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  • STM32F103C8T6
  • MFI343S00177
  • STM32F407VET6
  • ATMEGA328P-PU
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Items : %s%s

RF Misc ICs and Modules

Contact Plating

  • Copper, Silver, Tin
  • Gold
  • Gold, Silver
  • Lead, Silver, Tin
  • Lead, Tin
  • Silver, Tin
  • Tin

ECCN Code

  • 3A001.A.11.B
  • 3A001.A.3
  • 3A991.C.3
  • 5A991
  • 5A991.A
  • 5A991.B
  • 5A991.B.1
  • 5A991.G
  • 5A991.H
  • EAR99

Factory Lead Time

  • 10 Weeks
  • 11 Weeks
  • 111 Weeks
  • 12 Weeks
  • 13 Weeks
  • 14 Weeks
  • 15 Weeks
  • 16 Weeks
  • 17 Weeks
  • 18 Weeks
  • 19 Weeks
  • 2 Weeks
  • 20 Weeks
  • 21 Weeks
  • 22 Weeks
  • 23 Weeks
  • 24 Weeks
  • 25 Weeks
  • 26 Weeks
  • 3 Weeks
  • 31 Weeks
  • 4 Weeks
  • 5 Weeks
  • 6 Weeks
  • 7 Weeks
  • 8 Weeks
  • 9 Weeks
  • 98 Weeks

fmax-Min

  • 1000 MHz
  • 10000 MHz
  • 11000 MHz
  • 12000 MHz
  • 1300 MHz
  • 13000 MHz
  • 13500 MHz
  • 14500 MHz
  • 1500 MHz
  • 18000 MHz
  • 2200 MHz
  • 25000 MHz
  • 26000 MHz
  • 300 MHz
  • 3000 MHz
  • 3300 MHz
  • 3500 MHz
  • 5000 MHz
  • 6000 MHz
  • 7000 MHz
  • 8000 MHz

Housing Material

  • Aluminium

JESD-609 Code

  • e0
  • e1
  • e2
  • e3
  • e4
  • e6

Lifecycle Status

  • ACTIVE (Last Updated: 1 day ago)
  • ACTIVE (Last Updated: 1 week ago)
  • ACTIVE (Last Updated: 2 days ago)
  • ACTIVE (Last Updated: 3 days ago)
  • ACTIVE (Last Updated: 4 days ago)
  • ACTIVE (Last Updated: 5 days ago)
  • ACTIVE (Last Updated: 6 days ago)
  • ACTIVE (Last Updated: 6 months ago)
  • ACTIVE (Last Updated: 7 months ago)
  • ACTIVE (Last Updated: 8 months ago)
  • CONTACT ADI (Last Updated: 3 weeks ago)
  • IN PRODUCTION (Last Updated: 1 month ago)
  • LAST SHIPMENTS (Last Updated: 1 week ago)
  • LAST SHIPMENTS (Last Updated: 2 weeks ago)
  • LAST SHIPMENTS (Last Updated: 3 days ago)
  • LAST SHIPMENTS (Last Updated: 4 days ago)
  • LAST SHIPMENTS (Last Updated: 9 hours ago)
  • LAST TIME BUY (Last Updated: 1 week ago)
  • LAST TIME BUY (Last Updated: 2 days ago)
  • LAST TIME BUY (Last Updated: 2 weeks ago)
  • LAST TIME BUY (Last Updated: 3 days ago)
  • LAST TIME BUY (Last Updated: 3 months ago)
  • LAST TIME BUY (Last Updated: 4 days ago)
  • LAST TIME BUY (Last Updated: 5 days ago)
  • LAST TIME BUY (Last Updated: 6 days ago)
  • LIFEBUY (Last Updated: 1 week ago)
  • LIFEBUY (Last Updated: 2 days ago)
  • LIFETIME (Last Updated: 1 week ago)
  • LIFETIME (Last Updated: 2 days ago)
  • NRND (Last Updated: 6 days ago)
  • OBSOLETE (Last Updated: 1 day ago)
  • OBSOLETE (Last Updated: 1 month ago)
  • OBSOLETE (Last Updated: 1 week ago)
  • OBSOLETE (Last Updated: 2 days ago)
  • OBSOLETE (Last Updated: 2 weeks ago)
  • OBSOLETE (Last Updated: 3 days ago)
  • OBSOLETE (Last Updated: 3 weeks ago)
  • OBSOLETE (Last Updated: 4 days ago)
  • OBSOLETE (Last Updated: 5 days ago)
  • OBSOLETE (Last Updated: 6 days ago)
  • PRODUCTION (Last Updated: 1 month ago)
  • PRODUCTION (Last Updated: 1 week ago)
  • PRODUCTION (Last Updated: 2 days ago)
  • PRODUCTION (Last Updated: 2 weeks ago)
  • PRODUCTION (Last Updated: 3 days ago)
  • PRODUCTION (Last Updated: 3 months ago)
  • PRODUCTION (Last Updated: 3 weeks ago)
  • PRODUCTION (Last Updated: 4 days ago)
  • PRODUCTION (Last Updated: 4 months ago)
  • PRODUCTION (Last Updated: 4 weeks ago)

