Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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MT29E6T08ETHBBM5-3:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 3 (168 Hours) | ROHS3 Compliant | 0°C~70°C TA | FLASH - NAND | 6Tb 768G x 8 | Non-Volatile | 2.5V~3.6V | 333MHz | FLASH | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V3559S75BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 165 | 70°C | 0°C | 3.3V | 1 | 15mm | RoHS Compliant | Contains Lead | No | 165 | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 13mm | 1.2mm | CMOS | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 18b | Synchronous | 0.04A | 18b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V3319S166BCG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Bulk | 2009 | yes | Active | 3 (168 Hours) | 256 | 70°C | 0°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | COMMERCIAL | YES | 1mm | SRAMs | 3-STATE | 3.6 ns | 166MHz | 512kB | RAM, SDR, SRAM | 36b | 0.5mA | 0.03A | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AS4C256M16D3LB-10BCN | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 96-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR3L | 20ns | 4Gb 256M x 16 | Volatile | 1.283V~1.45V | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V27L15PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2012 | Active | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 512 kb | 14mm | 1.4mm | 225mA | 15 ns | 64kB | RAM, SDR, SRAM | 30b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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U6264BDC07LLG1 | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Through Hole | Tube | 2011 | yes | Discontinued | 1 (Unlimited) | 28 | EAR99 | 5V | 1 | ROHS3 Compliant | Lead Free | No | 28 | 28-DIP (0.600, 15.24mm) | 64 kb | Through Hole | 0°C~70°C TA | SRAM - Asynchronous | 1 | DUAL | 260 | 5V | 40 | 28 | 2.54mm | 64Kb 8K x 8 | Volatile | 13b | 4.5V~5.5V | 8KX8 | 8 | 70 ns | SRAM | Parallel | 70ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70914S15J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2010 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | AUTOMATIC POWER-DOWN; LOW POWER STANDBY MODE; SELF TIMED WRITE | PLCC | Parallel | 5.5V | 4.5V | 36 kb | 50MHz | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | COMMERCIAL | SRAMs | 5V | 3-STATE | 15 ns | RAM, SRAM | 12b | 4KX9 | Synchronous | 0.015A | 9b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7015L12JG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | yes | Active | 3 (168 Hours) | 68 | EAR99 | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Lead Free | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 5.5V | 4.5V | 72 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 275mA | e3 | MATTE TIN | QUAD | J BEND | 260 | 5V | 68 | COMMERCIAL | 12 ns | 9kB | RAM, SDR, SRAM | 13b | 8KX9 | Asynchronous | 9b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85R256GPF-G-BND-ERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | FRAM | Parallel | 150ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32FVSSIQ | Winbond Electronics | 0.2968 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | 2016 | SpiFlash® | Obsolete | 3 (168 Hours) | 8 | 3V | 5.23mm | ROHS3 Compliant | No | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 32 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2.16mm | 1 | 20mA | DUAL | 3V | 1.27mm | 2.7V | 3.6V | 7 ns | 32Mb 4M x 8 | Non-Volatile | 24b | 2.7V~3.6V | 32MX1 | 1 | Synchronous | 104MHz | 0.00002A | 8b | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 2.7V | 256B | SPI | FLASH | SPI - Quad I/O, QPI | 50μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MTFC4GMTEA-4M IT | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 153-WFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7134SA70CB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Bulk | 2005 | no | Active | 1 (Unlimited) | 48 | 125°C | -55°C | 5V | 2 | 61.72mm | RoHS Compliant | Contains Lead | No | 48 | AUTOMATIC POWER-DOWN | DIP | Parallel | 5.5V | 4.5V | 32 kb | 15.24mm | 3.3mm | CMOS | 1 | 270mA | e0 | Tin/Lead (Sn/Pb) | DUAL | 240 | 5V | 48 | MILITARY | SRAMs | 5V | 3-STATE | 70 ns | 38535Q/M;38534H;883B | RAM, SRAM | 24b | 4KX8 | Asynchronous | 0.03A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V25761SA166BQI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 165 | 3A991.B.2.A | 85°C | -40°C | 15mm | Non-RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | not_compliant | 166MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 165 | INDUSTRIAL | YES | 1mm | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.33mA | 128KX36 | 36 | 4718592 bit | 0.035A | 3.