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Thermal Management

Thermal management is a crucial aspect of electronic components classification. It refers to the process of controlling the temperature of electronic devices to ensure optimal performance and prevent damage. Effective thermal management involves the use of various techniques such as heat sinks, fans, and thermal interface materials to dissipate heat generated by electronic components. This helps to maintain a safe operating temperature range and prevent overheating, which can lead to reduced performance, premature failure, and even safety hazards. With proper thermal management, electronic devices can operate efficiently and reliably, ensuring their longevity and optimal performance.

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH)
SP1100ST-0.012-02-34 SP1100ST-0.012-02-34 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
HF300P-0.001-00-89 HF300P-0.001-00-89 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
2465101 2465101 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
SP980-0.009-AC-119 SP980-0.009-AC-119 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
SP980-0.009-AC-117 SP980-0.009-AC-117 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
HF300P-0.002-00-64 HF300P-0.002-00-64 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
HF625-0.005-00-95 HF625-0.005-00-95 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
GF1500-10-60-200CC GF1500-10-60-200CC Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
BP100-0.005-00-75 BP100-0.005-00-75 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
LBSA1000-00-00-600CC LBSA1000-00-00-600CC Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
HF650P-0.0015-01-45 HF650P-0.0015-01-45 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
HF625-0.005-AC-5 HF625-0.005-AC-5 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
TGP12000ULM-0.040-00-0808 TGP12000ULM-0.040-00-0808 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
HF625-0.005-00-51 HF625-0.005-00-51 Bergquist 0.0000
RFQ

Min: 1

Mult: 1

0.00000000
SP400-0.007-AC-32 SP400-0.007-AC-32 Bergquist 0.0000
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Min: 1

Mult: 1

0.00000000
  • SP1100ST-0.012-02-34
    SP1100ST-0.012-02-34 Bergquist

    Thermal Interface Products Insulating, Conductive, Soft Tack, 0.012" Thickness, Sil-Pad TSP 1100ST/1100ST

    Price: 0.0000

    RFQ
  • HF300P-0.001-00-89
    HF300P-0.001-00-89 Bergquist

    Thermal Interface Products Conductive Phase Change Material, 0.001" Thickness, Hi-Flow THF 1600P/300P

    Price: 0.0000

    RFQ
  • 2465101
    2465101 Bergquist

    Thermal Interface Products GAP PAD, Conductive, Sil-Free, TGP2000SF/2000SF, GP2000SF-0.020-02-0816

    Price: 0.0000

    RFQ
  • SP980-0.009-AC-119
    SP980-0.009-AC-119 Bergquist

    Thermal Interface Products Insulator, Low-Pressure, 0.009" Thickness, 1Side Adhesive, Sil-Pad TSP1680/980

    Price: 0.0000

    RFQ
  • SP980-0.009-AC-117
    SP980-0.009-AC-117 Bergquist

    Thermal Interface Products Insulator, Low-Pressure, 0.009" Thickness, 1Side Adhesive, Sil-Pad TSP1680/980

    Price: 0.0000

    RFQ
  • HF300P-0.002-00-64
    HF300P-0.002-00-64 Bergquist

    Thermal Interface Products Conductive Phase Change Material, 0.002" Thickness, Hi-Flow THF 1600P/300P

    Price: 0.0000

    RFQ
  • HF625-0.005-00-95
    HF625-0.005-00-95 Bergquist

    Thermal Interface Products Phase Change Material, 0.005" Thickness, Hi-Flow THF 500/625

    Price: 0.0000

    RFQ
  • GF1500-10-60-200CC
    GF1500-10-60-200CC Bergquist

    Thermal Interface Products Conductive, Liquid Gap Filler, 200CC Dual Cartridge, Gap Filler TGF 1500/1500

    Price: 0.0000

    RFQ
  • BP100-0.005-00-75
    BP100-0.005-00-75 Bergquist

    Thermal Interface Products Fiberglass Reinforced Adhesive Tape, 0.005" Thickness, Bond-Ply TBP 850/100

    Price: 0.0000

    RFQ
  • LBSA1000-00-00-600CC
    LBSA1000-00-00-600CC Bergquist

    Thermal Interface Products Liquid Silicon Adhesive, 1-Part, 600CC Cartridge, Liqui-Bond TLB SA1000/SA1000

    Price: 0.0000

    RFQ
  • HF650P-0.0015-01-45
    HF650P-0.0015-01-45 Bergquist

    Thermal Interface Products Conductive Phase Change Material, 0.0015" Thickness, Hi-Flow THF 1500P/650P

    Price: 0.0000

    RFQ
  • HF625-0.005-AC-5
    HF625-0.005-AC-5 Bergquist

    Thermal Interface Products Phase Change Material, 0.005" Thickness, 1 Side Adhesive, Hi-Flow THF 500/625

    Price: 0.0000

    RFQ
  • TGP12000ULM-0.040-00-0808
    TGP12000ULM-0.040-00-0808 Bergquist

    Thermal Interface Products GAP PAD, 12W/m-K, Ultra-Low Modulus, 8"x8" Sheet, 0.040" Thickness, TGP12000ULM

    Price: 0.0000

    RFQ
  • HF625-0.005-00-51
    HF625-0.005-00-51 Bergquist

    Thermal Interface Products Phase Change Material, 0.005" Thickness, Hi-Flow THF 500/625

    Price: 0.0000

    RFQ
  • SP400-0.007-AC-32
    SP400-0.007-AC-32 Bergquist

    Thermal Interface Products Original Sil-Pad Material, 0.007" Thickness, 1Side Adhesive, Sil-Pad TSP900/400

    Price: 0.0000

    RFQ
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