Material

  • Steel

Mfr

  • Acconeer AB
  • Ampleon USA Inc.
  • Anadigics
  • Analog Devices Inc.
  • Analog Devices Inc./Maxim Integrated
  • Broadcom Limited
  • CML Microcircuits
  • Harris Corporation
  • Infineon Technologies
  • MACOM Technology Solutions
  • Microchip Technology
  • Mini-Circuits
  • National Semiconductor
  • onsemi
  • Renesas Electronics America Inc
  • Sanyo
  • Seeed Technology Co., Ltd
  • Semtech Corporation
  • Skyworks Solutions Inc.
  • STMicroelectronics
  • Texas Instruments
  • Zarlink

Moisture Sensitivity Level (MSL)

  • 1
  • 1 (Unlimited)
  • 1 (Unlimited)
  • 2 (1 Year)
  • 2 (1 Year)
  • 2A (4 Weeks)
  • 2A (4 Weeks)
  • 3
  • 3 (168 Hours)
  • 3 (168 Hours)
  • 4
  • 4 (72 Hours)
  • 4 (72 Hours)
  • Not Applicable
  • NOT SPECIFIED
  • Vendor Undefined

Mount

  • Flanges
  • Front
  • Screw
  • Surface Mount
  • Through Hole

Mounting Feature

  • CHASSIS MOUNT
  • PANEL MOUNT

Mounting Type

  • -
  • Card Edge
  • Chassis Mount
  • Connector Mount
  • Flange Mount
  • Surface Mount
  • Surface Mount, Wettable Flank
  • Through Hole
  • User Defined

Number of Pins

  • 10
  • 100
  • 108
  • 11
  • 12
  • 120
  • 121
  • 128
  • 14
  • 144
  • 16
  • 160
  • 168
  • 17
  • 196
  • 2
  • 20
  • 24
  • 256
  • 28
  • 30
  • 32
  • 352
  • 36
  • 388
  • 4
  • 40
  • 44
  • 48
  • 484
  • 5
  • 56
  • 6
  • 64
  • 7
  • 72
  • 8
  • 80
  • 84

Number of Terminals

  • 10
  • 12
  • 14
  • 32
  • 6
  • 8

Number of Terminations

  • 10
  • 100
  • 108
  • 11
  • 12
  • 120
  • 121
  • 128
  • 14
  • 144
  • 16
  • 160
  • 161
  • 18
  • 196
  • 2
  • 20
  • 204
  • 22
  • 23
  • 24
  • 256
  • 28
  • 3
  • 308
  • 32
  • 352
  • 36
  • 388
  • 4
  • 40
  • 44
  • 48
  • 484
  • 5
  • 56
  • 6
  • 64
  • 7
  • 72
  • 8
  • 80
  • 81
  • 84

