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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Color Gender Contact Finish - Mating Orientation Depth Number of Contacts ELV Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Voltage - Rated Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Width Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Max Current Rating Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Material Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
110-43-314-41-001000 110-43-314-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2006 110 yes Active 1 (Unlimited) DIP, Socket Solder 14 EAR99 Gold Straight 10.16mm 14 17.78mm ROHS3 Compliant UL94 V-0 Lead Free Gold, Nickel 3A No DIP No SVHC 4.19mm 10.16mm Through Hole -55°C~125°C 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.3 (7.62mm) Row Spacing e3 Polychlorinated 2 Open Frame 7.62 mm 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 14 (2 x 7) Beryllium Copper Brass Alloy 0.125 3.18mm 0.100 2.54mm
515-91-056-09-041002 515-91-056-09-041002 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant
522-93-052-09-045003 522-93-052-09-045003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active Non-RoHS Compliant
2-641264-1 2-641264-1 TE Connectivity AMP Connectors 0.0000
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0.00000000 download 16 Weeks Vertical Thermoplastic, Glass Filled Tube 2008 Diplomate DL yes Obsolete 1 (Unlimited) DIP, Socket Solder 20 EAR99 Black Female Tin Straight 10.01mm 20 Compliant 25.27mm RoHS Compliant UL94 V-0 Lead Free Copper No Unknown 5.33mm Through Hole -55°C~105°C 8536.69.40.40 30mOhm 10GOhm DIP, 0.3 (7.62mm) Row Spacing 3.05mm e3 2.54mm Thermoplastic 0.394 inch 2 RECTANGULAR BELLOWED TYPE 0.1 inch 1000VAC V Closed Frame UL94 V-0 7.87 mm 0.100 2.54mm 20 (2 x 10) Beryllium Copper Beryllium Copper 0.120 3.05mm 0.100 2.54mm
511-93-089-13-082002 511-93-089-13-082002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 89 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA89
126-43-314-41-001000 126-43-314-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC 2013 yes Active EAR99 125°C -55°C Straight 10.1mm 14 17.7mm ROHS3 Compliant Contains Lead NOT SPECIFIED Gold 3A DIP SOCKET 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 Matte Tin (Sn) - with Nickel (Ni) barrier 2.54mm 7.62 mm IC SOCKET DIP14
511-91-145-13-041003 511-91-145-13-041003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant
614-13-085-13-042012 614-13-085-13-042012 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 85 ROHS3 Compliant NOT SPECIFIED LOW PROFILE 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA85
36-6513-10T 36-6513-10T Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 36 EAR99 Gold 36 ROHS3 Compliant UL94 V-0 3A LOW PROFILE; UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.175mm e3 3.6 inch 0.7 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 36 (2 x 18) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
18-7XXXX-10 18-7XXXX-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2013 700 Elevator Strip-Line™ Active 1 (Unlimited) Solder 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1.5A 18 SIP Through Hole -55°C~105°C SIP 3.81mm Elevated 1.5A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 18 (1 x 18) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
511-93-142-15-085002 511-93-142-15-085002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 142 Non-RoHS Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e0 Tin/Lead (Sn/Pb) IC SOCKET PGA142
110-88-318-41-530000 110-88-318-41-530000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 PLASTIC no Active EAR99 TIN LEAD (100) 18 Non-RoHS Compliant NOT SPECIFIED STANDARD: MIL-S-83734, STACKABLE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET DIP18
346-43-130-41-013000 346-43-130-41-013000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Bulk 2011 346 yes Active 1 (Unlimited) Press-Fit EAR99 Gold 30 76.2mm ROHS3 Compliant Lead Free Copper 30 2.79mm 2.54mm Through Hole -55°C~125°C 8536.90.40.00 SIP e3 3A 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 30 (1 x 30) Beryllium Copper Brass Alloy 0.175 4.45mm 0.100 2.54mm
SIP1X07-011BLF SIP1X07-011BLF Amphenol ICC (FCI) 0.0000
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Min: 1

