Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Max Supply Current | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Supplier Device Package | Output Characteristics | Access Time | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
.png "RMLV0408EGSB-4S2#AA0") |
RMLV0408EGSB-4S2#AA0 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-SOIC (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM | 32-TSOP II | 45ns | 4Mb 512K x 8 | Volatile | 2.7V~3.6V | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA75BQ8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR (ZBT) | IDT71V3557 | 165-CABGA (13x15) | 7.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3599S133BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 15mm | 1.4mm | CMOS | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | 208 | COMMERCIAL | YES | 0.8mm | SRAMs | 3-STATE | 25 ns | 512kB | RAM, SDR, SRAM | 34b | 0.4mA | 0.03A | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71321LA55PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | TQFP | Parallel | 5.5V | 4.5V | 16 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | YES | 0.8mm | SRAMs | 5V | 3-STATE | 55 ns | 2kB | RAM, SDR, SRAM | 22b | 0.11mA | 0.0015A | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V65603S133PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2015 | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | Non-RoHS Compliant | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | not_compliant | 3.135V | 9 Mb | 133MHz | CMOS | 1 | 320mA | e0 | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | 0.65mm | SRAMs | Not Qualified | 3-STATE | 4.2 ns | RAM, SRAM | 18b | 256KX36 | 36 | Synchronous | 0.06A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53E384M64D4NK-053 WT:E TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7006S35J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | CMOS | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 35 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.015A | 8b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IDT71T016SA15BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 3 (168 Hours) | 48 | 3A991.B.2.B | 70°C | 0°C | 7mm | Non-RoHS Compliant | 48 | Parallel | not_compliant | 7mm | CMOS | 1.34mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 2.5V | 20 | 48 | COMMERCIAL | YES | 0.75mm | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM - Asynchronous | 0.13mA | 64KX16 | 16 | 0.015A | 15 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3389S4BC | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | COMMERCIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3389S5PRFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 128 | 85°C | -40°C | 3.3V | 2 | 20mm | RoHS Compliant | Contains Lead | No | 128 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | TQFP | Parallel | 3.45V | 3.15V | 1.1 Mb | 100MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 415mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 225 | 3.3V | 128 | INDUSTRIAL | 0.5mm | SRAMs | 3-STATE | 5 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.03A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1444AV33-250AXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2004 | yes | Obsolete | 3 (168 Hours) | 100 | 3A991.B.2.A | 3.3V | 4 | 20mm | ROHS3 Compliant | 100 | PIPELINED ARCHITECTURE | 100-LQFP | 36 Mb | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.6mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | QUAD | 260 | 3.3V | 20 | CY7C1444 | 100 | YES | 0.65mm | 3.135V | Not Qualified | 3.6V | 3-STATE | 2.6ns | 36Mb 1M x 36 | Volatile | 20b | 3.135V~3.6V | 1MX36 | 36 | 250MHz | COMMON | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28HC256-12TU-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tape & Reel (TR) | 1997 | Active | 3 (168 Hours) | 28 | 11.8mm | ROHS3 Compliant | AUTOMATIC WRITE | 28-TSSOP (0.465, 11.80mm Width) | 8mm | Surface Mount | -40°C~85°C TC | CMOS | ASYNCHRONOUS | 1.2mm | 1 | DUAL | 5V | YES | 0.55mm | R-PDSO-G28 | 4.5V | 5.5V | 120ns | MIL-STD-883 | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 10ms | 5V | EEPROM | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25256AN-10SU-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | Obsolete | 1 (Unlimited) | 85°C | -40°C | 5V | ROHS3 Compliant | Lead Free | Gold, Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 5.5V | 2.7V | 256 kb | 20MHz | Surface Mount | -40°C~85°C TA | EEPROM | 10mA | 10MHz | AT25256 | 8-SOIC | 40 ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~5.5V | 20MHz | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7006L55PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 64 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 64 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 128 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | INDUSTRIAL | 0.8mm | SRAMs | 5V | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 0.004A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL164K0XBHI020 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2015 | FL1-K | Obsolete | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | No | 24 | ALSO CONFIGURABLE AS 64M X 1 | 24-TBGA | SPI, Serial | 64 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 25mA | 1.2mm | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 3V | YES | 1mm | 2.7V | 3/3.3V | 3.6V | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 16MX4 | 4 | 8b | 108MHz | 0.000005A | 2 | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 3V | 256B | SPI | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA183BQG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | Tape & Reel | 2009 | yes | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | PIPELINED ARCHITECTURE | FBGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 183MHz | 13mm | 1.2mm | CMOS | 1 | 340mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | COMMERCIAL | SRAMs | 3-STATE | 3.3 ns | RAM, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29C2G24MAABAKAMD-5 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2015 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 130-VFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND, Mobile LPDRAM | MT29C2G24M | 2Gb 128M x 16 N 1Gb 32M x 32 LPDRAM | Non-Volatile | 1.7V~1.95V | 200MHz | FLASH, RAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F1G08ABADAH4-IT:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 5 Weeks | Surface Mount | Tray | 2012 | Active | 3 (168 Hours) | 63 | 3.3V | ROHS3 Compliant | Lead Free | No | 63 | 63-VFBGA | 1 Gb | 1mm | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1 | 35mA | BOTTOM | 3.3V | MT29F1G08 | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 28b | 2.7V~3.6V | 128MX8 | 8 | Asynchronous | 0.0001A | 25 ns | 8b | NO | NO | YES | 1K | 2kB | YES | FLASH | Parallel | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
IDT71V67602S133BQ8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 165-TBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V67602 | 165-CABGA (13x15) | 4.2ns | 9Mb 256K x 36 | Volatile | 3.135V~3.465V | 133MHz | SRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761S200BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel | 2009 | yes | Discontinued | 3 (168 Hours) | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 200MHz | 22mm | 2.15mm | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | 260 | 119 | 3.1 ns | RAM, SRAM | 17b | Synchronous | 36b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46V128M8P-6T IT:A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | yes | Obsolete | 3 (168 Hours) | 66 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.32 | 1 | e3 | MATTE TIN | DUAL | 260 | 2.5V | 30 | MT46V128M8 | 66 | YES | 0.65mm | R-PDSO-G66 | 2.3V | Not Qualified | 2.5V | 2.7V | 3-STATE | 700ps | 1Gb 128M x 8 | Volatile | 0.525mA | 2.3V~2.7V | 128MX8 | 8 | 1073741824 bit | 167MHz | 0.01A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT41K128M16HA-15E IT:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2011 | Obsolete | 3 (168 Hours) | 96 | 1 | 14mm | ROHS3 Compliant | AUTO/SELF REFRESH | 96-TFBGA | unknown | 9mm | Surface Mount | -40°C~95°C TC | SDRAM - DDR3L | SYNCHRONOUS | 1.2mm | 1 | BOTTOM | 1.35V | MT41K128M16 | YES | 0.8mm | R-PBGA-B96 | 1.283V | Not Qualified | 1.35V | 1.45V | 3-STATE | 13.5ns | 2Gb 128M x 16 | Volatile | 0.425mA | 1.283V~1.45V | 128MX16 | 16 | 2147483648 bit | 667MHz | 0.012A | COMMON | 8192 | DRAM | Parallel | 8 | 8 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48LC4M32B2B5-6A IT:L TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 90-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM | MT48LC4M32B2 | 5.4ns | 128Mb 4M x 32 | Volatile | 3V~3.6V | 167MHz | DRAM | Parallel | 12ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT47H32M16NF-25E AUT:H TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 84-TFBGA | Surface Mount | -40°C~125°C TC | SDRAM - DDR2 | 400ps | 512Mb 32M x 16 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA256T-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 256 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 40 | 24AA256 | 8 | 0.65mm | 1.7V | Not Qualified | 5.5V | 900ns | 256Kb 32K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | NO | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT49F001T-55PI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1997 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 32-DIP (0.600, 15.24mm) | Through Hole | -40°C~85°C TC | FLASH | AT49F001 | 32-PDIP | 55ns | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT27C516-45JC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1998 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 44-LCC (J-Lead) | Surface Mount | 0°C~70°C TC | EPROM - OTP | AT27C516 | 45ns | 512Kb 32K x 16 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1041CV33-10BAJXET | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2013 | Discontinued | 3 (168 Hours) | 125°C | -40°C | 3.3V | 1 | ROHS3 Compliant | Lead Free | No | 48 | 48-TFBGA | Parallel | 3.6V | 3V | 4 Mb | Surface Mount | -40°C~125°C TA | SRAM - Asynchronous | 130mA | CY7C1041 | 48-FBGA (6x8) | 10ns | 4Mb 256K x 16 | Volatile | 18b | 3V~3.6V | Asynchronous | 16b | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M24C16-WMN6P | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Bulk | Active | 1 (Unlimited) | 8 | EAR99 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | No SVHC | 16 kb | 1.75mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 3mA | SO8N-A | 1 | 2mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 30 | M24C16 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 85°C | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | SERIAL | 400kHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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25LC1024-E/SM16KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | 5.26mm | ALSO OPERATES AT 10MHZ | 8-SOIC (0.209, 5.30mm Width) | compliant | 5.25mm | Surface Mount | -40°C~125°C TA | CMOS | SYNCHRONOUS | 2.03mm | 1 | DUAL | 5V | 25LC1024 | YES | 1.27mm | R-PDSO-G8 | 2.5V | 5.5V | 1Mb 128K x 8 | Non-Volatile | 2.5V~5.5V | 1MX1 | 1 | 1048576 bit | SERIAL | 20MHz | 6ms | SPI | EEPROM | SPI | 6ms |
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