P1dB

  • 11.5 dBm
  • 15.1 dBm

Package / Case

  • -
  • 10-SMD, Flat Lead
  • 10-UFQFN Exposed Pad
  • 10-WFDFN Exposed Pad
  • 10-XFLGA
  • 10-XFQFN
  • 10-XFQFN Exposed Pad
  • 100-BQFP
  • 100-LFBGA
  • 100-LQFP
  • 100-TQFP Exposed Pad
  • 108-LGA
  • 11-XFBGA, WLCSP
  • 1152-BBGA, FCBGA
  • 12-UFBGA, WLCSP
  • 12-UFQFN
  • 12-UFQFN Exposed Pad
  • 12-VFQFN Exposed Pad
  • 12-WFBGA, WLCSP
  • 120-BQFP
  • 121-BGA, CSPBGA
  • 121-LFBGA
  • 128-BFQFP
  • 128-BQFP
  • 128-LFBGA
  • 14-DIP (0.300, 7.62mm)
  • 14-SOIC (0.154, 3.90mm Width)
  • 14-SOIC (0.209, 5.30mm Width)
  • 144-LFBGA, CSPBGA
  • 144-LFBGA, FCCSPBGA
  • 144-QFP
  • 16-CLCC Exposed Pad
  • 16-CSMD Module
  • 16-DIP (0.300, 7.62mm)
  • 16-DIP Module
  • 16-LFCQFN Exposed Pad
  • 16-LFQFN Exposed Pad
  • 16-LSSOP (0.173, 4.40mm Width)
  • 16-SIP Formed Leads
  • 16-SMD, No Lead
  • 16-SOIC (0.154, 3.90mm Width)
  • 16-SOIC (0.209, 5.30mm Width)
  • 16-SSOP (0.154, 3.90mm Width)
  • 16-SSOP (0.154, 3.90mm Width) Exposed Pad
  • 16-UFQFN Exposed Pad
  • 16-VFCQFN Exposed Pad
  • 16-VFQFN Exposed Pad
  • 16-VQFN Exposed Pad
  • 16-VQFN Exposed Pad, CSP
  • 16-WFQFN Exposed Pad
  • 16-WFQFN Exposed Pad, CSP
  • 16-XFQFN Exposed Pad
  • 160-BGA
  • 160-LBGA
  • 161-TFBGA, FCCSP
  • 169-LBGA
  • 17-VFQFN, 17-MLF®
  • 18-DIP (0.300, 7.62mm)
  • 196-BBGA
  • 196-LFBGA
  • 196-LFBGA Exposed Pad
  • 2-SMD Module
  • 2-SMD, No Lead
  • 20-CDIP (0.300, 7.62mm)
  • 20-CLCC
  • 20-DIP (0.300, 7.62mm)
  • 20-LSSOP (0.173, 4.40mm Width)
  • 20-SMD Module
  • 20-SOIC (0.295, 7.50mm Width)
  • 20-SSOP (0.154, 3.90mm Width)
  • 20-SSOP (0.209, 5.30mm Width)
  • 20-TQFN Exposed Pad
  • 20-TSSOP (0.173, 4.40mm Width)
  • 20-TSSOP (0.173, 4.40mm Width) Exposed Pad
  • 20-UFBGA, WLCSP
  • 20-VFQFN Exposed Pad
  • 20-WFQFN Exposed Pad
  • 20-WQFN Exposed Pad
  • 204-BLGA
  • 24-CLCC Exposed Pad
  • 24-PowerQFN
  • 24-SMD Module
  • 24-SMD Module, No Lead
  • 24-SOIC (0.295, 7.50mm Width)
  • 24-SSOP (0.209, 5.30mm Width)
  • 24-TFCQFN Exposed Pad
  • 24-TFLGA Exposed Pad
  • 24-TFQFN Exposed Pad
  • 24-VFCQFN Exposed Pad
  • 24-VFQFN
  • 24-VFQFN Exposed Pad
  • 24-VFQFN Exposed Pad, CSP
  • 24-WFQFN Exposed Pad
  • 256-BGA
  • 256-LBGA, CSBGA
