
Items : %s%s
Soldering Supplies and Tools
Soldering supplies and tools refer to the equipment and materials used in the process of soldering electronic components. Soldering is the process of joining two metal surfaces together using a heated metal alloy called solder. Soldering supplies and tools include soldering irons, soldering stations, soldering tips, soldering wire, flux, desoldering pumps, and soldering stands. These tools and supplies are essential for electronic technicians, hobbyists, and professionals who need to repair or assemble electronic devices. With the right soldering supplies and tools, one can achieve a strong and reliable connection between electronic components, ensuring the proper functioning of electronic devices.
Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Material | Packaging | Published | Series | Part Status | Moisture Sensitivity Level (MSL) | Number of Positions | Accessory Type | Diameter | RoHS Status | Thickness | Weight | Type | Storage/Refrigeration Temperature | Shelf Life | Shelf Life Start | Composition | Pitch | Wire Gauge | Outer Dimension | Diameter - Inner | Form | Process | Melting Point | Flux Type | Thermal Center Pad |
---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
![]() |
IPC0044-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Stainless Steel | 2014 | Proto-Advantage IPC | Active | 1 (Unlimited) | 40 | ROHS3 Compliant | 0.0040 0.102mm | QFN/LFCSP | 0.016 0.40mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.197 L x 0.197 W (5.00mm x 5.00mm) | 0.138 L x 0.138 W (3.50mm x 3.50mm) | ||||||||||||||||
![]() |
BGA0014-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2016 | Proto-Advantage BGA | Active | 1 (Unlimited) | 54 | ROHS3 Compliant | 0.0040 0.102mm | BGA | 0.029 0.75mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | |||||||||||||||||||
![]() |
BGA0010-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2014 | Proto-Advantage BGA | Active | 1 (Unlimited) | 42 | ROHS3 Compliant | 0.0040 0.102mm | BGA | 0.020 0.50mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | |||||||||||||||||||
![]() |
IPC0208-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Stainless Steel | Proto-Advantage IPC | Active | 1 (Unlimited) | 16 | ROHS3 Compliant | 0.0040 0.102mm | PowerQSOP | 0.025 0.64mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.193 L x 0.154 W (4.90mm x 3.90mm) | 0.123 L x 0.087 W (3.12mm x 2.20mm) | ||||||||||||||||||
![]() |
IPC0132-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2014 | Proto-Advantage IPC | Active | 1 (Unlimited) | 44 | ROHS3 Compliant | 0.0040 0.102mm | HSOP | 0.026 0.65mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.630 L x 0.433 W (16.00mm x 11.00mm) | ||||||||||||||||||
![]() |
TS391LT250 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2017 | Active | Not Applicable | ROHS3 Compliant | Solder Paste | 68°F~77°F 20°C~25°C | 12 Months | Date of Manufacture | Bi57.6Sn42Ag0.4 (57.6/42/0.4) | Jar, 8.8 oz (250g) | Lead Free | 281°F 138°C | No-Clean | ||||||||||||||||
![]() |
SMD2032 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.016 0.40mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||||||||
![]() |
IPC0207-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Stainless Steel | Proto-Advantage IPC | Active | 1 (Unlimited) | 24 | ROHS3 Compliant | 0.0040 0.102mm | QFN | 0.016 0.40mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.118 L x 0.118 W (3.00mm x 3.00mm) | 0.059 L x 0.059 W (1.50mm x 1.50mm) | ||||||||||||||||||
![]() |
SMD2020 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.010 0.25mm | ROHS3 Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | Jar | Lead Free | 423°F~428°F 217°C~220°C | |||||||||||||||||
![]() |
SMDSW.020 .4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | 1 (Unlimited) | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 24 AWG, 25 SWG | Tube, 0.4 oz (11.34g) | Leaded | 361°F 183°C | No-Clean, Water Soluble | |||||||||||||||||
![]() |
SMD4.5 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Solder | CHIPQUIK® | Active | Not Applicable | Removal Alloy | Non-RoHS Compliant | |||||||||||||||||||||||
![]() |
FPC080P030-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2014 | Proto-Advantage FPC | Active | 1 (Unlimited) | 30 | ROHS3 Compliant | 0.0040 0.102mm | FPC/FFC | 0.031 0.80mm | 1.950 L x 0.900 W (49.53mm x 22.86mm) | 1.248 L x 0.157 W (31.70mm x 4.00mm) | ||||||||||||||||||
![]() |
BARSN99.3CU0.7-8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Super Low Dross™ | Active | Not Applicable | ROHS3 Compliant | Bar Solder | Sn99.3Cu0.7 (99.3/0.7) | Bar, 0.5 lb (227g) | Lead Free | 441°F 227°C | ||||||||||||||||||||
![]() |
