Items : %s%s
Telecom Interface ICs
Applications
- ATM;SDH;SONET
- SDH
- SONET;SDH
Contact Plating
- Copper, Silver, Tin
- Copper, Tin
- Lead, Tin
- Tin
ECCN Code
- 5A002.A.2
- 5A991
- 5A991.B.1
- 5A991.C
- 5A992.C
- EAR99
Factory Lead Time
- 1 Weeks
- 10 Weeks
- 11 Weeks
- 12 Weeks
- 13 Weeks
- 14 Weeks
- 15 Weeks
- 16 Weeks
- 17 Weeks
- 18 Weeks
- 19 Weeks
- 2 Weeks
- 20 Weeks
- 21 Weeks
- 22 Weeks
- 23 Weeks
- 24 Weeks
- 25 Weeks
- 26 Weeks
- 28 Weeks
- 3 Weeks
- 33 Weeks
- 35 Weeks
- 39 Weeks
- 4 Weeks
- 5 Weeks
- 52 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
- 9 Weeks
- 98 Weeks
JESD-609 Code
- e0
- e1
- e2
- e3
- e3/e2
- e4
Lifecycle Status
- ACTIVE (Last Updated: 1 day ago)
- ACTIVE (Last Updated: 1 week ago)
- ACTIVE (Last Updated: 2 days ago)
- ACTIVE (Last Updated: 3 days ago)
- ACTIVE (Last Updated: 4 days ago)
- ACTIVE (Last Updated: 5 days ago)
- ACTIVE (Last Updated: 6 days ago)
- ACTIVE (Last Updated: 6 months ago)
- ACTIVE (Last Updated: 7 months ago)
- IN PRODUCTION (Last Updated: 1 month ago)
- IN PRODUCTION (Last Updated: 2 weeks ago)
- IN PRODUCTION (Last Updated: 3 weeks ago)
- IN PRODUCTION (Last Updated: 4 weeks ago)
- LIMITED TIME BUY (Last Updated: 1 month ago)
- LIMITED TIME BUY (Last Updated: 3 weeks ago)
- NOT RECOMMENDED FOR NEW DESIGN (Last Updated: 1 month ago)
- NRND (Last Updated: 6 months ago)
- NRND (Last Updated: 7 months ago)
- NRND (Last Updated: 8 months ago)
- OBSOLETE (Last Updated: 1 month ago)
- OBSOLETE (Last Updated: 3 weeks ago)
- OBSOLETE (Last Updated: 5 days ago)
- PRODUCTION (Last Updated: 1 month ago)
- PRODUCTION (Last Updated: 2 weeks ago)
- PRODUCTION (Last Updated: 6 days ago)
Max Operating Temperature
- 100°C
- 105°C
- 110°C
- 125°C
- 60°C
- 70°C
- 75°C
- 80°C
- 85°C
- 90°C
Min Operating Temperature
- -20°C
- -25°C
- -35°C
- -40°C
- -45°C
- 0°C
Moisture Sensitivity Level (MSL)
- 1
- 1 (Unlimited)
- 1 (Unlimited)
- 2
- 2 (1 Year)
- 2A
- 2A (4 Weeks)
- 3
- 3 (168 Hours)
- 3 (168 Hours)
- 4
- 4 (72 Hours)
- 4 (72 Hours)
- 5 (48 Hours)
- 6 (Time on Label)
- Not Applicable
- NOT SPECIFIED
- Vendor Undefined
Mount
- Base
- Box
- Surface Mount
- Surface Mount, Through Hole
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 10
- 100
- 11
- 119
- 120
- 121
- 128
- 14
- 144
- 1517
- 16
- 160
- 176
- 18
- 196
- 20
- 208
- 217
- 22
- 220
- 225
- 24
- 256
- 272
- 28
- 289
- 30
- 300
- 304
- 316
- 32
- 324
- 329
- 344
- 349
- 36
- 365
- 38
- 40
- 400
- 416
- 42
- 420
- 44
- 444
- 48
- 484
- 49
- 52
- 520
- 535
- 552
- 56
- 6
- 60
- 64
- 640
- 672
- 676
- 68
- 8
- 80
- 81
- 84
- 9
Number of Terminals
- 100
- 128
- 22
- 225
- 44
Number of Terminations
- 10
- 100
- 1152
- 120
- 121
- 128
- 138
- 14
- 144
- 16
- 160
- 17
- 176
- 18
- 195
- 196
- 20
- 208
- 217
- 22
- 220
- 225
- 24
- 256
- 26
- 272
- 276
- 28
- 289
- 292
- 300
- 304
- 316
- 32
- 324
- 344
- 349
- 36
- 365
- 38
- 40
- 400
- 416
- 42
- 420
- 44
- 444
- 48
- 480
- 484
- 49
- 500
- 52
- 53
- 535
