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M2S050-1FGG896I

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Manufacturer No:

M2S050-1FGG896I

Manufacturer:

Microsemi

HK JDW NO:

523-M2S050-1FGG896I

Package:

896-BGA

Datasheet:

M2S050-1FGG896I

Description:

-40°C~100°C TJ M2S050 System On ChipSmartFusion?2 Series 377 I/O

Quantity:

In Stock : 999

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Product Details

Purchasing and Inquiry

This SoC is built on ARM? Cortex?-M3 core processor(s).


A ARM? Cortex?-M3 core processor(s) is built into this SoC.The manufacturer assigns this system on a chip with a 896-BGA package as per the manufacturer's specifications.Users will enjoy reliable performance with this SoC chip, which has implemented 64KB RAM.The SoC design uses MCU, FPGA architecture for its internal architecture.Featured system on chip SoCs of the SmartFusion?2 series.For this SoC meaning, the average operating temperature should be -40°C~100°C TJ.A key point to note is that this SoC security combines FPGA - 50K Logic Modules.Housed in the state-of-art Tray package.377 I/Os are included in this SoC part.It has a 256KB flash.Search M2S050 for system on chips with similar specs and purposes.166MHz is the wireless SoC's frequency.It uses ARM as its core architecture.It is just enough to start the SoC computing at -40°C.In this SoC system on chip, 100°C represents its maximum operating temperature.

ARM? Cortex?-M3 processor.


64KB RAM.
Built on MCU, FPGA.
256KB extended flash.
Core Architecture: ARM

There are a lot of Microsemi Corporation


M2S050-1FGG896I System On Chip (SoC) applications.

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4. Shipping Cost

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The basic freight (for package ≤0.5kg or corresponding volume) depends on the time zone and country.

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Currently, our products are shipped through DHL, FedEx, SF, and UPS.

Delivery Time

Once the goods are shipped, estimated delivery time depends on the shipping methods you chose:
FedEx International, 5-7 business days.
The following are some common countries' logistic time.

Purchasing and Inquiry

Payment Method

The fee is charged according to the rule of PayPal.
East West Bank charge US$30.00 banking fee.
The fee is charged according to the rule of PayPal.
Western Union charge US$0.00 banking fee.

Shipping

DHL(www.dhl.com)
From $40.00 basic shipping fee depend on zone and country.
UPS(www.ups.com)
From $40.00 basic shipping fee depend on zone and country.
FedEx(www.fedex.com)
From $40.00 basic shipping fee depend on zone and country.
Registered Mail(www.singpost.com)
From $10.00 basic shipping fee depend on different zone and country.

Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

M2S050-1FGG896I

technical specifications, attributes, parameters and parts with similar specifications to M2S050-1FGG896I.

  • Type
    Parameter
    Select All
  • Factory Lead Time

    10 Weeks

  • Lifecycle Status

    IN PRODUCTION (Last Updated: 1 month ago)

  • Package / Case

    896-BGA

  • Supplier Device Package

    896-FBGA (31x31)

  • Operating Temperature

    -40°C~100°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    SmartFusion®2

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    3 (168 Hours)

  • Max Operating Temperature

    100°C

  • Min Operating Temperature

    -40°C

  • Frequency

    166MHz

  • Base Part Number

    M2S050

  • Interface

    CAN, Ethernet, I2C, SPI, UART, USART, USB

  • Number of I/O

    377

  • Speed

    166MHz

  • RAM Size

    64KB

  • Core Processor

    ARM® Cortex®-M3

  • Peripherals

    DDR, PCIe, SERDES

  • Connectivity

    CANbus, Ethernet, I2C, SPI, UART/USART, USB

  • Architecture

    MCU, FPGA

  • Core Architecture

    ARM

  • Primary Attributes

    FPGA - 50K Logic Modules

  • Flash Size

    256KB

  • RoHS Status

    RoHS Compliant

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