  • 28-SMD Module
  • 28-SSOP (0.154, 3.90mm Width)
  • 28-TSSOP (0.173, 4.40mm Width)
  • 28-VFQFN Exposed Pad
  • 28-VQFN Exposed Pad
  • 28-WFQFN Exposed Pad
  • 3-SMD, No Lead
  • 3-XFBGA, WLCSP
  • 30-BSOP (0.295, 7.50mm Width)
  • 32-CLCC
  • 32-LFQFN Exposed Pad, CSP
  • 32-PowerVFQFN
  • 32-TFCQFN Exposed Pad
  • 32-TFLGA Exposed Pad
  • 32-TFQFN Exposed Pad
  • 32-VFQFN Exposed Pad
  • 32-VFQFN Exposed Pad, CSP
  • 32-WFLGA Exposed Pad
  • 32-WFQFN Exposed Pad
  • 32-WFQFN Exposed Pad, CSP
  • 352-LBGA Exposed Pad
  • 36-VFQFN Exposed Pad, CSP
  • 36-WFQFN Exposed Pad
  • 388-BBGA Exposed Pad
  • 4-SMD Module
  • 4-SMD, No Lead
  • 4-UFBGA, WLCSP
  • 4-XFBGA
  • 4-XFBGA, FCBGA
  • 40-VFLGA Exposed Pad
  • 40-VFQFN Exposed Pad
  • 40-WFLGA Exposed Pad
  • 40-WFQFN Exposed Pad
  • 44-BSOP (0.295, 7.50mm Width)
  • 44-VFQFN Exposed Pad
  • 48-LQFP
  • 48-TQFP
  • 48-TQFP Exposed Pad
  • 48-VFQFN Exposed Pad
  • 48-WFLGA Exposed Pad
  • 48-WFQFN Exposed Pad
  • 48-WFQFN Exposed Pad, CSP
  • 484-BBGA Exposed Pad
  • 484-BGA
  • 5-SMD Module
  • 56-VFQFN Exposed Pad
  • 56-VFQFN Exposed Pad, CSP
  • 56-WFQFN Exposed Pad
  • 6-SMD, No Lead
  • 6-TSSOP, SC-88, SOT-363
  • 6-VFDFN
  • 6-WDFN Exposed Pad
  • 6-XFBGA, WLCSP
  • 64-BQFP
  • 64-LQFP
  • 64-TQFP Exposed Pad
  • 64-VFQFN Exposed Pad
  • 64-VFQFN Exposed Pad, CSP
  • 64-WFQFN Exposed Pad, CSP
  • 68-WFQFN Exposed Pad
  • 72-TFLGA
  • 72-VFLGA Exposed Pad
  • 72-VFQFN Exposed Pad, CSP
  • 8-QFN
  • 8-SMD
  • 8-SMD, Flat Lead Exposed Pad
  • 8-SMD, No Lead
  • 8-SOIC (0.154, 3.90mm Width)
  • 8-SOIC (0.154, 3.90mm Width) Exposed Pad
  • 8-SOIC (0.173, 4.40mm Width)
  • 8-SSOP (0.126, 3.20mm Width)
  • 8-TSSOP (0.173, 4.40mm Width)
  • 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
  • 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) Exposed Pad
  • 8-XFBGA, WLCSP
  • 80-LQFP
  • 80-TQFP Exposed Pad
  • 81-BLGA
  • 84-LCC (J-Lead)
  • BGA
  • CS19-1
  • Die
  • DO-215AA, SMB Gull Wing
  • E50
  • E50SM
  • FCBGA
  • Flat Box, Terminator
  • FP-2
  • H50
  • Inline Module
  • Module
  • Module, SMA Connectors
  • N-Type In-Line Module
  • PLCC
  • QFN
  • QFN EP
  • SMA In-Line Module
  • SOIC
  • SOT-23-6
  • TO-8 Style, 4 Lead

