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MCP130-270DI/TO
MCP130-270DI/TO
536-MCP130-270DI/TO
TO-226-3, TO-92-3 (TO-226AA)
5V3 Terminals 3-Pin MCP130 Voltage supervisor1 Channels Min 1V Max 5.5V
In Stock : 999
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Product Details
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MCP130-270DI/TO Overview
This power management consists of 3 mounting terminals on which it can be mounted. Packaged in the form of a Bulk, power management is easy to use. There are 1 functions included in this PMIC so that you can refer to them. Power management consists of 1 channels, each of which can be used independently. Please refer to power management for TO-226-3, TO-92-3 (TO-226AA) functions. Several of the benefits of this PMIC are also shared by other Simple Reset/Power-On Reset products. IC management conducts in a 5V-voltage supply. Power ics operate at 1 supply voltages. Through Hole is the one that mounts power management. In this case, this PMIC chip can be sub-categorized as a Power Management Circuits chip. In total, it has 3 pins on IC management. 3 pins are present on the power management system. A voltage (Vsup) that doesn't fall below 1V as the minimum supply voltage (Vsup) should be applied to this IC power in order to ensure its proper operation. This IC power should be powered by no more than 5.5V volts of supply voltage (Vsup). Power management recommends the Through Hole mounting type. It is recommended to set the supervisor's temperature to this range: -40°C~85°C TA. While this power management is operating, it will output Open Drain or Open Collector as the output voltage. There is a supply current of 60μA for the power management. If you want to search for similar IC managements of this manufacturer, you can always refer to MCP130, which is the base power ics number. A maximum supply temperature of 60μA can be used with this power management.
MCP130-270DI/TO Features
Simple Reset/Power-On Reset type
Minimum supply voltage of 1V
60μA operating supply current
MCP130-270DI/TO Applications
There are a lot of Microchip Technology MCP130-270DI/TO Voltage Supervisors applications.
- Microprocessor system
- Embedded computing
- Electronics installed in the vehicle
- Magnetic resonance imaging
- Battery cars
- Set top box
- Smartphones
- Power distribution systems of infant care room
- FPGA design
- Consumer electronics
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