- 552
- 56
- 568
- 60
- 625
- 64
- 640
- 672
- 676
- 68
- 8
- 80
- 81
- 84
Operating Temperature
- -10°C~60°C
- -10°C~70°C
- -10°C~75°C
- -15°C~60°C
- -20°C~60°C
- -20°C~70°C
- -20°C~85°C
- -25°C~100°C
- -25°C~125°C
- -25°C~70°C
- -25°C~75°C
- -25°C~80°C
- -25°C~85°C
- -30°C~85°C
- -35°C~60°C
- -40°C ~ 85°C
- -40°C~105°C
- -40°C~110°C
- -40°C~125°C
- -40°C~65°C
- -40°C~70°C
- -40°C~75°C
- -40°C~80°C
- -40°C~85°C
- -45°C~85°C
- -55°C~125°C
- -5°C~90°C
- 0°C~110°C
- 0°C~125°C
- 0°C~50°C
- 0°C~70°C
- 0°C~75°C
- 0°C~85°C
- 0°C~85°C TJ
Package / Case
- 10-TFSOP, 10-MSOP (0.118, 3.00mm Width)
- 10-VFSOP, 10-MSOP (0.118, 3.00mm Width) Exposed Pad
- 100
- 100-BQFP
- 100-LBGA
- 100-LBGA, CSBGA
- 100-LFBGA, CSPBGA
- 100-LQFP
- 100-QFP
- 100-TQFP Exposed Pad
- 1020-BGA
- 1024-BGA
- 1152-BGA
- 119-WFBGA, WLBGA
- 120-BGA
- 120-LQFP
- 121-LFBGA
- 128-BFQFP
- 128-LQFP
- 128-LQFP Exposed Pad
- 128-QFP
- 128-TQFP
- 1369-BGA
- 14-DIP (0.300, 7.62mm)
- 14-SOIC (0.154, 3.90mm Width)
- 144-BBGA
- 144-BGA
- 144-BGA, CSPBGA
- 144-LBGA
- 144-LQFP
- 144-LQFP Exposed Pad
- 1517-BBGA
- 16-DIP (0.300, 7.62mm)
- 16-LSSOP (0.173, 4.40mm Width)
- 16-QFN
- 16-SOIC (0.154, 3.90mm Width)
- 16-SOIC (0.154, 3.90mm Width) Exposed Pad
- 16-SOIC (0.295, 7.50mm Width)
- 16-SSOP (0.154, 3.90mm Width)
- 16-TQFN Exposed Pad
- 16-TSSOP (0.173, 4.40mm Width)
- 16-VDFN Exposed Pad
- 16-VFQFN Exposed Pad
- 16-VQFN Exposed Pad
- 160-BGA
- 160-BQFP
- 160-LBGA
- 160-LQFP
- 164-QFN
- 176-LBGA
- 176-LQFP
- 18-DIP (0.300, 7.62mm)
- 18-DIP Module (0.850, 21.59mm), 11 Leads
- 18-DIP Module (0.850, 21.59mm), 9 Leads
- 18-SOIC (0.213, 5.40mm Width)
- 18-SOIC (0.295, 7.50mm Width)
- 195-BFBGA, FCBGA
- 196-BGA
- 196-LBGA
- 196-LBGA, FCBGA
- 20-DIP (0.300, 7.62mm)
- 20-LCC (J-Lead)
- 20-SOIC (0.295, 7.50mm Width)
- 20-SOIC (0.433, 11.00mm Width) Exposed Pad
- 20-SSOP (0.209, 5.30mm Width)
- 20-TSSOP (0.173, 4.40mm Width)
- 20-VFQFN Exposed Pad
- 208-BFQFP
- 208-BGA
- 208-LBGA
- 217-BBGA
- 217-BGA
- 22-DIP (0.400, 10.16mm)
- 220-BGA
- 220-LBGA
- 225-BGA
- 225-LFBGA
- 24-DIP (0.300, 7.62mm)
- 24-DIP (0.600, 15.24mm)
- 24-QFN
- 24-SOIC (0.295, 7.50mm Width)
- 24-SSOP (0.154, 3.90mm Width)
- 24-SSOP (0.209, 5.30mm Width)
- 24-TSSOP (0.173, 4.40mm Width) Exposed Pad
- 24-VFQFN Exposed Pad
- 24-VQFN Exposed Pad
- 24-WFQFN Exposed Pad
- 244-BBGA, FCBGA
- 256-BBGA, FCBGA
- 256-BGA
- 256-LBGA
- 256-LBGA Exposed Pad
- 256-LBGA, CSBGA
- 256-LQFP
- 272-BBGA
- 272-BGA
- 28-BSOJ (0.300, 7.62mm Width)
- 28-DIP (0.600, 15.24mm)
- 28-LCC (J-Lead)
- 28-QFN
- 28-SOIC (0.295, 7.50mm Width)
- 28-TSSOP (0.173, 4.40mm Width)
- 28-VDFN Exposed Pad
- 28-VFQFN
- 28-VFQFN Exposed Pad
- 289-LFBGA
- 300-BBGA
- 302-TQFP
- 304-BBGA
- 304-LBGA
- 316-BGA
- 316-LBGA
- 32-LCC (J-Lead)
- 32-LQFP
- 32-QFN
- 32-SOIC (0.295, 7.50mm Width)
- 32-TFQFN Exposed Pad
- 32-TQFP
- 32-VFQFN Exposed Pad
- 32-VQFN Exposed Pad
- 323-BBGA, FCBGA
- 324-BGA
- 324-FBGA
- 324-LBGA
- 329-FBGA
- 344-BBGA
- 349-BBGA, CSBGA Exposed Pad