Packaging

  • 100 per Card
  • Box
  • Bulk
  • Cut Tape (CT)
  • Digi-Reel®
  • Strip
  • Tape & Reel
  • Tape & Reel (TR)
  • Tray
  • Tube

Part Status

  • Active
  • Discontinued
  • Last Time Buy
  • Not For New Designs
  • Obsolete

Pbfree Code

  • icon-pbfree yes
  • no
  • yes

Published

  • 1996
  • 1997
  • 1998
  • 1999
  • 2000
  • 2001
  • 2002
  • 2003
  • 2004
  • 2005
  • 2006
  • 2007
  • 2008
  • 2009
  • 2010
  • 2011
  • 2012
  • 2013
  • 2014
  • 2015
  • 2016
  • 2017

Resistance

  • 100Ohm
  • 10MOhm
  • 12.5Ohm
  • 122Ohm
  • 150Ohm
  • 200Ohm
  • 25Ohm
  • 50Ohm

Series

  • *
  • -
  • 2690
  • AD7011
  • AD9856
  • AD9857
  • AD9986
  • ADMV1009
  • ADMV1011
  • ADMV1012
  • ADMV4530
  • AFE8406
  • AMMP-6530
  • Automotive
  • Automotive, AEC-Q100
  • CHF
  • CHF - RF Power
  • CU
  • FirmASIC®
  • FR
  • GC1012
  • GC3011
  • GC5316
  • GC5318
  • GF-78
  • GF-87
  • GF-870x
  • GX62476
  • HSP50110
  • IQCM-300
  • ISL5239
  • LoRa?
  • LoRa™
  • MAX
  • MAX2223
  • MAX2320
  • MAX2321
  • MAX2538
  • MAX2750
  • MAX2751
  • MAX2752
  • MiniGate™
  • MLP71xx
  • P1400
  • P1500
  • Parascan™
  • PLLatinum?
  • PLLatinum™
  • RedBox
  • RPA
  • SiGe
  • TRF1112
  • TRF1121
  • UltraCMOS®
  • UltraCMOS®, DuNE™
  • Xinger III®
  • Xinger®
  • ZL40800
  • ZL40802
  • ZL40804
  • ZL40813
  • ZL40815
  • ZL40818

