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  • XC7K325T-2FBG900C

XC7K325T-2FBG900C

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Manufacturer No:

XC7K325T-2FBG900C

Manufacturer:

Xilinx

HK JDW NO:

903-XC7K325T-2FBG900C

Package:

900-BBGA, FCBGA

Datasheet:

XC7K325T-2FBG900C

Description:

2.54mm mm 1GB B FPGAs Kintex?-7 Series 900-BBGA, FCBGA 1mm mm 900

Quantity:

In Stock : 8716

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XC7K325T-2FBG900C Overview


Fpga chips is supplied in the 900-BBGA, FCBGA package. Fpga chips consists of FIELD PROGRAMMABLE GATE ARRAY elements. There are 500 I/Os for better data transfer. A fundamental building block consists of 326080 logic elements/cells. Power is provided by a 1V-volt supply. The Field Programmable Gate Arrays family of FPGAs includes this part. The Surface Mount-slot connector on the FPGA module can be connected to the development board. There is a 0.97V~1.03V-volt supply voltage required for the device to operate. An FPGA belonging to the Kintex?-7 series is referred to as an FPGA. Operating temperatures should be maintained within the 0°C~85°C TJ range at all times when the unit is in use. During the installation of this device, 500 outputs were incorporated. It is for space saving reasons that this FPGA model is contained in Tray. The total number of terminations is 900. There are 16404480 RAM bits that are available with this device. Parts related to this part can be found using its base part number XC7K325T. The RAM si2MBe of this FPGA module reaches 2MB so as to guarantee the normal operation of the program during operation. This cable has 900 pins and is designed to connect to a computer. 25475 LABs/CLBs are configured on this FPGA. The device runs on a 11.83.3V battery and requires no additional power supply to operate. I am going to present you with a device that is equipped with 900 pins. Typically, it uses a crystal oscillating at 1818MHz in order to operate. There is a memory of 1GB embedded in this FPGA module, which can be used for storing programs and data. During the process of storing and transferring data, 407600 registers are used. Data is stored in the DDR3 memory, so resource conflicts are avoided.

XC7K325T-2FBG900C Features


500 I/Os
Up to 16404480 RAM bits
900 LABs/CLBs
407600 registers

XC7K325T-2FBG900C Applications


There are a lot of Xilinx Inc. XC7K325T-2FBG900C FPGAs applications.

  • Telecommunication
  • Cryptography
  • High Performance Computing
  • Data Mining
  • Solar Energy
  • Device controllers
  • Automotive advanced driver assistance systems (ADAS)
  • Military Temperature
  • Security systems
  • Computer hardware emulation
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Package

Product
Step1Product
Casing drivepipe
Step2Casing drivepipe
Anti-static bag
Step3Anti-static bag
Packaging boxes
Step4Packaging boxes
Bar-code shipping tag
Step5Bar-code shipping tag

XC7K325T-2FBG900C

technical specifications, attributes, parameters and parts with similar specifications to XC7K325T-2FBG900C.

  • Type
    Parameter
    Select All
  • ECCN Code

    3A991.D

  • Terminal Finish

    Tin/Silver/Copper (Sn96.5Ag3.0Cu0.5)

  • HTS Code

    8542.39.00.01

  • Subcategory

    Field Programmable Gate Arrays

  • Technology

    CMOS

  • Voltage - Supply

    0.97V~1.03V

  • Terminal Position

    BOTTOM

  • Terminal Form

    BALL

  • Peak Reflow Temperature (Cel)

    NOT SPECIFIED

  • Supply Voltage

    1V

  • Terminal Pitch

    1mm

  • Reach Compliance Code

    not_compliant

  • Time@Peak Reflow Temperature-Max (s)

    NOT SPECIFIED

  • Base Part Number

    XC7K325T

  • Pin Count

    900

  • Number of Outputs

    500

  • Qualification Status

    Not Qualified

  • Power Supplies

    11.83.3V

  • Memory Size

    1GB

  • Number of I/O

    500

  • RAM Size

    2MB

  • Memory Type

    DDR3

  • Clock Frequency

    1818MHz

  • Programmable Logic Type

    FIELD PROGRAMMABLE GATE ARRAY

  • Number of Logic Elements/Cells

    326080

  • Total RAM Bits

    16404480

  • Number of LABs/CLBs

    25475

  • Speed Grade

    -2

  • Number of Registers

    407600

  • Combinatorial Delay of a CLB-Max

    0.61 ns

  • Height Seated (Max)

    2.54mm

  • Length

    31mm

  • Width

    31mm

  • RoHS Status

    ROHS3 Compliant

  • Factory Lead Time

    11 Weeks

  • Contact Plating

    Copper, Silver, Tin

  • Mounting Type

    Surface Mount

  • Package / Case

    900-BBGA, FCBGA

  • Surface Mount

    YES

  • Number of Pins

    900

  • Operating Temperature

    0°C~85°C TJ

  • Packaging

    Tray

  • Published

    2009

  • Series

    Kintex®-7

  • JESD-609 Code

    e1

  • Pbfree Code

    yes

  • Part Status

    Active

  • Moisture Sensitivity Level (MSL)

    4 (72 Hours)

  • Number of Terminations

    900

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