- 349-BGA Exposed Pad
- 36-BSOP (0.295, 7.50mm Width)
- 36-FBGA
- 36-VFQFN Exposed Pad
- 38-QFN
- 38-TFSOP (0.173, 4.40mm Width)
- 38-VFQFN Exposed Pad
- 388-BBGA
- 40-DIP (0.600, 15.24mm)
- 40-VFQFN Exposed Pad
- 416-BGA
- 42-VFQFN Exposed Pad
- 42-WFQFN Exposed Pad
- 420-LBGA
- 44-BSOP (0.295, 7.50mm Width)
- 44-LCC (J-Lead)
- 44-LQFP
- 44-QFP
- 44-TQFP
- 44-TQFP Exposed Pad
- 48-BSSOP (0.295, 7.50mm Width)
- 48-LQFP
- 48-QFN
- 48-SSOP (0.295, 7.50mm Width)
- 48-TQFP
- 48-VFQFN Exposed Pad
- 48-VQFN Exposed Pad
- 484-BGA
- 484-LFBGA
- 49-LFBGA, CSPBGA
- 52-LQFP
- 535-BGA
- 552-BGA
- 56-VFQFN Exposed Pad
- 60-WFQFN Exposed Pad
- 64-FQFP
- 64-LQFP
- 64-QFP
- 64-TQFP
- 64-VFQFN Exposed Pad
- 640-BGA Exposed Pad
- 672-BGA
- 672-LBGA
- 676-BGA
- 68-LCC (J-Lead)
- 68-VFQFN Exposed Pad
- 8-DIP (0.300, 7.62mm)
- 8-ESOP (0.250, 6.35mm Width)
- 8-SMD, Gull Wing
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.154, 3.90mm Width) Exposed Pad
- 8-SOIC (0.173, 4.40mm Width)
- 80-LQFP
- 80-QFP
- 80-TFQFN Exposed Pad
- 81-LBGA
- 81-LFBGA
- 868-BGA
- 896-BGA
- BGA
- DIP
- FBGA
- FCBGA
- LCC
- LQFP
- PDIP
- PLCC
- PQFP
- QFN
- SOIC
- SSOP
- TQFP
- VQFN
Packaging
- *
- Bag
- Bulk
- Cut Tape (CT)
- Tape & Reel
- Tape & Reel (TR)
- Tape and Reel
- Tray
- Tube
Part Status
- Active
- Discontinued
- Last Time Buy
- Not For New Designs
- Obsolete
Pbfree Code
- icon-pbfree no
- no
- yes
Power (Watts)
- 1.04W
- 1.11W
- 1.1W
- 1.37W
- 1.49W
- 1.4W
- 1.5W
- 1.69W
- 1.6W
- 1.73W
- 1.75W
- 10.5mW
- 10.5W
- 100mW
- 10mW
- 130mW
- 140mW
- 150mW
- 1mW
- 1W
- 2.045W
- 2.55W
- 2.57W
- 2.89W
- 250mW
- 25mW
- 280mW
- 290mW
- 2W
- 3.1W
- 3.5W
- 300mW
- 305mW
- 310mW
- 315mW
- 350mW
- 35mW
- 370mW
- 3W
- 400mW
- 450mW
- 454mW
- 500mW
- 50mW
- 520W
- 550mW
- 650mW
- 666mW
- 700mW
- 730mW
- 740mW
- 750mW
- 78.75mW
- 800mW
- 840mW
- 900mW
- 90mW
- 941mW
PSRR-Min
- 25 dB
- 27 dB
- 30 dB
- 40 dB
Published
- 1993
- 1996
- 1997
- 1998
- 1999
- 2000
- 2001
- 2002
- 2003
- 2004
- 2005
- 2006
- 2007
- 2008
- 2009
- 2010
- 2011
- 2012
- 2013
- 2014
- 2015
- 2016
- 2017
Resistance
- 100Ohm
- 10kOhm
- 110Ohm
- 14.5Ohm
- 15Ohm
- 25Ohm
- 35Ohm
- 50Ohm
Series
- Amazon
- ARCOFI®
- Automotive, AEC-Q100
- Caracal™ Lite
- Caracal™-1
- Caracal™-2
- Cybergate™
- DS
- DualFALC™
- DuSLIC
- E-StaX-III-28
- E-StaX-III-48
- E-StaX-III-68
- ELIC®
- EPIC®
- FALC™
- FlexiSLIC™
- HOTlink II™
- INCA™
- IPAC-X
- ISAC™
- ISOmodem®
- Jaguar™-1
- Jaguar™-2
- LITELINK®
- LITELINK® II
- LITELINK® III
- LMCMOS™
- LynX™-1
- LynX™-2
- MicroDAA™
- miSLIC™
- MT8976
- MT8977
- MV1442
- OctalFALC™
- OctalLIU™
- ProSLIC®
- Q-SMINT®
- QuadFALC™
- QuadLIU™
- RSLIC18
- SCOUT™
- SEROCCO™
- Serval™ Lite
- Serval™-1
- Serval™-2
- Serval™-2 Lite
- Serval™-T
- Serval™-TE
- Serval™-TE10
- SICOFI®
- SLIC™, DuSLIC™
- SOCRATES™
- SparX™-III-10
- SparX™-III-10um
- SparX™-III-11
- SparX™-III-17um
- SparX™-III-18
- SparX™-III-24
- SparX™-III-25um
- SparX™-III-26
- SparX™-IV-34