Supplier Device Package

  • -
  • 10-QFN (2x2)
  • 100-LFBGA (9x9)
  • 100-QFP (14x20)
  • 12-QFN (2x2)
  • 12-QFN (3x3)
  • 12-SMT (3x3)
  • 120-MQFP (28x28)
  • 128-LQFP (14x14)
  • 14-DMP
  • 14-PDIP
  • 14-SOIC
  • 144-CSBGA (10x10)
  • 144-CSPBGA (10x10)
  • 16-CLCC-HS (6x6)
  • 16-CSMT (3x3)
  • 16-CSMT (5x5)
  • 16-DIP
  • 16-DMP
  • 16-HXQFN (3x3)
  • 16-MCLP (3.5x2.5)
  • 16-PDIP
  • 16-PQFN (3x3)
  • 16-PQFN (7x7)
  • 16-QSOP
  • 16-SIP
  • 16-SMT (3x3)
  • 16-SOIC
  • 16-SSOP
  • 16-TMLF® (2.0x2.5)
  • 16-WLCSP (1.56x1.56)
  • 160-BGA (15x15)
  • 169-BGA (13x13)
  • 17-MLF® (2.5x2.8)
  • 18-DIP
  • 180-FCBGA (15x15)
  • 196-BGA (12x12)
  • 196-BGA (15x15)
  • 2-SMD
  • 20-QSOP
  • 20-SO
  • 20-SOIC
  • 20-SSO
  • 20-SSOP
  • 20-TQFN (4x4)
  • 20-TQFN (5x5)
  • 20-TSSOP
  • 24-CLCC (3.9x3.9)
  • 24-CQFN (4x4)
  • 24-CSMT (4x4)
  • 24-LGA (4x4)
  • 24-PQFN (4x4)
  • 24-QFN (3x4)
  • 24-QFN (4x4)
  • 24-SMT (4x4)
  • 24-SSOP
  • 24-VQLP (3.5x3.5)
  • 24-VSOP
  • 256-CSBGA (17x17)
  • 256-PBGA (17x17)
  • 28-LGA (5.5x5.0)
  • 28-MCM (6x6)
  • 28-QFN (5x5)
  • 28-QFN (6x6)
  • 28-QFN-EP (5x5)
  • 28-SOP
  • 28-SSOP
  • 28-SSOP/QSOP
  • 28-TQFN (5x5)
  • 28-WQFN (5x5)
  • 30-MFPSD
  • 30-SSOP
  • 32-CSMT (5x5)
  • 32-LCC (5x5)
  • 32-LFCSP (5x5)
  • 32-LFCSP-WQ (5x5)
  • 32-QFN (5x5)
  • 32-QFN (6x6)
  • 32-SMT (5x5)
  • 32-TQFN-EP (5x5)
  • 32-VQFN (5x5)
  • 324-BGA-ED (15x15)
  • 352-PBGA (27x27)
  • 388-BGA EP (27x27)
  • 4-WLCSP (0.63x0.61)
  • 40-LFCSP-VQ (6x6)
  • 40-LGA (6x6)
  • 40-QFN (6x6)
  • 40-TQFN (5x5)
  • 40-TQFN (6x6)
  • 40-TQFN-EP (6x6)
  • 40-VQFN (6x6)
  • 48-LFCSP-WQ (7x7)
  • 48-LGA (7x7)
  • 48-LQFP (7x7)
  • 48-QFN (7x7)
  • 48-TQFN (7x7)
  • 48-TQFP (7x7)
  • 48-TQFP-EP (7x7)
  • 48-VQFN (7x7)
  • 484-BGA (23x23)
  • 50-FCCSP (5.5x5.2)
  • 56-QFN (8x8)
  • 64-LFCSP-VQ (9x9)
  • 64-LFCSP-WQ (9x9)
  • 64-LQFP (10x10)
  • 64-QIPE (14x14)
  • 64-VQFN (9x9)
  • 68-QFN (7x7)
  • 72-LFCSP-VQ (10x10)
  • 72-LGA (10x10)
  • 8-CDIP
  • 8-DIP
  • 8-MSG
  • 8-MSOP
  • 8-MSOP-EP
  • 8-SMT
  • 8-SOIC
  • 8-SON (2.9x2.8)
  • 8-SOP
  • 8-SSOP
  • 8-TSSOP
  • 8-VFDFPN (5x6)
  • 8-WLCSP (.92x1.69)
  • 8-WLCSP (0.83x0.65)
  • 80-LGA (18x18)
  • 80-TQFP (14x14)
  • 84-PLCC (29.31x29.31)
  • CS121
  • CS122
  • CS19-1
  • CS23
  • CS301
  • Die
  • DO-215AA (SMB)
  • E50
  • E50SM
  • FP-2
  • GU1414
  • H50
  • Module
  • OMP-400-8G-1
  • PG-DSO-8
  • PG-TSLP-10-2
  • RH-3
  • SC-70-6
  • SF-1
  • SMA
  • SMD
  • SOT-23-6
  • SOT-23-8
  • TO-8
  • TSNP-7-10
  • US8

