Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Voltage - Rated DC | Technology | Operating Mode | Max Supply Current | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Output Enable | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
93AA56-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Through Hole | Tube | 2004 | yes | Active | Not Applicable | 8 | EAR99 | 9.46mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1000K ERASE/WRITE CYCLE; 200 YEAR DATA RETENTION | 8-DIP (0.300, 7.62mm) | Serial | 2 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 4.32mm | 1 | 3mA | e3 | DUAL | 3V | 93AA56 | 8 | 2.54mm | 5.5V | 2 μs | 2Kb 256 x 8 128 x 16 | Non-Volatile | 1.8V~5.5V | 16 | 2MHz | 8 | 10ms | MICROWIRE | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC080D-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2009 | yes | Active | 3 (168 Hours) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 8 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 5mA | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 25LC080D | 8 | 1.27mm | 100 ns | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7016L20J8") |
7016L20J8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7016 | 144Kb 16K x 9 | Volatile | 4.5V~5.5V | SRAM | Parallel | 20ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25AA640AX-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 64 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | DUAL | 260 | 2.5V | 40 | 25AA640A | 8 | YES | 0.65mm | 160 ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7005L20G | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | 2012 | Active | 70°C | 0°C | 5V | 2 | 29.46mm | RoHS Compliant | Contains Lead | No | 68 | Parallel | 5.5V | 4.5V | 64 kb | 29.46mm | 3.68mm | 240mA | 20 ns | 8kB | RAM, SDR, SRAM | 26b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7025L15PFG8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 100-LQFP | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT7025 | 100-TQFP (14x14) | 15ns | 128Kb 8K x 16 | Volatile | 4.5V~5.5V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W74M12JVSSIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 12 Weeks | Tape & Reel (TR) | SpiFlash® | Active | 1 (Unlimited) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O, QPI | 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
M29F200FB55M3E2 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2014 | yes | Obsolete | 3 (168 Hours) | 44 | EAR99 | 5V | 28.5mm | ROHS3 Compliant | No | 44 | BOTTOM BOOT BLOCK | 44-SOIC (0.496, 12.60mm Width) | 2 Mb | 12.6mm | Surface Mount | -40°C~125°C TA | FLASH - NOR | 3mm | 8542.32.00.51 | 1 | 20mA | DUAL | 260 | 5V | 30 | M29F200 | 44 | YES | 1.27mm | 5V | 4.5V | AEC-Q100 | 2Mb 256K x 8 128K x 16 | Non-Volatile | 4.5V~5.5V | 128KX16 | 16 | Asynchronous | 0.00012A | 55 ns | 8 | YES | YES | YES | 1213 | YES | YES | FLASH | Parallel | 55ns | 16K8K32K64K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F4G08ABBDAM60A3WC1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Box | Obsolete | RoHS Compliant | 4 Gb | Surface Mount | 1.8V | 1.8V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M24C02-DRDW8TP/K | STMicroelectronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | ACTIVE (Last Updated: 7 months ago) | Cut Tape (CT) | Automotive, AEC-Q100 | Active | 1 (Unlimited) | 8 | EAR99 | 4.4mm | ROHS3 Compliant | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, I2C, Serial | 3mm | Surface Mount | -40°C~105°C TA | CMOS | SYNCHRONOUS | 1.2mm | 1 | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 2.5V | NOT SPECIFIED | M24C02 | YES | 0.65mm | Not Qualified | 2/5V | 5.5V | 450ns | 2Kb 256 x 8 | Non-Volatile | 0.002mA | 1.8V~5.5V | 8 | 1MHz | 0.000001A | 50 | 900000 Write/Erase Cycles | HARDWARE | 4ms | I2C | 1010DDDR | EEPROM | I2C | 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S99GL01GP0609 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | 2016 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
25AA640A-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2012 | Active | 1 (Unlimited) | ROHS3 Compliant | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 64 kb | Surface Mount | -40°C~125°C TA | e3 | Matte Tin (Sn) - annealed | 260 | 40 | 25AA640A | 100 ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 10MHz | SPI | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9864G6JB-6 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2016 | Obsolete | 3 (168 Hours) | 60 | EAR99 | 3.3V | 1 | 10.1mm | ROHS3 Compliant | 60 | AUTO/SELF REFRESH | 60-TFBGA | 64 Mb | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.1mm | 8542.32.00.02 | 1 | 75mA | BOTTOM | 3.3V | 60 | 0.65mm | 3V | 3.6V | 5ns | 64Mb 4M x 16 | Volatile | 14b | 3V~3.6V | 4MX16 | 16 | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3577S85BGI | Renesas Electronics America Inc. | 70.4532 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tray | Active | 3 (168 Hours) | Non-RoHS Compliant | 119-BGA | Surface Mount | -40°C~85°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 119-PBGA (14x22) | 8.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | 87MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7140LA20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | PLCC | Parallel | 5.5V | 4.5V | 8 kb | 3.63mm | 19mm | 3.63mm | 2.96261g | CMOS | 110mA | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 1kB | RAM, SDR, SRAM | 10b | 1KX8 | Asynchronous | 0.0015A | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46V64M8P-75:D | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 2007 | Obsolete | 4 (72 Hours) | 66 | EAR99 | 2.5V | 1 | 22.22mm | ROHS3 Compliant | Lead Free | 66 | AUTO/SELF REFRESH | 66-TSSOP (0.400, 10.16mm Width) | unknown | 512 Mb | Surface Mount | 0°C~70°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | 145mA | e3 | Matte Tin (Sn) | DUAL | 260 | 2.5V | 30 | MT46V64M8 | 66 | 0.65mm | 2.3V | Not Qualified | 2.7V | 3-STATE | 750ps | 512Mb 64M x 8 | Volatile | 15b | 2.3V~2.7V | 64MX8 | 8 | 133MHz | 0.005A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT24C01BY6-YH-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | Obsolete | 1 (Unlimited) | 8 | 5V | 3mm | ROHS3 Compliant | Lead Free | 8 | 8-UFDFN Exposed Pad | 2-Wire, I2C, Serial | 1 kb | 2mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 0.6mm | 1 | 3mA | DUAL | 5V | AT24C01 | 0.5mm | 550ns | 1Kb 128 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 1MHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709289L9PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 1 Mb | 40MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 400mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 20 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX16 | Synchronous | 0.003A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