- SparX™-IV-44
- SparX™-IV-52
- SparX™-IV-80
- SparX™-IV-90
- SWITI
- T-SMINT®
- TE3-LIU™
- UniSLIC14
- VINETIC®
- Voice Edge™
- XWAY™TANTOS
Supplier Device Package
- 10-MSOP
- 100-CSBGA (10x10)
- 100-CSBGA (11x11)
- 100-LQFP (14x14)
- 100-MQFP (14x20)
- 100-TQFP (14x14)
- 120-LQFP (14x20)
- 120-PBGA (23x23)
- 121-LFBGA (10x10)
- 128-LQFP (14x14)
- 128-LQFP (14x20)
- 128-LQFP (20x14)
- 128-PQFP (14x20)
- 128-QFP
- 128-TQFP
- 128-TQFP (14x20)
- 1292-FCBGA
- 135-QFN (12x12)
- 138-QFN (12x12)
- 14-DIP
- 14-SOIC
- 144-BGA
- 144-BGA (13x13)
- 144-LBGA
- 144-LBGA (13x13)
- 144-LQFP (15x15)
- 144-LQFP (20x20)
- 144-LQFP-EP (20x20)
- 144-PBGA (17x17)
- 144-TECSBGA (13x13)
- 16-MLP (7x6)
- 16-PDIP
- 16-QFN
- 16-QFN (4x4)
- 16-SOIC
- 16-SOP
- 16-SSOP-B
- 164-QFN (13x13)
- 176-LQFP
- 18-DIP
- 18-PDIP
- 18-SOIC
- 18-SOP
- 196-BGA
- 196-CABGA (15x15)
- 196-FBGA (15x15)
- 196-FCBGA (15x15)
- 196-PBGA (15x15)
- 20-DIP
- 20-PDIP
- 20-PLCC (9x9)
- 20-QFN (4x4)
- 20-SOIC
- 20-SSOP
- 20-TSSOP
- 208-PBGA (17x17)
- 208-PQFP (28x28)
- 217-BGA (23x23)
- 22-DIP
- 225-BGA (19x19)
- 24-PDIP
- 24-QFN
- 24-QFN (6x6)
- 24-QFNJ (4x4)
- 24-SO
- 24-SOP
- 24-SSOP
- 24-VSOP
- 244-FCBGA (17x17)
- 256-BGA
- 256-BGA (17x17)
- 256-BGA (27x27)
- 256-CABGA (17x17)
- 256-CSBGA (17x17)
- 256-FBGA (17x17)
- 256-FCBGA (17x17)
- 256-FPBGA (17x17)
- 256-LQFP (28x28)
- 256-MQFP (28x28)
- 256-PBGA (17x17)
- 272-BGA (27x27)
- 272-PBGA (27x27)
- 28-DFN
- 28-PDIP
- 28-PLCC
- 28-PLCC (11.51x11.51)
- 28-QFN
- 28-QFN (4x5)
- 28-SO
- 28-SOIC
- 28-SOJ
- 28-SOP
- 300-HBGA
- 300-PBGA (27x27)
- 302-TQFP (24x24)
- 304-PBGA (31x31)
- 32-PLCC (11.43x13.97)
- 32-QFN (5x5)
- 32-QFN (7x7)
- 32-QFN (8x8)
- 32-QFN-EP (5x5)
- 32-SOIC
- 32-TQFP (7x7)
- 323-FCLBGA
- 324-BGA (19x19)
- 324-PBGA (23x23)
- 329-FPBGA (17x17)
- 344-PBGA (27x27)
- 38-QFN (5x7)
- 38-TSSOP
- 388-BGA (35x35)
- 40-PDIP
- 40-QFN
- 400-PBGA (27x27)
- 42-PDIP
- 42-QFN (5x7)
- 44-eLQFP
- 44-MQFP (10x10)
- 44-PLCC
- 44-PLCC (16.51x16.51)
- 44-PLCC (16.58x16.58)
- 44-PLCC (16.59x16.59)
- 44-QCC
- 44-QFN (7x7)
- 44-SSO
- 44-TQFP
- 44-TQFP (10x10)
- 44-TQFP-EP (10x10)
- 444-BGA (27x27)
- 48-eTQFP
- 48-LQFP
- 48-LQFP (7x7)
- 48-QFN
- 48-QFN (5x9)
- 48-QFN (6x6)
- 48-QFN (7x7)
- 48-SSOP
- 48-VQFN (7x7)
- 484-BGA (27x27)
- 49-CSBGA (7x7)
- 50-QFN (6x8)
- 52-TQFP (10x10)
- 535-PBGA (31x31)
- 552-PBGA (35x35)
- 56-QFN (8x8)
- 64-eTQFP
- 64-LQFP
- 64-LQFP (10x10)
- 64-LQFP (14x14)
- 64-QFN
- 64-TQFP
- 64-TQFP (10x10)
- 64-TQFP (14x14)
- 640-TEPBGA (31x31)
- 672-FCBGA (27x27)
- 672-HSBGA (27x27)
- 68-PLCC (24.23x24.23)
- 68-QFN (8x8)
- 69-BGA
- 8-DIP
- 8-Flatpack
- 8-PDIP
- 8-SMD
- 8-SOIC
- 8-SOP
- 80-eLQFP
- 80-LQFP (12x12)
- 80-MQFP (14x14)
- 80-TQFP (14x14)
- 868-BGA
- 896-FCBGA
- 896-FCBGA (31x31)
- P-DSO-20-5
- P-DSO-28
- P-DSO-36-15
- P-LBGA-256
- P-LBGA-324
- P-LCC-44
- P-LCC-44-1
- P-MQFP-100
- P-MQFP-44
- P-MQFP-44-1
- P-MQFP-64
- P-MQFP-64-1
- P-MQFP-64-9
- P-TQFP-100
- P-TQFP-144
- P-TQFP-144-6
- P-TQFP-64
