Items : %s%s
Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | Length | RoHS Status | Lead Free | REACH SVHC | Height | Width | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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732997 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | Hydro-X | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | Water Soluble | |||||||||||||||
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BARSN42BI57AG1 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn42Bi57Ag1 (42/57/1) | Bar, 1 lb (454g) | Lead Free | 280°F 138°C | |||||||||||||||||||
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SMD2SWLF.031 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | Spool, 1 oz (28.35g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | |||||||||||||||||
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NC2SWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||||
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SMD3SW.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD3 | Active | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn62Pb36Ag2 (62/36/2) | Spool, 4 oz (113.40g) | Leaded | 354°F 179°C | No-Clean, Water Soluble | |||||||||||||||||
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BARSN99.3CU0.7 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 1 lb (454g) | Lead Free | 441°F 227°C | |||||||||||||||||||
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SMDSWLF.006 50G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.006 0.15mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 34 AWG, 38 SWG | Spool, 1.76 oz (50g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
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TS391LT500C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Cartridge, 17.64 oz (500g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||||||
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90-7068-9850 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2016 | 296 | Obsolete | 1 (Unlimited) | 0.010 0.25mm | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 30 AWG, 33 SWG | Spool, 3.53 oz (100g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||||||||||||||
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732999 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | C511™ | Active | Not Applicable | 0.048 1.22mm | Non-RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||||||
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WBNCSAC20-4OZ | SRA Soldering Products | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2 Weeks | Active | 1 (Unlimited) | 0.020 0.51mm | RoHS Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 4 oz (113.40g) | Lead Free | 430°F 221°C | No-Clean | ||||||||||||||||||
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4902P-15G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | 4902 | Active | Not Applicable | Solder Paste | 35°F~50°F 2°C~10°C | 12 Months | Date of Manufacture | Bi57Sn42Ag1 (57/42/1) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 281°F 138°C | No-Clean | |||||||||||||||
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SMD2SW.020 2OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 2 oz (56.70g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | |||||||||||||||||
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SMDLTLFP | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2015 | Active | Not Applicable | ROHS3 Compliant | No SVHC | 15g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Syringe, 0.53 oz (15g), 5cc | Lead Free | 281°F 138°C | No-Clean | |||||||||||
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TS991SNL500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | ||||||||||||||||||||||||||||||
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386840 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2000 | 370 | Obsolete | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | 1.1lbs 499g | 23 AWG | Wire Solder | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||||||||||
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1769647 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | HF212 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 21.16 oz (600g) | Lead Free | 423°F 217°C | No-Clean | |||||||||||||||
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BARSN62PB36AG2-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | Leaded | 354°F 179°C | |||||||||||||||||||
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SMDSWLF.015 1OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Spool, 1 oz (28.35g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||||
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SMD291AXT5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 0.53 oz (15g), 5cc | Leaded | 361°F 183°C | No-Clean | ||||||||||||||||
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SMDLTLFP60T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | 2015 | Active | Not Applicable | 76.2mm | ROHS3 Compliant | No SVHC | 76.2mm | 76.2mm | 60g | Solder Paste, Two Part Mix | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 2.12 oz (60g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||
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92-6337-8809 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.025 0.64mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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1817250 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Bar | 2000 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F 217°C | ||||||||||||||||
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92-6337-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2015 | 245 | Active | 1 (Unlimited) | 0.031 0.79mm | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | No-Clean | |||||||||||||||
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SMD2SWLF.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | 1 (Unlimited) | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn99.3Cu0.7 (99.3/0.7) | 24 AWG, 25 SWG | Tube, 0.7 oz (19.85g) | Lead Free | 441°F 227°C | No-Clean, Water Soluble | ||||||||||||||||
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29-4060-0177 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.250 6.35mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 2 AWG, 3 SWG | Spool | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||||||||
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4866-227G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Spool | 2009 | 4860 | Obsolete | Not Applicable | 0.040 1.02mm | Non-RoHS Compliant | 226.796185g | Wire Solder | Sn63Pb37 (63/37) | 18 AWG, 19 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean | ||||||||||||||
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24-7031-8801 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | ROHS3 Compliant | Wire Solder | 50°F~104°F 10°C~40°C | 21 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 428°F~454°F 219°C~235°C | No-Clean | ||||||||||||||||||
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24-7340-0026 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | Rosin Activated (RA) | |||||||||||||
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24-6040-0039 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 44 | Active | Not Applicable | 0.040 1.02mm | 76.2mm | Non-RoHS Compliant | Contains Lead | Unknown | 76.2mm | 76.2mm | 1.016 mm | 1lb 453.59g | 18 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) |
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TS991SNL500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (500g jar)
Price: 0.0000
RFQ -
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SMDLTLFP60T4 Chip Quik Inc.
CHIP QUIK SMDLTLFP60T4 SOLDER PASTE, SN, BI, AG, 138DEG C, 60G
Price: 0.0000
RFQ -
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4866-227G MG Chemicals
Solder;0.040 Dia.;SN63/PB37;1/2 Lbs.;No Clean;Flux Core 2.20%
Price: 0.0000
RFQ -
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24-6040-0039 Kester Solder
KESTER SOLDER24-6040-0039SOLDER WIRE, 60/40 SN/PB, 190°C, 1LB
Price: 0.0000
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