Surface Mount

  • NO
  • YES

Temperature Coefficient

  • 150 ppm/°C

Terminal Shape

  • FLAT
  • WRAPAROUND

Termination

  • Axial
  • SMD/SMT

Tolerance

  • 2%
  • 5%

Type

  • General Purpose
  • Integrated Circuit (IC)
  • Pocket

Weight

  • 1.028804g
  • 1.319103g
  • 1.620005g
  • 123.008581mg
  • 130.492855mg
  • 137.410139mg
  • 139.989945mg
  • 155.100241mg
  • 188.609377mg
  • 190.990737mg
  • 280.405133mg
  • 288.002805mg
  • 338.011364mg
  • 342.689036mg
  • 360.605934mg
  • 38.895546mg
  • 50.008559mg
  • 511.793941mg
  • 540.001716mg
  • 57.09594mg
  • 665.986997mg
  • 70.788759mg
  • 73.992255mg
  • 92.589543mg
  • 928.191737mg
  • 935.10902mg
  • 937.688827mg
  • 951.693491mg
  • 994.501271mg
Reset
Apply
    Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Packaging Published Part Status Moisture Sensitivity Level (MSL) Number of Terminations ECCN Code Max Operating Temperature Min Operating Temperature Operating Supply Voltage Length RoHS Status Lead Free Contact Plating Radiation Hardening Number of Pins Package / Case Max Supply Voltage REACH SVHC Min Supply Voltage Frequency Height Width Operating Supply Current Max Supply Current Height Seated (Max) HTS Code Number of Functions Nominal Supply Current JESD-609 Code Terminal Finish Terminal Position Terminal Form Peak Reflow Temperature (Cel) Supply Voltage Time@Peak Reflow Temperature-Max (s) Pin Count Temperature Grade Surface Mount Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Subcategory Qualification Status Power Supplies Gain Consumer IC Type Power Dissipation-Max Supply Current-Max Telecom IC Type
    HSP50415VIZ HSP50415VIZ Intersil (Renesas Electronics America) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Surface Mount 2000 Active 3 100 85°C -40°C 3.3V 20mm RoHS Compliant Lead Free Tin No 100 14mm 500mA 3.4mm 8542.39.00.01 1 e3 QUAD GULL WING 245 3.3V 40 100 INDUSTRIAL 0.65mm Other Telecom ICs 1.75W 0.5mA TELECOM CIRCUIT
    QHX220IQT7 QHX220IQT7 Intersil (Renesas Electronics America) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download Digi-Reel® 2005 Active 1 16 85°C -40°C 1.8V 3mm RoHS Compliant 16 QFN EP 1.9V No SVHC 1.7V 300MHz 3mm 1mm 8542.39.00.01 1 e3 Matte Tin (Sn) - annealed QUAD NO LEAD 260 1.8V 30 16 INDUSTRIAL YES 0.5mm Not Qualified TELECOM CIRCUIT
    HSP50210JI-52Z HSP50210JI-52Z Intersil (Renesas Electronics America) 51.7002
    Add to Cart

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    		 0.00000000 download 2000 Active 4 (72 Hours) 84 85°C -40°C 5V 29.31mm RoHS Compliant No 84 PLCC 5.25V 4.75V 52MHz 29.31mm 500μA 4.57mm 8542.39.00.01 1 e3 Matte Tin (Sn) - annealed QUAD J BEND 245 5V 84 INDUSTRIAL YES 1.27mm Other Telecom ICs 5V 0.225mA TELECOM CIRCUIT
    QHX100IQSR QHX100IQSR Intersil (Renesas Electronics America) 0.0000
    RFQ

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    HSP50216KIZ HSP50216KIZ Intersil (Renesas Electronics America) 0.0000
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    Min: 1

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    		 0.00000000 download 13 Weeks 2001 Active 3 196 85°C -40°C 3.45V 12mm RoHS Compliant 196 BGA 12mm 850mA 1.5mm 8542.39.00.01 1 e3 MATTE TIN BOTTOM BALL 260 3.3V 40 196 INDUSTRIAL YES 0.8mm Not Qualified 96 dB BASEBAND CIRCUIT
    ISL5239KIZ ISL5239KIZ Intersil (Renesas Electronics America) 0.0000
    RFQ