- P/PG-LBGA-160-1
- P/PG-LCC-28
- PG-DSO-24
- PG-LBGA-144
- PG-LBGA-176
- PG-LBGA-256
- PG-LBGA-324-2
- PG-LBGA-324-3
- PG-LQFP-176
- PG-VQFN-48-4
- PG-WFWLB-119-1
Surface Mount
- NO
- YES
Terminal Finish
- MATTE TIN
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- NICKEL PALLADIUM GOLD
- Nickel/Palladium/Gold (Ni/Pd/Au)
- NOT SPECIFIED
- TIN
- Tin (Sn)
- TIN LEAD
- TIN SILVER COPPER
- Tin/Copper (Sn/Cu)
- Tin/Lead (Sn/Pb)
- Tin/Lead (Sn63Pb37)
- Tin/Lead (Sn85Pb15)
- Tin/Silver/Copper (Sn/Ag/Cu)
- TIN/TIN COPPER
Termination
- Gull Wing
- SMD/SMT
Transistor Element Material
- SILICON
Type
- Integrated Circuit (IC)
Weight
- 1.053808g
- 1.098005g
- 1.182714g
- 1.270087g
- 1.319103g
- 1.620005g
- 1.833392g
- 100.952652mg
- 117.310327mg
- 129.387224mg
- 130.010913mg
- 140.160042mg
- 140.30179mg
- 141.690917mg
- 143.193441mg
- 150.507618mg
- 152.066842mg
- 181.692094mg
- 188.609377mg
- 189.233067mg
- 189.318115mg
- 189.403164mg
- 189.431514mg
- 2.214806g
- 2.259996g
- 2.386605g
- 2.784008g
- 220.105698mg
- 252.254057mg
- 252.565902mg
- 342.689036mg
- 356.09836mg
- 360.605934mg
- 4.190003g
- 453.59237mg
- 50.008559mg
- 503.487531mg
- 506.605978mg
- 540.001716mg
- 547.485991mg
- 600.301152mg
- 639.990485mg
- 665.986997mg
- 67.301768mg
- 72.801575mg
- 723.394782mg
- 76.997305mg
- 766.089163mg
- 77.592645mg
- 792.000628mg
- 800.987426mg
- 86.749541mg
- 9.071791g
- 927.99329mg
- 930.006106mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Frequency | Height | Width | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Current - Supply | Input Current | Min Supply Voltage (DC) | Height Seated (Max) | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Output Current | Throw Configuration | Number of Circuits | Data Rate | Applications | Interface IC Type | Supplier Device Package | Max Output Voltage | Isolation Voltage | Logic Function | Function | Power (Watts) | Number of I/O | Address Bus Width | Supply Current-Max | Telecom IC Type | Voltage - Supply | Number of Transceivers | Boundary Scan | External Data Bus Width | Bus Compatibility | Clock Frequency | RAM (words) |
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.png "LE9662WQC") |
LE9662WQC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 22 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Tray | miSLIC™ | Active | 3 (168 Hours) | 56 | 3.3V | 8mm | ROHS3 Compliant | 56-VFQFN Exposed Pad | 4-Wire | unknown | 8mm | Surface Mount | -40°C~85°C | 25mA | 3.135V | 1mm | QUAD | NO LEAD | 3.3V | YES | 0.5mm | S-XQCC-N56 | 2 | Subscriber Line Interface Concept (SLIC) | 3.135V~3.465V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE79R79-3DJCT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 32-LCC (J-Lead) | 2-Wire | Surface Mount | 0°C~70°C | 1 | 32-PLCC (11.43x13.97) | Subscriber Line Interface Concept (SLIC) | 4.75V~5.25V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CS2777.E0-998180 | Inphi Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Discontinued | 3 (168 Hours) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BCM84794A1KFSBG | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Last Time Buy | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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ITC100PTR | IXYS / Littelfuse | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2003 | Obsolete | 1 (Unlimited) | 85°C | -40°C | 10.16mm | RoHS Compliant | Lead Free | No | 16 | 16-SOIC (0.295, 7.50mm Width) | 2.108mm | 7.493mm | Surface Mount | -40°C~85°C | 1W | 1 | 16-SOIC | Multifunction Telecom Switch | 1W | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BCM63168USAS01 | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Active | 1 (Unlimited) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PM5326H-FXI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Not For New Designs | 3 (168 Hours) | Non-RoHS Compliant | SFI-4 | Surface Mount | 1292-FCBGA | SONET/SDH | 1.2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BCM88752KFSBG | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Vendor Undefined | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BA8206F-E2 | ROHM Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 1998 | yes | Not For New Designs | 1 (Unlimited) | 8 | 5mm | ROHS3 Compliant | Lead Free | 8 | 8-SOIC (0.173, 4.40mm Width) | 4.4mm | Surface Mount | -25°C~75°C | BIPOLAR | e3/e2 | TIN/TIN COPPER | DUAL | GULL WING | 260 | 24V | 10 | BA8206 | Telephone Circuits | Not Qualified | 24V | 450mW | 1 | Tone Generator | TELEPHONE RINGER CIRCUIT | 38V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS21Q552BN+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 1998 | Obsolete | 4 (72 Hours) | 5V | ROHS3 Compliant | Lead Free | No | 256 | 256-BGA | T1 | Surface Mount | DS21Q552 | Transceiver | 5V | 4 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE77D112BTCT | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2001 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 2-Wire | -40°C~85°C | 2 | Subscriber Line Interface Concept (SLIC) | 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
78P2352-IGT/F | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Bulk | 2006 | no | Not For New Designs | 3 (168 Hours) | 128 | 5A991 | 14mm | ROHS3 Compliant | Tin | 128-LQFP Exposed Pad | CMOS | 14mm | Surface Mount | -40°C~85°C | 325mA | 1.6mm | QUAD | GULL WING | NOT SPECIFIED | 3.3V | NOT SPECIFIED | 78P2352 | 0.4mm | Digital Transmission Interfaces | Not Qualified | 3.3V | 2 | SONET;SDH | Line Interface Unit (LIU) | ATM/SONET/SDH TRANSCEIVER | 3.15V~3.45V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PEF 80912 H V1.4 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Q-SMINT® | Obsolete | 3 (168 Hours) | 44-QFP | ISDN | Surface Mount | PEF80912 | P-MQFP-44 | Second Generation Modular | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TS117PL | IXYS / Littelfuse | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tube | 2001 | Active | 1 (Unlimited) | Gull Wing | 85°C | -40°C | 9.652mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SMD, Gull Wing | 2.159mm | 6.35mm | Surface Mount | -40°C~85°C | 50mA | 800mW | 120mA | SPST | 2 | 8-Flatpack | 350V | 3.75kV | Relay Switch | 800mW | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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XRT75L04IVTR | Exar Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tape & Reel (TR) | RoHS Compliant | LQFP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M86201G12 | NXP Semiconductors | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | 2015 | Active | 3 (168 Hours) | 625 | 21mm | ROHS3 Compliant | 21mm | CMOS | 2.67mm | BOTTOM | BALL | 1.13V | COMMERCIAL | YES | 0.8mm | S-PBGA-B625 | 1.096V | 70°C | -10°C | 1.164V | 64 | 26 | YES | 32 | I2C, PCI, SPI, UART, USB | 1200MHz | 64000 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE87271EQC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Active | 1 (Unlimited) | LINE DRIVER | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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LE88116BLC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 44 | 44-LQFP | PCM | Surface Mount | 1 | Telecom Circuit | 3V 5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BCM56242XB0IFSBLG | Broadcom | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 22 Weeks | Active | 1 (Unlimited) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
VSC8504XKS-01 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | LIMITED TIME BUY (Last Updated: 1 month ago) | Tray | Obsolete | 4 (72 Hours) | 256 | ROHS3 Compliant | Lead Free | 256-BGA | Surface Mount | BOTTOM | BALL | 1V | OTHER | YES | S-PBGA-B256 | 1 | 1 Gbps | Ethernet | 1V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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VSC7108XVP-01 | Microsemi | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2004 | Obsolete | 3 (168 Hours) | RoHS Compliant | 69-FBGA | TTL/CMOS | Surface Mount | 0°C~110°C | 2.65W | 8 | Octal Signal Conditioner | 2.5V 3.3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
LE58QL021BVC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | IN PRODUCTION (Last Updated: 3 weeks ago) | Surface Mount | Tray | Active | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | Lead Free | Tin | No | 44 | 44-TQFP | PCM | 5V | 3.3V | Surface Mount | -40°C~85°C | 4 | 44-TQFP (10x10) | Subscriber Line Interface Concept (SLIC) | 3.3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
RPCS3487C.B0-998978 | Inphi Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 4 (72 Hours) | 1369-BGA | Interlaken, XAUI | Surface Mount | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PEF 24624 E V1.2 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | SOCRATES™ | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 324-LBGA | ISDN, SHDSL | Surface Mount | -40°C~85°C | PEF24624 | 4 | P-LBGA-324 | Symmetrical DSL Front End (SDFE) | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
