Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Page Size | Serial Bus Type | I2C Control Byte | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CY7C1464AV33-167BGI | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | no | Obsolete | 3 (168 Hours) | 209 | 22mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | 209-BGA | unknown | 14mm | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | 1.96mm | 1 | e0 | TIN LEAD | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 209 | YES | 1mm | R-PBGA-B209 | 3.135V | COMMERCIAL | 3.63V | 3.4ns | 36Mb 512K x 72 | Volatile | 3.135V~3.6V | 512KX72 | 72 | 37748736 bit | 167MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS7C34096A-20JCNTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2001 | yes | Active | 3 (168 Hours) | 36 | 23.495mm | ROHS3 Compliant | 36 | 36-BSOJ (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SRAM - Asynchronous | 3.7592mm | 1 | e3/e6 | PURE MATTE TIN/TIN BISMUTH | DUAL | 245 | 3.3V | 40 | 36 | YES | 1.27mm | 3V | 3.6V | 4Mb 512K x 8 | Volatile | 3V~3.6V | 512KX8 | 8 | 4194304 bit | 20 ns | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "CG8392AA") |
CG8392AA | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT6116LA45SOI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 2008 | 1 (Unlimited) | 24 | EAR99 | 85°C | -40°C | 5V | 1 | Non-RoHS Compliant | 24 | SOIC | Parallel | 5.5V | not_compliant | 4.5V | 16 kb | CMOS | 2.65mm | 1 | 95mA | e0 | Tin/Lead (Sn/Pb) | DUAL | GULL WING | 225 | 5V | 20 | 24 | INDUSTRIAL | SRAMs | Not Qualified | 5V | 3-STATE | 45 ns | RAM, SRAM - Asynchronous | 11b | 2KX8 | 8 | Asynchronous | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||
 |
70V05L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 64 kb | 24mm | 3.63mm | CMOS | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 55 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | Asynchronous | 0.005A | 8b | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||
|
SM662GEB-AC | Silicon Motion, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3399S133BCI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | PIPELINED OR FLOW-THROUGH ARCHITECTURE | Parallel | 3.45V | 3.15V | 2.3 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 480mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 256kB | RAM, SDR, SRAM | 34b | Synchronous | 0.04A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||
 |
AT49F002N-55VI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1999 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-TFSOP (0.488, 12.40mm Width) | Surface Mount | -40°C~85°C TC | AT49F002 | 55ns | 2Mb 256K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 50μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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QS7024A-55J | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | QS7024A | no | Obsolete | NOT SPECIFIED | 84 | ROHS3 Compliant | INTERRUPT FLAG; SEMAPHORE | Surface Mount | 0°C~70°C | CMOS | ASYNCHRONOUS | 1 | e0 | TIN LEAD | QUAD | J BEND | NOT SPECIFIED | 5V | NOT SPECIFIED | YES | S-PQCC-J84 | 4.5V | COMMERCIAL | 5.5V | 64Kb 4K x 16 | Volatile | 5V | 4KX16 | 16 | 65536 bit | PARALLEL | 18MHz | 55 ns | SRAM | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7015S35PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 250mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 35 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.015A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||
 |
MT29F512G08CECBBJ4-37:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 111 Weeks | Tray | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 132-VBGA | Surface Mount | 0°C~70°C TA | FLASH - NAND | 512Gb 64G x 8 | Non-Volatile | 2.7V~3.6V | 267MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29BV020-15TU | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT29BV020 | 150ns | 2Mb 256K x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 20ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT41K512M8DA-107 V:P TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 4Gb 512M x 8 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT25SF081-SHD-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel (TR) | 2014 | yes | Active | 1 (Unlimited) | 8 | 3.3V | 5.29mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 64 Mb | 5.24mm | Surface Mount | -40°C~85°C TC | CMOS | SYNCHRONOUS | 2.16mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | AT25SF081 | 1.27mm | 2.5V | 3.6V | 8 ns | 8Mb 1M x 8 | Non-Volatile | 2.5V~3.6V | 1 | 104MHz | 3V | 256B | FLASH | SPI | 5μs, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3579S4DR | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 28mm | RoHS Compliant | Contains Lead | No | 208 | PQFP | Parallel | 3.45V | 3.15V | 1.1 Mb | 133MHz | 28mm | 3.5mm | CMOS | 1 | 460mA | e0 | Tin/Lead (Sn/Pb) | QUAD | GULL WING | 225 | 3.3V | 208 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 7.5 ns | 128kB | RAM, SDR, SRAM | 30b | Synchronous | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC08BHT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 13 Weeks | Surface Mount | Tape & Reel (TR) | 2013 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | I2C, Serial | 8 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24LC08BH | 8 | 1.27mm | 900ns | 8Kb 256 x 8 x 4 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010XMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||
 |