CQNIRM-1.0 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | CHIPQUIK® | Active | 1 (Unlimited) | ROHS3 Compliant | Flux Remover - Lead Free | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Bottle, 1 oz (28.35g) | ||||||||||||||||||||
![]() |
IPC0139-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Stainless Steel | 2017 | Proto-Advantage IPC | Active | Not Applicable | 80 | ROHS3 Compliant | 0.0040 0.102mm | TQFP | 0.031 0.80mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.787 L x 0.551 W (20.00mm x 14.00mm) | |||||||||||||||||
![]() |
SMD2195-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | SMD2 | Active | Not Applicable | 0.022 0.56mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Jar | Leaded | 361°F 183°C | |||||||||||||||||
![]() |
SMD2SW.020 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD2 | Active | Not Applicable | 0.020 0.51mm | Non-RoHS Compliant | Wire Solder | Sn60Pb40 (60/40) | Spool, 4 oz (113.40g) | Leaded | 361°F~370°F 183°C~188°C | No-Clean, Water Soluble | ||||||||||||||||||
![]() |
SMD29175G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | 2015 | CHIPQUIK® | Active | Not Applicable | ROHS3 Compliant | Flux - No Clean, Tacky Solder | 37°F~77°F 3°C~25°C | 24 Months | Date of Manufacture | Jar, 2.65 oz (75g) | |||||||||||||||||||
![]() |
NCSWLF.020 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | Not Applicable | 0.020 0.51mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 24 AWG, 25 SWG | Spool, 1 lb (454 g) | Lead Free | 422°F~428°F 217°C~220°C | No-Clean | ||||||||||||||||||
![]() |
DR127P18-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 4 Weeks | Stainless Steel | Proto-Advantage DR | Active | 1 (Unlimited) | 18 | ROHS3 Compliant | 0.050 1.27mm | |||||||||||||||||||||||
![]() |
FPC030P045-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2014 | Proto-Advantage FPC | Active | 1 (Unlimited) | 45 | ROHS3 Compliant | 0.0040 0.102mm | FPC/FFC | 0.012 0.30mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | |||||||||||||||||||
![]() |
SMD2200-25000 | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Jar | 2017 | SMD2 | Active | Not Applicable | 0.024 0.61mm | Non-RoHS Compliant | Solder Sphere | 24 Months | Date of Manufacture | Sn63Pb37 (63/37) | Leaded | 361°F 183°C | ||||||||||||||||
![]() |
IPC0178-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Stainless Steel | 2017 | Proto-Advantage IPC | Active | Not Applicable | 56 | ROHS3 Compliant | 0.0040 0.102mm | TSSOP | 0.020 0.50mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.551 L x 0.240 W (14.00mm x 6.10mm) | |||||||||||||||||
![]() |
SMDSW.031 8OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | 0.031 0.79mm | Non-RoHS Compliant | Wire Solder | Sn63Pb37 (63/37) | 20 AWG, 22 SWG | Spool, 8 oz (227g), 1/2 lb | Leaded | 361°F 183°C | No-Clean, Water Soluble | ||||||||||||||||||
![]() |
FPC080P010-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Stainless Steel | 2014 | Proto-Advantage FPC | Active | 1 (Unlimited) | 10 | ROHS3 Compliant | 0.0040 0.102mm | FPC/FFC | 0.031 0.80mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.618 L x 0.157 W (15.70mm x 4.00mm) | ||||||||||||||||||
![]() |
CQ100GE 35G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | Solder Paste | 37°F~46°F 3°C~8°C | 6 Months | Date of Manufacture | Sn99.244Cu0.7 (Ni0.05/Ge0.006) | Syringe, 1.23 oz (35g), 10cc | Lead Free | 441°F 227°C | No-Clean | |||||||||||||||||
![]() |
SMDSWLF.031 4OZ | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Spool | Active | 1 (Unlimited) | 0.031 0.79mm | ROHS3 Compliant | 0.25lb 113.4g | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 4 oz (113.40g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | ||||||||||||||||
![]() |
SMDSWLT.040 200G | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | SMD | Active | Not Applicable | 0.040 1.02mm | ROHS3 Compliant | Wire Solder | Sn42Bi57Ag1 (42/57/1) | 18 AWG, 19 SWG | Spool, 7 oz (200g) | Lead Free | 280°F 138°C | No-Clean, Rosin Activated (RA) | |||||||||||||||||
![]() |
SMDSWLF.031 1LB | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Bulk | Active | Not Applicable | 0.031 0.79mm | ROHS3 Compliant | Wire Solder | Sn96.5Ag3Cu0.5 (96.5/3/0.5) | 20 AWG, 22 SWG | Spool, 1 lb (454 g) | Lead Free | 423°F~428°F 217°C~220°C | No-Clean, Water Soluble | |||||||||||||||||
![]() |
IPC0177-S | Chip Quik Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2 Weeks | Stainless Steel | 2017 | Proto-Advantage IPC | Active | Not Applicable | 48 | ROHS3 Compliant | 0.0040 0.102mm | TSSOP | 0.020 0.50mm | 1.300 L x 0.900 W (33.02mm x 22.86mm) | 0.492 L x 0.240 W (12.50mm x 6.10mm) |
-
-
-
-
IPC0208-S Chip Quik Inc.
IPC0208-S datasheet pdf and Solder Stencils, Templates product details from Chip Quik Inc. stock available at Utmel
Price: 0.0000
RFQ -
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-
-