PEB 4264 V V1.2 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | DuSLIC | Obsolete | 3 (168 Hours) | 48-VFQFN Exposed Pad | IOM-2, PCM | Surface Mount | 105mA | PEB4264 | 2 | PG-VQFN-48-4 | Dual Channel Subscriber Line Interface Circuit (DuSLIC) | 3.3V~5V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AK2361 | AKM Semiconductor Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 24-LSOP (0.220, 5.60mm Width) | Surface Mount | -10°C~70°C | 1 | 24-VSOP | Base-Band LSI | 1.9V~5.5V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT88L70ANR1 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | IN PRODUCTION (Last Updated: 1 month ago) | Surface Mount | Tape & Reel (TR) | 2006 | yes | Active | 3 (168 Hours) | 20 | 3V | 7.2mm | ROHS3 Compliant | Lead Free | No | 20 | 20-SSOP (0.209, 5.30mm Width) | 3.58MHz | 5.3mm | Surface Mount | 453.59237mg | -40°C~85°C | CMOS | 2mA | 2mm | e3 | MATTE TIN | DUAL | GULL WING | 260 | 3V | 30 | 0.65mm | Telecom Signaling Circuits | 3V | 500mW | 1 | Receiver | DTMF Receiver | 5.5mA | DTMF SIGNALING CIRCUIT | 2.7V~3.6V | |||||||||||||||||||||||||||||||||||||||||||
 |
CYV15G0401DXB-BGXC | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2003 | HOTlink II™ | yes | Active | 3 (168 Hours) | 256 | 5A991.B.1 | 3.3V | 27mm | ROHS3 Compliant | Lead Free | No | 256 | 256-LBGA Exposed Pad | LVTTL | 27mm | Surface Mount | 0°C~70°C | BICMOS | 830mA | 1.06A | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | CY*15G04 | 1.27mm | Network Interfaces | 4 | 1500000 Mbps | Transceiver | 3.135V~3.465V | 4 | |||||||||||||||||||||||||||||||||||||||||||||||
 |
DS3152N+ | Rochester Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 144 | 13mm | ROHS3 Compliant | 144-BGA, CSPBGA | LIU | unknown | 13mm | Surface Mount | -40°C~85°C | 150mA | 1.76mm | e1 | TIN SILVER COPPER | BOTTOM | BALL | 260 | 3.3V | NOT SPECIFIED | YES | 1mm | S-PBGA-B144 | COMMERCIAL | 2 | Line Interface Unit (LIU) | PCM TRANSCEIVER | 3.135V~3.465V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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PEB 20256 E V2.1 | Infineon Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 388-BBGA | HDLC, PPP, Serial, TMA | Surface Mount | 0°C~70°C | 200mA | PEB20256 | 388-BGA (35x35) | Multichannel Network Interface Controller (MUNICH) | 3W | 3V~3.6V |
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LE58QL021BVC Microchip Technology
44 Pin Telecom device4 CircuitsMin 3.3V VMax 5V V
Price: 0.0000
RFQ -
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MT88L70ANR1 Microchip Technology
20 Terminations3V 20 Pin Telecom device1 Circuits
Price: 0.0000
RFQ -
CYV15G0401DXB-BGXC Cypress Semiconductor Corp
256 Terminations3.3V 256 Pin CY*15G04 Telecom device4 Circuits
Price: 0.0000
RFQ -
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