Items : %s%s
IC Test Clips
Additional Feature
- PGA SOCKET
Body Material
- Glass, Nylon
- Gold
Color
- Black
- Black, Gold
- Blue
- Gold
- Grey
- Red
- White
Connector Type
- Clip
- Clip, DIP
- Clip, Socket
Contact Material
- BERYLLIUM COPPER
- COPPER ALLOY
- Nickel Silver
- NOT SPECIFIED
Contact Plating
- Gold
- Gold, Silver
- Nickel, Silver
- Silver
ECCN Code
- EAR99
Factory Lead Time
- 2 Weeks
- 3 Weeks
- 4 Weeks
- 5 Weeks
- 9 Weeks
Gender
- Female
- Male
Housing Material
- GLASS FILLED POLYAMIDE
- Plastic
- Polyester
HTS Code
- 8536.69.40.40
Insulation Material
- Glass
- Nylon
JESD-609 Code
- e4
Material
- Glass
- Glass, Polyester
- Gold
- Thermoplastic
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- Not Applicable
Mount
- Cable
- Surface Mount
- Through Hole
Number of Pins
- 100
- 128
- 14
- 144
- 16
- 160
- 176
- 18
- 20
- 208
- 22
- 24
- 240
- 28
- 32
- 36
- 40
- 44
- 48
- 52
- 56
- 64
- 68
- 8
- 80
- 84
Number of Positions
- 14
- 16
- 18
- 20
- 22
- 24
- 28
- 36
- 40
- 44
- 48
- 64
- 68
- 8
Number of Positions or Pins (Grid)
- 100 (11 x 11)
- 100 (2 x 20, 2 x 30)
- 100 (4 x 25)
- 128 (4 x 32)
- 14 (2 x 7)
- 144 (13 x 13)
- 144 (4 x 36)
- 16 (2 x 8)
- 160 (4 x 40)
- 176 (14 x 14)
- 18 (2 x 9)
- 20 (2 x 10)
- 20 (4 x 5)
- 208 (4 x 52)
- 22 (2 x 11)
- 24 (2 x 12)
- 240 (17 x 17)
- 28 (2 x 14)
- 28 (4 x 7)
- 32 (2 x 16)
- 32 (2 x 7, 2 x 9)
- 36 (2 x 18)
- 40 (2 x 20)
- 44 (2 x 22)
- 44 (4 x 11)
- 48 (2 x 24)
- 52 (4 x 13)
- 56 (2 x 28)
- 64 (2 x 32)
- 64 (4 x 16)
- 68 (4 x 17)
- 8 (1 x 8)
- 8 (2 x 4)
- 80 (2 x 16, 2 x 24)
- 80 (4 x 20)
- 84 (4 x 21)
Orientation
- Straight
Package / Case
- DIP
- LCC
- PLCC
- SOIC
- SSOP
- TQFP
Packaging
- Bulk
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1998
- 1999
- 2002
- 2003
- 2008
- 2011
- 2014
Series
- 5747
- 5878
- 5893
- 5894
- 5969
- 5972
- 5998
- 6150
- 6151
- 6152
- 923
- 927
- BU
- DIP Clip®
- EIAJ
- JEDEC
- QUAD Clip™
- SOIC Clip®
Termination
- PCB
- SMD/SMT
- Solder
Type
- DIP with Cable Assembly
- DIP, .300
- DIP, .600
- DIP, .900
- DIP, 0.3 Row Spacing
- DIP, 0.5 to 0.6 Row Spacing
- DIP, Open Back
- DIP, Standard
- Integrated Circuit (IC)
- LCC, .050
- PLCC
- PLCC, .050
- QFP, 0.50mm Pitch
- QFP, 0.65mm Pitch
- QFP, 0.80mm Pitch
- SOIC, 0.15 Body
- SOIC, 0.15 to 0.30 Wide
- SOIC, 0.15 to 0.35 Wide
- SOIC, 0.30 Body
- SOIC, 0.30 to 0.60 Wide
- SSOP, 0.025 Pitch
- SSOP, 0.65mm Pitch
Voltage - Rated
- 270V
- 500V
- 94V
Weight
- 200.850701g
- 22.679619g
- 23.133211g
- 23.586803g
- 24.040396g
- 24.94758g
- 28.349523g
- 29.483504g
- 43.091275g
- 453.59237g
- 46.493218g
- 56.699046g
- 95.254398g
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Series | Part Status | Moisture Sensitivity Level (MSL) | RoHS Status | Type | Number of Positions or Pins (Grid) | Contact Finish |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
BU-P5250 | Mueller Electric Co | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | BU | Active | Not Applicable | RoHS Compliant | SOIC, 0.15 to 0.35 Wide | 8 (1 x 8) | Gold |
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