R1LV0216BSB-5SI#B0 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 44-TSOP (0.400, 10.16mm Width) | Surface Mount | -40°C~85°C TA | SRAM | 44-TSOP II | 55ns | 2Mb 128K x 16 | Volatile | 2.7V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD25VE40CSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 2.1V~3.6V | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT29F32G08FAAWP-ET:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Discontinued | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NAND | MT29F32G08 | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V432S7PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2014 | 3 (168 Hours) | 100 | 3A991.B.2.B | 85°C | -40°C | 20mm | RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | unknown | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.63V | 3-STATE | RAM, SRAM | 0.16mA | 32KX32 | 32 | 1048576 bit | 66MHz | 0.015A | 7 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V25761S200PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 85°C | -40°C | Non-RoHS Compliant | LQFP | Parallel | 200MHz | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16JWBYIM | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | SpiFlash® | Active | RoHS Compliant | 8-UFBGA, WLCSP | compliant | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 133MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT28C256-25DM/883-815 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 23 Weeks | Tube | 1997 | Active | 1 (Unlimited) | 28 | 37.215mm | ROHS3 Compliant | AUTOMATIC WRITE | 28-CDIP (0.600, 15.24mm) | 15.24mm | Through Hole | -55°C~125°C TC | CMOS | ASYNCHRONOUS | 5.72mm | 1 | DUAL | 5V | NO | 2.54mm | R-GDIP-T28 | 4.5V | 5.5V | 250ns | MIL-STD-883 Class C | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 262144 bit | 10ms | 5V | EEPROM | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71256SA15TPG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2011 | yes | Active | 1 (Unlimited) | 28 | EAR99 | 70°C | 0°C | 5V | 1 | 34.3mm | RoHS Compliant | Lead Free | No | 28 | PDIP | Parallel | 5.5V | 4.5V | 256 kb | 7.62mm | 3.3mm | CMOS | 4.572mm | 1 | 150mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 28 | COMMERCIAL | 2.54mm | SRAMs | 5V | 3-STATE | 15 ns | 32kB | RAM, SDR, SRAM - Asynchronous | 15b | 32KX8 | Asynchronous | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||
 |
MT53D512M32D2DS-046 WT ES:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 1 (Unlimited) | 200-WFBGA | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR4 | 200-WFBGA (10x14.5) | 16Gb 512M x 32 | Volatile | 1.1V | 2133MHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
THGBMJG7C2LBAU8 | Kioxia America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tray | e•MMC™ | Active | 3 (168 Hours) | RoHS Compliant | 153-WFBGA | Surface Mount | -40°C~105°C TA | FLASH - NAND | 128Gb 16G x 8 | Non-Volatile | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CG8097AAT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
THGBMNG5D1LBAIT | Kioxia America, Inc. | 4.9871 |
Min: 1 Mult: 1 |
0.00000000 | download | 26 Weeks | Tray | e•MMC™ | Active | 3 (168 Hours) | 153 | RoHS Compliant | 153-WFBGA | Surface Mount | -25°C~85°C TA | FLASH - NAND | ASYNCHRONOUS | 1 | BOTTOM | YES | R-PBGA-B153 | 2.7V | 3.6V | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | 4GX8 | 8 | 34359738368 bit | SERIAL | 52MHz | 2.7V | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT29BV040A-20TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1997 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 32-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT29BV040 | 200ns | 4Mb 512K x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | 20ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY62137FV18LL-55BVXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tray | 2001 | MoBL® | Active | 3 (168 Hours) | 48 | 1.8V | 1 | 8mm | ROHS3 Compliant | Lead Free | No | 48 | 48-VFBGA | 2 Mb | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1 | 18mA | 18MHz | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | CY62137 | 48 | 0.75mm | 2.25V | 3-STATE | 2Mb 128K x 16 | Volatile | 17b | 1.65V~2.25V | 16 | Asynchronous | 0.000004A | 55 ns | 16b | COMMON | 1V | SRAM | Parallel | 55ns |
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IDT6116LA45SOI Integrated Device Technology (IDT)
5V V Surface Mount 24 Pin Memory IC 16 kb kb 95mA mA 8b b
Price: 0.0000
RFQ -
70V05L55J8 Integrated Device Technology (IDT)
Surface Mount 68 Pin Memory IC 64 kb kb 24mm mm 155mA mA 8b b
Price: 0.0000
RFQ -
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70V3399S133BCI Integrated Device Technology (IDT)
Surface Mount 256 Pin Memory IC 2.3 Mb kb 17mm mm 480mA mA 18b b
Price: 0.0000
RFQ -
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7015S35PF8 Integrated Device Technology (IDT)
5V V Surface Mount 80 Pin Memory IC 72 kb kb 14mm mm 250mA mA 9b b
Price: 0.0000
RFQ -
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AT25SF081-SHD-T Adesto Technologies
Surface Mount Memory IC AT25SF081 64 Mb kb 5.29mm mm
Price: 0.0000
RFQ -
70V3579S4DR Integrated Device Technology (IDT)
Surface Mount 208 Pin Memory IC 1.1 Mb kb 28mm mm 460mA mA 36b b
Price: 0.0000
RFQ -
24LC08BHT-I/SN Microchip Technology
Surface Mount 8 Pin Memory IC 24LC08BH 8 kb kb 4.9mm mm 3mA mA
Price: 0.0000
RFQ -
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IDT71V432S7PFGI Integrated Device Technology (IDT)
3.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
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71256SA15TPG Integrated Device Technology (IDT)
5V V Through Hole 28 Pin Memory IC 256 kb kb 34.3mm mm 150mA mA 8b b
Price: 0.0000
RFQ -
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CY62137FV18LL-55BVXI Cypress Semiconductor Corp
Surface Mount MoBL® 48 Pin Memory IC MoBL® Series CY62137 2 Mb kb 8mm mm 18mA mA 16b b
Price: 0.0000
RFQ
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