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Solder
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Diameter | RoHS Status | Lead Free | Package / Case | Weight | Wire/Cable Gauge | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Wire Gauge | Form | Process | Melting Point | Flux Type |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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24-7068-6411 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 331 | Active | Not Applicable | 0.062 1.57mm | ROHS3 Compliant | Lead Free | 062 | 1lb 453.59g | 14 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | Water Soluble | ||||
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SMDPB100-S-16 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | Non-RoHS Compliant | Solder Shot | Pb100(100) | Bag, 1 lb (454g) | Leaded | 622°F 328°C | ||||||||||||||
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SMD4300SNL500T3C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months, 2 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Cartridge, 17.64 oz (500g) | Lead Free | 423°F~428°F 217°C~220°C | Water Soluble | |||||||||
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SMD2024 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.012 0.31mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||
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92-6337-9702 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Spool, 17.64 oz (500g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||
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70-2002-0310 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | R560 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Sn62Pb36Ag2 (62/36/2) | Jar, 17.64 oz (500g) | Leaded | 354°F 179°C | Water Soluble | |||||||||||
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WS991AX500T4 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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24-7080-0061 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.062 1.57mm | ROHS3 Compliant | Lead Free | Wire Solder | 50°F~104°F 10°C~40°C | Sn95Sb5 (95/5) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Lead Free | 450°F~464°F 232°C~240°C | Rosin Activated (RA) | ||||||||
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24-7068-7601 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2005 | 275 | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Lead Free | 217 | 1lb 453.59g | 20 AWG | Wire Solder | 50°F~104°F 10°C~40°C | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~424°F 217°C~218°C | No-Clean | ||||
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SMD2200-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | ||||||||||
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24-6040-9759 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2017 | 285 | Obsolete | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Mildly Activated (RMA) | |||||||||
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395451 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Spool | 2000 | C502 | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | 20 AWG | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean | |||||||
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386818 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | Hydro-X | Active | Not Applicable | 0.032 0.81mm | Non-RoHS Compliant | 1lb 453.59g | Wire Solder | 70°F~85°F 20°C~30°C | Sn63Pb37 (63/37) | 20 AWG, 21 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Water Soluble | |||||||
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85-9601-0118 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Active | 1 (Unlimited) | 0.118 3.00mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 9 AWG, 11 SWG | Spool, 22.05 lbs (10kg) | Leaded | 361°F 183°C | |||||||||||||
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24-6040-0038 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | Rosin Activated (RA) | ||||||||
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24-6040-8825 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2012 | 245 | Obsolete | 1 (Unlimited) | 0.040 1.02mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 18 AWG, 19 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | ||||||||
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24-6337-9717 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2017 | 285 | Active | 1 (Unlimited) | 0.025 0.64mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 22 AWG, 23 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||
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SMD2040 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2013 | SMD2 | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | ||||||||||
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386820 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | Hydro-X | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | 0.551lb 249.93g | 23 AWG | Wire Solder | Sn63Pb37 (63/37) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Water Soluble | |||||||
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24-6040-8816 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2012 | 245 | Obsolete | 1 (Unlimited) | 0.050 1.27mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn60Pb40 (60/40) | 16 AWG, 18 SWG | Spool, 1 lb (454 g) | Leaded | 361°F~374°F 183°C~190°C | No-Clean | |||||||||
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SMDSWLF.004 20G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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16-6337-0125 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Spool | 2010 | Solid Core Wire | Active | Not Applicable | 0.125 3.18mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Sn63Pb37 (63/37) | 8 AWG, 10 SWG | Spool, 5 lbs (2.27kg) | Leaded | 361°F 183°C | ||||||||
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SMD2028-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.014 0.36mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||
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1051209 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | 2000 | MP218 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 32°F~50°F 0°C~10°C | 6 Months | Date of Manufacture | Jar, 17.64 oz (500g) | Leaded | No-Clean | |||||||||||
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SMD4300AX500T5C | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Cartridge | 2015 | Active | Not Applicable | Non-RoHS Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 12 Months, 6 Months | Date of Manufacture | Sn63Pb37 (63/37) | Cartridge, 17.64 oz (500g) | Leaded | 361°F 183°C | Water Soluble | |||||||||
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17552LF | Aven Tools | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bag | 2015 | Active | Not Applicable | 0.047 1.19mm | ROHS3 Compliant | Wire Solder | 60 Months | Date of Manufacture | Sn99.3Cu0.7 (99.3/0.7) | 17 AWG, 18 SWG | Tube, 0.71 oz (20g) | Lead Free | 440°F 227°C | Rosin Activated (RA) | ||||||||
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CQ-SS-SNBIAG-0.20MM-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | |||||||||||||||||||||||||
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1179443 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | 2000 | 381™ | Not For New Designs | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 23 AWG, 24 SWG | Spool, 8.8 oz (250g) | Leaded | 361°F 183°C | Rosin Mildly Activated (RMA) | ||||||||||
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24-7340-0009 | Kester Solder | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | 2016 | 44 | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Contains Lead | Wire Solder | 50°F~104°F 10°C~40°C | Pb93.5Sn5Ag1.5 (93.5/5/1.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Leaded | 565°F~574°F 296°C~301°C | Rosin Activated (RA) | ||||||||
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392249 | Multicore | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Spool | 2000 | C400 | Active | Not Applicable | 0.064 1.63mm | Non-RoHS Compliant | 1.1lbs 499g | 14 AWG | Wire Solder | 59°F~86°F 15°C~30°C | Sn63Pb37 (63/37) | 14 AWG, 16 SWG | Spool, 1 lb (454 g) | Leaded | 361°F 183°C | No-Clean |
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WS991AX500T4 Chip Quik Inc.
Solder Thermally Stable Solder Paste WS (Water-Soluble) Sn63/Pb37 T4 (500g jar)
Price: 0.0000
RFQ -
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24-7068-7601 Kester Solder
KESTER 24-7068-7601 SOLDERWIRE 96.5/3/0.5 SN/AG/CU 217C 1LB
Price: 0.0000
RFQ -
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SMDSWLF.004 20G Chip Quik Inc.
Solder LF Solder Wire Sn96.5/Ag3/Cu0.5 No-Clean Water-Washable .004 20g ULTRA THIN
Price: 0.0000
RFQ -
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CQ-SS-SNBIAG-0.20MM-25000 Chip Quik Inc.
Solder Solder Spheres Sn42/Bi57.6/Ag0.4 0.20mm diameter 25K Bottle
Price: 0.0000
RFQ -
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