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q16DWSSIG | Winbond Electronics | 0.1993 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2016 | SpiFlash® | Discontinued | 3 (168 Hours) | 8 | EAR99 | 5.23mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | DUAL | 1.8V | 8 | YES | 1.27mm | S-PDSO-G8 | 1.65V | Not Qualified | 1.8V | 1.95V | 16Mb 2M x 8 | Non-Volatile | 0.04mA | 1.65V~1.95V | 16MX1 | 1 | 16777216 bit | 104MHz | 0.000005A | 20 | 100000 Write/Erase Cycles | HARDWARE/SOFTWARE | 1.8V | SPI | FLASH | SPI - Quad I/O, QPI | 40μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24C04N-10SI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2001 | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT24C04 | 8-SOIC | 900ns | 4Kb 512 x 8 | Non-Volatile | 4.5V~5.5V | 400kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71V3557S75BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 275mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 7.5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT24CM01-XHM-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Cut Tape (CT) | 1997 | yes | Active | 1 (Unlimited) | 8 | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 1 Mb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 5V | 40 | AT24CM01 | YES | 0.65mm | 1.7V | 5.5V | 550ns | 1Mb 128K x 8 | Non-Volatile | 0.003mA | 1.7V~5.5V | 8 | 1MHz | 0.000001A | 40 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT35XU02GCBA1G12-0AAT | Micron Technology Inc. | 31.3671 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tray | Xccela™ - MT35X | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | 24-TBGA | 6mm | Surface Mount | -40°C~105°C | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | YES | 1mm | R-PBGA-B24 | 1.7V | 2V | AEC-Q100 | 2Gb 256M x 8 | Non-Volatile | 1.7V~2V | 2GX1 | 1 | 2147483648 bit | SERIAL | 200MHz | 1.8V | FLASH | Xccela Bus | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX29GL512FUT2I-12G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 16 Weeks | Tray | MX29GL | Active | 3 (168 Hours) | 56 | 18.4mm | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | YES | 0.5mm | R-PDSO-G56 | 2.7V | Not Qualified | 3/3.3V | 3.6V | 512Mb 64M x 8 | Non-Volatile | 0.03mA | 2.7V~3.6V | 32MX16 | 16 | 536870912 bit | 0.00002A | 120 ns | 8 | 3V | YES | YES | YES | 512 | 8/16words | YES | YES | FLASH | Parallel | 120ns | 128K | |||||||||||||||||||||||||||||||||||||||||||||||||||||
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70261L20PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | IDT7026 | 256Kb 16K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
| CY7C1312BV18-167BZCT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2003 | no | Obsolete | 3 (168 Hours) | 165 | 15mm | Non-RoHS Compliant | Contains Lead | 165 | PIPELINED ARCHITECTURE | 165-LBGA | not_compliant | 13mm | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 1.4mm | 1 | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | CY7C1312 | YES | 1mm | 1.7V | Not Qualified | 1.5/1.81.8V | 1.9V | 3-STATE | 500 ps | 18Mb 1M x 18 | Volatile | 0.6mA | 1.7V~1.9V | 1MX18 | 18 | 18874368 bit | 167MHz | 0.36A | SEPARATE | 1.7V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W25Q32JWSSIQ | Winbond Electronics | 0.8796 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tube | SpiFlash® | Active | 3 (168 Hours) | 8 | 5.23mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | S-PDSO-G8 | 1.7V | 1.95V | 32Mb 4M x 8 | Non-Volatile | 1.7V~1.95V | 4MX8 | 8 | 33554432 