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    		 0.00000000 download 2001 3 196 1.8V 15mm RoHS Compliant Lead Free No 196 BGA 1.89V 1.71V 15mm 1.5mm 8542.39.00.01 1 300mA e3 MATTE TIN BOTTOM BALL 260 40 196 INDUSTRIAL YES 1mm 85°C -40°C CONSUMER CIRCUIT
    HSP50214BVIZ HSP50214BVIZ Intersil (Renesas Electronics America) 0.0000
    RFQ

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    		 0.00000000 download 13 Weeks 1999 Active 3 120 EAR99 85°C -40°C 28mm RoHS Compliant No 120 28mm 4.07mm 8542.39.00.01 1 e3 MATTE TIN QUAD GULL WING 245 5V 40 120 INDUSTRIAL YES 0.8mm TELECOM CIRCUIT
    HSP50110JC-52 HSP50110JC-52 Intersil (Renesas Electronics America) 0.0000
    RFQ

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    		 0.00000000 download 2001 Active 4 84 EAR99 5V 29.31mm RoHS Compliant Contains Lead No 84 PLCC 29.31mm 350mA 4.57mm 8542.39.00.01 1 e0 Tin/Lead (Sn/Pb) QUAD J BEND 225 5V 84 COMMERCIAL YES 1.27mm 70°C TELECOM CIRCUIT
    QHX100IQT7 QHX100IQT7 Intersil (Renesas Electronics America) 0.0000
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    HSP50110JI-52 HSP50110JI-52 Intersil (Renesas Electronics America) 0.0000
    RFQ

    Min: 1

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    		 0.00000000 download 2001 Active 4 84 EAR99 5V 29.31mm RoHS Compliant Contains Lead No 84 PLCC 29.31mm 350mA 4.57mm 8542.39.00.01 1 e0 Tin/Lead (Sn/Pb) QUAD J BEND 225 5V 84 INDUSTRIAL YES 1.27mm 85°C -40°C TELECOM CIRCUIT
    HSP50214BVCZ HSP50214BVCZ Intersil (Renesas Electronics America) 0.0000
    RFQ

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    		 0.00000000 download 7 Weeks 1999 Active 3 120 70°C 0°C 5V 28mm RoHS Compliant Lead Free No 120 28mm 420mA 4.07mm 8542.39.00.01 1 e3 Matte Tin (Sn) QUAD GULL WING 245 5V 40 120 COMMERCIAL YES 0.8mm TELECOM CIRCUIT
    HSP50210JC-52Z HSP50210JC-52Z Intersil (Renesas Electronics America) 0.0000
    RFQ

    Min: 1

    Mult: 1

    		 0.00000000 download 2000 Active 4 84 70°C 0°C 5V 29.31mm RoHS Compliant 84 PLCC 5.25V 4.75V 52MHz 29.31mm 500μA 4.57mm 8542.39.00.01 1 e3 Matte Tin (Sn) - annealed QUAD J BEND 245 5V NOT SPECIFIED 84 COMMERCIAL YES 1.27mm Other Telecom ICs Not Qualified 5V 0.225mA TELECOM CIRCUIT
    HSP50016JM-5296R3571 HSP50016JM-5296R3571 Intersil (Renesas Electronics America) 0.0000
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    		 0.00000000 RoHS Compliant
    QHX220IQSR QHX220IQSR Intersil (Renesas Electronics America) 0.0000
    RFQ

    Min: 1

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    		 0.00000000 download Surface Mount 2005 Active 1 16 85°C -40°C 1.8V 3mm RoHS Compliant Tin No 16 QFN EP 1.9V 1.7V 300MHz 950μm 3mm 8542.39.00.01 1 e3 QUAD 260 1.8V 30 16 INDUSTRIAL 0.5mm TELECOM CIRCUIT
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