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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | REACH SVHC | Outside Diameter | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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SMD291AX10T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Syringe | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Syringe, 1.23 oz (35g), 10cc | Leaded | 361°F 183°C | No-Clean | |||||||||||
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SMDLTLFP250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | Lead Free | 281°F 138°C | No-Clean | |||||||||||
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SMDSWLF.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||
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BARSN62PB36AG2-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | Non-RoHS Compliant | Bar Solder | Sn62Pb36Ag2 (62/36/2) | Bar, 0.5 lb (227g) | Leaded | 354°F 179°C | ||||||||||||||||
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1817250 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 9 Weeks | Bar | 2000 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 423°F 217°C | |||||||||||||
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04-1090-0000 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | Bar Solder | Pb90Sn10 (90/10) | Bar, 1.66 lbs (750g) | Leaded | |||||||||||||||||||
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07-7031-1900 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2012 | ULTRAPURE® | Active | 1 (Unlimited) | ROHS3 Compliant | Lead Free | Bar Solder | Sn97Cu2Sb0.8Ag0.2 (97/2/0.8/0.2) | Bar, 7.4 lbs (3.36kg) | Lead Free | |||||||||||||||
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SMD2150-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.010 0.25mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||
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SMD291SNL250T3 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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TS991SNL35T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||||
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SMD291SNL250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||||
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SMD291SNL10T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | Syringe | 2014 | Active | Not Applicable | ROHS3 Compliant | 0.077lb 34.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 423°F~428°F 217°C~220°C | No-Clean | |||||||||
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SMD4300SNL250T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2015 | Active | Not Applicable | ROHS3 Compliant | 0.551lb 249.93g | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | ||||||||||
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24-6337-0053 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2007 | 44 | Active | Not Applicable | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Unknown | 1.27 mm | 1lb 453.59g | 16 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Activated (RA) | |||||
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SMD2036-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.018 0.46mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||||
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544784 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | Water Soluble | ||||||||||||
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CQ100GE.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Spool, 1 lb (454 g) | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||
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SMDSWLF.015 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | Active | Not Applicable | 0.015 0.38mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 27 AWG, 28 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||
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1434537 | LOCTITE | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 3 Weeks | LF318M | Active | Not Applicable | RoHS Compliant | Solder Paste | 6 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 21.16 oz (600g) | Lead Free | 350°F 177°C | No-Clean | ||||||||||||||
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1354298 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2000 | WS200™ | Obsolete | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||||
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386832 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | 370 | Active | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | 1.1lbs 499g | 14 AWG | Wire Solder | Sn60Pb40 (60/40) | 14 AWG, 16 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | |||||||||
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SS-S020 | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | 24 AWG | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool | Leaded | 361°F 183°C | Water Soluble | |||||||||||||||
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OS-S031 | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2009 | Obsolete | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Lead Free | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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MMF006630 | Micro-Measurements (Division of Vishay Precision Group) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Jar | Active | 1 (Unlimited) | RoHS Compliant | Solder Paste | 41°F~77°F 5°C~25°C | 9 Months | Date of Manufacture | Ag40Cu30Zn28Ni2 (40/30/28/2) | Jar, 1 oz (28g) | Lead Free | 1220°F~1435°F 660°C~780°C | ||||||||||||||
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17555LF | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Spool | 2015 | Active | Not Applicable | 0.039 0.99mm | ROHS3 Compliant | Wire Solder | 60 Months | Date of Manufacture | Sn99.3Cu0.7 (99.3/0.7) | 18 AWG, 19 SWG | Spool, 3.53 oz (100g) | Lead Free | 440°F 227°C | Rosin Activated (RA) | ||||||||||
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4897-454G | MG Chemicals | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | 2009 | 4890 | Active | Not Applicable | 0.050 1.27mm | Non-RoHS Compliant | 1lb 453.59g | 16 AWG | Wire Solder | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~376°F 183°C~191°C | Rosin Activated (RA) | |||||||||
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OS-S031AS | MENDA/EasyBraid | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 2009 | Obsolete | Not Applicable | 0.031 0.79mm | Non-RoHS Compliant | Lead Free | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool | Leaded | 361°F 183°C | No-Clean | |||||||||||||
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17551 | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Bag | 2015 | Active | Not Applicable | 0.039 0.99mm | Non-RoHS Compliant | Wire Solder | 60 Months | Date of Manufacture | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Tube, 0.71 oz (20g) | Leaded | 360°F 180°C | Rosin Activated (RA) | |||||||||||
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732998 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C511™ | Active | Not Applicable | 0.064 1.63mm | RoHS Compliant | 1lb 453.59g | 14 AWG | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F 217°C | No-Clean | |||||||||
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NC191SNL250T5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Smooth Flow™ | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar, 8.8 oz (250g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean |
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07-7031-1900 Kester Solder
SN97AG.20SB.80CU02 FLO-BAR Solder - Sold IN 50 LB Boxes
Price: 0.0000
RFQ -
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TS991SNL35T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste NC (No-Clean) Sn96.5/Ag3.0/Cu0.5 T4 (35g syringe)
Price: 0.0000
RFQ -
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MMF006630 Micro-Measurements (Division of Vishay Precision Group)
1240-FPA SILVER SOLDER PASTE --
Price: 0.0000
RFQ -
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