93AA86A-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Tin | No | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 16 kb | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1.75mm | 1 | 3mA | e3 | DUAL | 260 | 2.5V | 40 | 93AA86A | 8 | 1.27mm | 100 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 3MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT40A2G4WE-075E:D TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 78-TFBGA | Surface Mount | 0°C~95°C TC | SDRAM - DDR4 | 8Gb 2G x 4 | Volatile | 1.14V~1.26V | 1.33GHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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93AA56/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 28 Weeks | Tube | 2004 | yes | Active | Not Applicable | 8 | EAR99 | 9.46mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 100K ERASE/WRITE CYCLES MIN; DATA RETENTION > 40 YEARS | 8-DIP (0.300, 7.62mm) | Serial | 2 kb | 7.62mm | Through Hole | 0°C~70°C TA | CMOS | 4.32mm | 1 | 3mA | e3 | DUAL | 3V | 93AA56 | 8 | NO | 2.54mm | 2/5V | 5.5V | 3-STATE | TS 16949 | 2Kb 256 x 8 128 x 16 | Non-Volatile | 1.8V~5.5V | 16 | 2MHz | 0.00003A | 8 | 200 | 10000000 Write/Erase Cycles | SOFTWARE | 10ms | MICROWIRE | EEPROM | SPI | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL256LAGBHM030 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 15 Weeks | Tray | 2016 | Automotive, AEC-Q100, FL-L | Active | 3 (168 Hours) | 24 | 8mm | ROHS3 Compliant | IT ALSO HAVE MEMORY WIDTH X 1 | 24-TBGA | 6mm | Surface Mount | -40°C~125°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 2.7V | 3.6V | 256Mb 32M x 8 | Non-Volatile | 2.7V~3.6V | 64MX4 | 4 | 268435456 bit | SERIAL | 133MHz | 2 | 3V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7025L55FB | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | 2012 | no | Active | 1 (Unlimited) | 84 | 125°C | -55°C | 5V | 2 | 29.2mm | RoHS Compliant | Contains Lead | No | 84 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE; BATTERY BACKUP | Parallel | 5.5V | 4.5V | 128 kb | 29.21mm | 2.54mm | CMOS | 1 | 250mA | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 5V | 84 | MILITARY | 3-STATE | 55 ns | MIL-PRF-38535 | 16kB | RAM, SDR, SRAM | 26b | 8KX16 | Asynchronous | 0.004A | 16b | YES | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24C01C-I/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tube | 1997 | yes | Active | 1 (Unlimited) | 8 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | DATA RETENTION > 200 YEARS, 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-TSSOP (0.173, 4.40mm Width) | I2C, Serial | 1 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.2mm | 1 | 3mA | e3 | DUAL | 260 | 5V | 40 | 24C01C | 8 | 0.65mm | 5V | 900ns | 1Kb 128 x 8 | Non-Volatile | 4.5V~5.5V | 8 | 400kHz | 0.00005A | 200 | 1000000 Write/Erase Cycles | 1ms | I2C | 1010DDDR | EEPROM | I2C | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
93AA46AE48T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2010 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | Tin | 8 | 8-SOIC (0.154, 3.90mm Width) | Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | DUAL | 260 | 2.5V | 40 | 93AA46A | YES | 1.27mm | 5.5V | TS 16949 | 1Kb 128 x 8 | Non-Volatile | 1.8V~5.5V | 8 | 1024 bit | 2MHz | 3-WIRE | EEPROM | SPI | 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M29F040B55N1 | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Surface Mount | Tray | 1998 | Obsolete | 3 (168 Hours) | 70°C | 0°C | 5V | ROHS3 Compliant | 32 | 32-TFSOP (0.724, 18.40mm Width) | Parallel | 5.5V | 4.5V | 4 Mb | Surface Mount | 0°C~70°C TA | FLASH - NOR | 15mA | M29F040 | 32-TSOP | 55ns | 4Mb 512K x 8 | Non-Volatile | 19b | 4.5V~5.5V | Asynchronous | 8b | FLASH | Parallel | 55ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71321SA45J | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 52-LCC (J-Lead) | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT71321 | 52-PLCC (19.13x19.13) | 45ns | 16Kb 2K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 45ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7007S35JI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 68-LCC (J-Lead) | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 256Kb 32K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FL164K0XMFA000 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 26 Weeks | Tray | 2013 | Automotive, AEC-Q100, FL1-K | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 108MHz | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16-SOIC | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 108MHz | FLASH | SPI - Quad I/O | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3576S133PFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 260mA | e3 | Matte Tin (Sn) - annealed | QUAD | FLAT | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.035A | 36b | COMMON |
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71V3576S133PFGI Integrated Device Technology (IDT)
Surface Mount 100 Pin Memory IC 4.5 Mb kb 20mm mm 260mA mA 36b b
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RFQ
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