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0.00000000 Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2006 SIP1x yes Obsolete 1 (Unlimited) Solder EAR99 Gold 7 20.3mm RoHS Compliant UL94 V-0 Copper 7 STANDARD: UL 94V-0 4.19mm 2.54mm Through Hole 8536.69.40.40 SIP 3.175mm Closed Frame UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 7 (1 x 7) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
612-93-650-41-004000 612-93-650-41-004000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC no Active EAR99 125°C -55°C Straight 17.78mm 50 63.5mm Non-RoHS Compliant Copper Gold 3A 150V 100V 8536.90.40.00 10mOhm 10GOhm e0 Polychlorinated 2 Tin/Lead (Sn/Pb) 2.54mm 15.24 mm IC SOCKET DIP50
510-87-238-19-101101 510-87-238-19-101101 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 510 Active 1 (Unlimited) Solder EAR99 Gold 238 ROHS3 Compliant UL94 V-0 1A 238 STANDARD: UL 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm PGA 3.175mm e3 Open Frame UL94 V-0 0.100 2.54mm Tin Flash 238 (19 x 19) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
15-0513-11H 15-0513-11H Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 0513 yes Active 1 (Unlimited) Solder 15 EAR99 Gold 15 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e4 1 RECTANGULAR RND PIN-SKT UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 15 (1 x 15) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
23-7XXXX-10 23-7XXXX-10 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2013 700 Elevator Strip-Line™ Active 1 (Unlimited) Solder 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1.5A 23 SIP Through Hole -55°C~105°C SIP 3.81mm Elevated 1.5A UL94 V-0 0.100 2.54mm Tin 200.0μin 5.08μm 200.0μin 5.08μm 23 (1 x 23) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
515-91-081-09-000003 515-91-081-09-000003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant
110-83-964-41-530000 110-83-964-41-530000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 PLASTIC no Active EAR99 GOLD (30) OVER NICKEL (100) 64 Non-RoHS Compliant NOT SPECIFIED STANDARD: MIL-S-83734, STACKABLE 8536.90.40.00 e0 Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier IC SOCKET DIP64
146-91-320-41-012000 146-91-320-41-012000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant IC SOCKET
523-13-098-13-061003 523-13-098-13-061003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 3 Weeks Active ROHS3 Compliant
110-87-636-41-105101 110-87-636-41-105101 Preci-Dip 0.0000
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Min: 1

Mult: 1

0.00000000 download 10 Weeks Surface Mount Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 110 Active 1 (Unlimited) Solder EAR99 Gold 2.8mm 36 45.7mm ROHS3 Compliant UL94 V-0 Brass, Copper Gold, Tin 150V 1A 17.7mm Surface Mount -55°C~125°C 10mOhm 10000000000Ohm DIP, 0.6 (15.24mm) Row Spacing 2.9972mm RND PIN-SKT 0.1 inch 1400VAC V Open Frame UL94 V-0 0.100 2.54mm Tin Flash 36 (2 x 18) Beryllium Copper Brass 0.118 3.00mm 0.100 2.54mm
ICF-632-S-O-TR ICF-632-S-O-TR Samtec Inc. 7.2028
Add to Cart

Min: 1

Mult: 1

0.00000000 3 Weeks Surface Mount Liquid Crystal Polymer (LCP) Tape & Reel (TR) 2011 iCF yes Active 1 (Unlimited) Solder EAR99 Female Tin Straight 32 ROHS3 Compliant No TIGER EYE Surface Mount -55°C~125°C 8536.69.40.40 10mOhm 1A DIP, 0.6 (15.24mm) Row Spacing e3 1.6 inch 0.675 inch 2 RECTANGULAR 0.18 inch 0.1 inch Open Frame 0.100 2.54mm 32 (2 x 16) Beryllium Copper Beryllium Copper 0.100 2.54mm
116-91-950-41-003000 116-91-950-41-003000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant IC SOCKET
48-6621-30 48-6621-30 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 6621 Active 1 (Unlimited) Solder EAR99 Tin 48 ROHS3 Compliant UL94 V-0 1.5A 48 STANDARD: UL 94V-0 2.54mm Through Hole, Bottom Entry; Through Board -55°C~105°C DIP, 0.6 (15.24mm) Row Spacing 3.81mm e3 2.45 inch 0.9 inch RECTANGULAR 0.375 inch SQ PIN-SKT 0.1 inch Closed Frame 0.9 mm UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 48 (2 x 24) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
ED06DT ED06DT ON Shore Technology 0.0000
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0.00000000 download 8 Weeks Through Hole Polybutylene Terephthalate (PBT), Glass Filled Tube ED Active 1 (Unlimited) Solder Tin 6 ROHS3 Compliant UL94 V-0 1A 6 Through Hole -55°C~110°C 20mOhm 5000Ohm DIP, 0.3 (7.62mm) Row Spacing 2.54mm 0.3 inch 0.4 inch RECTANGULAR 0.201 inch 0.1 inch 1400VAC V Open Frame 0.3 mm UL94 V-0 0.100 2.54mm 60.0μin 1.52μm 60.0μin 1.52μm 6 (2 x 3) Phosphor Bronze Phosphor Bronze 0.100 2.54mm
32-3513-10 32-3513-10 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Lo-PRO®file, 513 yes Active 1 (Unlimited) Solder 32 EAR99 Gold 32 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 0.4 inch 2 RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 32 (2 x 16) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
523-93-052-09-045001 523-93-052-09-045001 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 52 Non-RoHS Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 0.9 inch 0.9 inch STRAIGHT RECTANGULAR 0.193 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier WIRE WRAP 0.1 mm IC SOCKET PGA52 9X9
210-11-636-41-001000 210-11-636-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant IC SOCKET
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