 | Volatile | 20b | 3.135V~3.6V | 1MX18 | 18 | 0.06A | COMMON | 3.14V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "W25Q80JVSVIQ TR") |
W25Q80JVSVIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | SpiFlash® | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST26VF016-80-5I-S2AE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 21 Weeks | Tape & Reel (TR) | 2005 | SST26 SQI® | Active | 3 (168 Hours) | 8 | 3.3V | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 16 Mb | Surface Mount | -40°C~85°C TA | CMOS | 18mA | e3 | Matte Tin (Sn) - annealed | DUAL | SST26VF016 | YES | 1.27mm | 6 ns | 16Mb 2M x 8 | Non-Volatile | 1b | 2.7V~3.6V | 8 | Synchronous | 8b | 80MHz | 0.000015A | 100 | 100000 Write/Erase Cycles | SOFTWARE | 256B | SPI | FLASH | SPI - Quad I/O | 1.5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q80EWSSIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 1.65V~1.95V | 104MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W9812G2KB-6 TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 90-TFBGA | Surface Mount | 0°C~70°C TA | SDRAM | 5ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 166MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT48LC16M8A2BB-6A XIT:L TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2014 | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 60-FBGA | Surface Mount | -40°C~85°C TA | SDRAM | MT48LC16M8A2 | 5.4ns | 128Mb 16M x 8 | Volatile | 3V~3.6V | 167MHz | DRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16JWSSIM | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Active | RoHS Compliant | 8-SOIC (0.209, 5.30mm Width) | compliant | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 133MHz | FLASH | SPI - Quad I/O | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71421LA20JG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | yes | Active | 1 (Unlimited) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Lead Free | No | 52 | AUTOMATIC POWER DOWN | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | CMOS | 1 | 200mA | e3 | Matte Tin (Sn) - annealed | QUAD | J BEND | 260 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||
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7140LA25J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 3.63mm | 19mm | 3.63mm | 2.96261g | CMOS | 110mA | 1 | 170mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 25 ns | 1kB | RAM, SDR, SRAM | 20b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||
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IDT71V3556S166BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 165 | 3A991.B.2.A | 85°C | -40°C | 15mm | RoHS Compliant | 165 | Parallel | unknown | 166MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.36mA | 128KX36 | 36 | 4718592 bit | 0.045A | 3.5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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70125L25J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 18 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | YES | SRAMs | 5V | 3-STATE | 25 ns | 2.3kB | RAM, SDR, SRAM | 22b | 0.015A | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||
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71V3558SA166BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2006 | yes | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | Parallel | 4.5 Mb | 166MHz | 13mm | 1.2mm | CMOS | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | YES | SRAMs | 3.465V | 3-STATE | RAM, SRAM | 18b | 0.36mA | 0.045A | 3.5 ns | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V321L35PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | 2009 | yes | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 64 | TQFP | Parallel | 3.6V | 3V | 16 kb | 14mm | 1.4mm | CMOS | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 64 | INDUSTRIAL | YES | 35 ns | 2kB | RAM, SDR, SRAM | 22b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2546S100BGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2011 | no | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 260mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | OTHER | SRAMs | 3-STATE | 5 ns | RAM, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
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7142SA35CB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Bulk | 2007 | Active | 125°C | -55°C | 5V | 2 | 61.72mm | RoHS Compliant | Contains Lead | No | 48 | DIP | Parallel | 5.5V | 4.5V | 16 kb | 15.24mm | 3.3mm | 230mA | 35 ns | RAM, SRAM | 22b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V424S10PHI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | not_compliant | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | INDUSTRIAL | YES | 0.8mm | R-PDSO-G44 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.18mA | 512KX8 | 8 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V2556S100PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2011 | Active | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 14mm | 1.4mm | 260mA | 5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 36b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V25S25PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2001 | yes | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 3.3V | 2 | 14mm | RoHS Compliant | Lead Free | No | 100 | TQFP | Parallel | 3.6V | 3V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 25 ns | 16kB | RAM, SDR, SRAM | 26b | 0.19mA | 8KX16 | Asynchronous | 0.005A | 16b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||
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70V657S10BFG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | Parallel | 3.45V | 3.15V | 1.1 Mb | 15mm | 1.4mm | CMOS | 1 | 500mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 10 ns | 128kB | RAM, SDR, SRAM | 30b | Asynchronous | 0.015A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
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7130SA55TF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | Active | 70°C | 0°C | 5V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 8 kb | 10mm | 1.4mm | 155mA | 55 ns | 2kB | RAM, SDR, SRAM | 20b | Asynchronous | 8b |
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MX25L25835EMI-10G Macronix
MX25xxx35/36 - MXSMIO™ Memory IC MX25xxx35/36 - MXSMIO™ Series 10.3mm mm
Price: 0.0000
RFQ -
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IS43DR16160A-3DBI ISSI, Integrated Silicon Solution Inc
Surface Mount 84 Pin Memory IC 256 Mb kb 12.5mm mm 330mA mA
Price: 0.0000
RFQ -
IS61C6416AL-12TI ISSI, Integrated Silicon Solution Inc
5V V 44 Pin Memory IC 1 Mb kb 45mA mA 16b b
Price: 0.0000
RFQ -
IS42S16400D-7BL ISSI, Integrated Silicon Solution Inc
3.3V V 60 Pin Memory IC 10.1mm mm
Price: 0.0000
RFQ -
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IS42VM16160E-75BLI ISSI, Integrated Silicon Solution Inc
Surface Mount Memory IC 256 Mb kb 8mm mm 60mA mA
Price: 0.0000
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Price: 0.0000
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RFQ
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