bit | SERIAL | 133MHz | 1 | 1.8V | FLASH | SPI - Quad I/O | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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M29W128GL60ZA6E | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2013 | yes | Obsolete | 3 (168 Hours) | 64 | 3A991.B.1.A | 13mm | ROHS3 Compliant | No | 64 | 64-TBGA | 128 Mb | 10mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | e1 | TIN SILVER COPPER | BOTTOM | 260 | 3V | 30 | M29W128 | 64 | YES | 1mm | 3/3.3V | 2.7V | 128Mb 16M x 8 8M x 16 | Non-Volatile | 0.02mA | 2.7V~3.6V | 8KX16 | 16 | 0.0001A | 60 ns | 8 | YES | YES | YES | 128 | 8/16words | YES | YES | FLASH | Parallel | 60ns | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||||
| IS43R16320D-6BL | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tray | yes | Active | 3 (168 Hours) | 60 | EAR99 | 2.5V | 1 | 13mm | ROHS3 Compliant | 60 | AUTO/SELF REFRESH | 60-TFBGA | No SVHC | 512 Mb | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 370mA | e1 | TIN SILVER COPPER | BOTTOM | 260 | 2.5V | 40 | 60 | 1mm | 2.3V | Not Qualified | 2.7V | 3-STATE | 700ps | 512Mb 32M x 16 | Volatile | 15b | 2.3V~2.7V | 32MX16 | 16 | 16b | 166MHz | 0.025A | COMMON | 64MB | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||
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70V05S55J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V05 | 64Kb 8K x 8 | Volatile | 3V~3.6V | SRAM | Parallel | 55ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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DS28CZ04G-4+ | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2008 | Obsolete | 1 (Unlimited) | 12 | EAR99 | 4mm | ROHS3 Compliant | 12-WQFN Exposed Pad | 2-Wire, I2C, Serial | 4mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.8mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | QUAD | 260 | 3.6V | NOT SPECIFIED | DS28CZ04 | 12 | YES | 0.8mm | S-XQCC-N12 | 2V | Not Qualified | 2.5/5V | 5.25V | 4Kb 512 x 8 | Non-Volatile | 0.0005mA | 2V~5.25V | 512X8 | 8 | 4096 bit | 400kHz | 40 | 200000 Write/Erase Cycles | HARDWARE | 5V | I2C | 1010DDMR | EEPROM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SST39VF1602C-70-4I-B3KE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2000 | SST39 MPF™ | Active | 3 (168 Hours) | 48 | 3.3V | ROHS3 Compliant | No | 48 | 48-TFBGA | 16 Mb | Surface Mount | -40°C~85°C TA | CMOS | 18mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | SST39VF1602C | 0.8mm | 70ns | 16Mb 1M x 16 | Non-Volatile | 20b | 2.7V~3.6V | 1MX16 | 16 | Asynchronous | 16b | 0.00002A | 16b | YES | YES | YES | 12131 | YES | YES | FLASH | Parallel | 10μs | 8K4K16K32K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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W29GL032CB7A | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tube | yes | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 8mm | ROHS3 Compliant | No | 48 | BOTTOM BOOT BLOCK | 48-TFBGA | 32 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 55mA | e1 | TIN SILVER COPPER | BOTTOM | 3V | 48 | 0.8mm | 2.7V | 3/3.3V | 3.6V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 21b | 2.7V~3.6V | 32MX1 | 1 | Asynchronous | 0.000005A | 70 ns | 8 | 3V | YES | YES | YES | 863 | 8/16words | YES | YES | FLASH | Parallel | 70ns | 8K64K | BOTTOM | |||||||||||||||||||||||||||||||||||||||||||||||||||
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DS1245Y-100 | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | no | Obsolete | 3 (168 Hours) | 32 | Non-RoHS Compliant | 32-DIP Module (0.600, 15.24mm) | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 1 | e0 | TIN LEAD | DUAL | 245 | 5V | NOT SPECIFIED | 32 | NO | R-XDMA-T32 | 4.5V | COMMERCIAL | 5.5V | 1Mb 128K x 8 | Non-Volatile | 4.5V~5.5V | 128KX8 | 8 | 1048576 bit | 100 ns | NVSRAM | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71V3578S150PFI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 100-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3578 | 3.8ns | 4.5Mb 256K x 18 | Volatile | 3.135V~3.465V | 150MHz | SRAM | Parallel |
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