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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature Package / Case Lead Pitch Width Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Max Current Rating Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Max Voltage Rating (AC) Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
511-93-168-17-105002 511-93-168-17-105002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 168 Non-RoHS Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.7 inch 1.7 inch STRAIGHT RECTANGULAR 0.173 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA168 17X17
614-83-044-08-031112 614-83-044-08-031112 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 614 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 44 Through Hole -55°C~125°C 10mOhm PGA 3.4544mm Carrier, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 44 (8 x 8) Beryllium Copper Brass 0.136 3.45mm 0.100 2.54mm
522-13-225-18-091002 522-13-225-18-091002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
123-13-322-41-001000 123-13-322-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Wire Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2005 123 yes Active 1 (Unlimited) Wire Wrap EAR99 Gold Straight 10.16mm 22 27.94mm ROHS3 Compliant Copper 3A 22 2.54mm 10.2mm Through Hole -55°C~125°C 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.3 (7.62mm) Row Spacing e4 Polychlorinated 2 Open Frame 7.62 mm 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 22 (2 x 11) Beryllium Copper Brass Alloy 0.510 12.95mm 0.100 2.54mm
122-13-320-41-801000 122-13-320-41-801000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Wire Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2012 122 yes Active 1 (Unlimited) Wire Wrap EAR99 Gold Straight 10.16mm 20 25.3mm ROHS3 Compliant 3A 20 LOW PROFILE 10.2mm Through Hole -55°C~125°C 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.3 (7.62mm) Row Spacing e4 Polychlorinated 2 Open Frame, Decoupling Capacitor 7.62 mm 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 20 (2 x 10) Beryllium Copper Brass Alloy 0.370 9.40mm 0.100 2.54mm
522-93-100-10-000003 522-93-100-10-000003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active Non-RoHS Compliant
514-87-145-15-081117 514-87-145-15-081117 Preci-Dip 0.0000
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Min: 1

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0.00000000 download 10 Weeks Surface Mount Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 514 Active 1 (Unlimited) Solder EAR99 Gold 145 ROHS3 Compliant UL94 V-0 1A 145 STANDARD: UL 94V-0 Surface Mount -55°C~125°C 8536.69.40.40 10mOhm PGA 1.397mm e3 Open Frame UL94 V-0 0.100 2.54mm Tin Flash 145 (15 x 15) Beryllium Copper Brass 0.055 1.40mm 0.100 2.54mm
551-10-068-10-041004 551-10-068-10-041004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 68 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA68
511-13-149-15-061002 511-13-149-15-061002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 149 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA149
35-0501-21 35-0501-21 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 35 125°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 1A SIP 2.54mm Through Hole -55°C~125°C SIP 10.668mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm 35 (1 x 35) Phosphor Bronze Phosphor Bronze 0.420 10.67mm 0.100 2.54mm
28-3553-16 28-3553-16 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 28 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 28 (2 x 14) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
36-6552-18 36-6552-18 Aries Electronics 0.0000
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0.00000000 6 Weeks Polyetheretherketone (PEEK), Glass Filled Bulk 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 36 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole -55°C~250°C 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.54mm 2.39 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 36 (2 x 18) Beryllium Nickel Beryllium Nickel 0.110 2.78mm 0.100 2.54mm
42-3551-16 42-3551-16 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 6 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 42 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 42 (2 x 21) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
110-13-210-61-001000 110-13-210-61-001000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks Active ROHS3 Compliant
24-3553-16 24-3553-16 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 4 Weeks Polyphenylene Sulfide (PPS), Glass Filled Bulk 2013 55 yes Active 1 (Unlimited) Solder EAR99 Nickel Boron 24 ROHS3 Compliant STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing Closed Frame 1A UL94 V-0 0.100 2.54mm Nickel Boron 50.0μin 1.27μm 50.0μin 1.27μm 24 (2 x 12) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
D95018-42 D95018-42 Harwin Inc. 0.0000
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0.00000000 download 20 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Glass Filled Bulk 2010 D95 yes Active 1 (Unlimited) Solder EAR99 Gold 18 ROHS3 Compliant UL94 V-0 1A 18 ROHS COMPLIANT Through Hole -55°C~125°C 8536.69.40.40 10mOhm 10000000000Ohm DIP, 0.3 (7.62mm) Row Spacing 3.2004mm e3 0.898 inch 0.394 inch 0.315 inch RND PIN-SKT 0.1 inch 1000VAC V Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 196.9μin 5.00μm 18 (2 x 9) Beryllium Copper Brass 0.126 3.20mm 0.100 2.54mm
17-0511-10 17-0511-10 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 511 Active 1 (Unlimited) Solder 17 105°C -55°C Tin ROHS3 Compliant UL94 V-0 Tin 1A SIP 2.54mm Through Hole -55°C~105°C SIP 3.81mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Tin 50.0μin 1.27μm 50.0μin 1.27μm 17 (1 x 17) Phosphor Bronze Phosphor Bronze 0.150 3.81mm 0.100 2.54mm
48-6570-11 48-6570-11 Aries Electronics 0.0000
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Min: 1

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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 48 EAR99 Gold 48 ROHS3 Compliant UL94 V-0 1A STANDARD: UL 94V-0 Through Hole 1000000000Ohm DIP, ZIF (ZIP), 0.6 (15.24mm) Row Spacing 2.794mm e4 2.54mm 150°C 2.99 inch 0.9 inch RECTANGULAR 0.47 inch SQ PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 48 (2 x 24) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
20-3513-00 20-3513-00 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 Lo-PRO®file, 513 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Lead Free Gold 3A 20 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.175mm Closed Frame 3A UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 20 (2 x 10) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
5-6437504-3 5-6437504-3 TE Connectivity / AMP 0.0000
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0.00000000 DIALLYL PHTHALATE EAR99 GOLD (30) OVER NICKEL 3 RoHS Compliant 8536.69.40.40 e4 Gold (Au) - with Nickel (Ni) barrier TRANSISTOR SOCKET TO-3
210-33-964-41-101000 210-33-964-41-101000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 PLASTIC yes Active EAR99 GOLD (30) OVER NICKEL (100) 64 Non-RoHS Compliant NOT SPECIFIED DIP SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET DIP64
48-3575-11 48-3575-11 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 48 EAR99 Tin 48 ROHS3 Compliant UL94 V-0 Gold, Tin 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm e4 Closed Frame UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 48 (2 x 24) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
23-0501-31 23-0501-31 Aries Electronics 0.0000
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Mult: 1

0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 23 125°C -55°C Gold ROHS3 Compliant UL94 V-0 Gold 1A SIP 2.54mm Through Hole -55°C~125°C SIP 17.526mm 1 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm 23 (1 x 23) Phosphor Bronze Phosphor Bronze 0.690 17.52mm 0.100 2.54mm
XR2A-4011-N XR2A-4011-N Omron Electronics Inc-EMC Div 0.0000
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Min: 1

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0.00000000 download 9 Weeks Through Hole Polybutylene Terephthalate (PBT), Glass Filled Bulk 2002 XR2 Active 1 (Unlimited) Solder EAR99 Gold Straight 40 48.26mm RoHS Compliant 1A No DIP 15.24mm Through Hole -55°C~125°C 300V 20mOhm 1GOhm 1A DIP, 0.6 (15.24mm) Row Spacing e4 2 Open Frame UL94 V-0 15.24 mm 300V 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 40 (2 x 20) Beryllium Copper Beryllium Copper 0.126 3.20mm 0.100 2.54mm
551-10-196-14-000003 551-10-196-14-000003 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 196 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA196
110-13-632-61-001000 110-13-632-61-001000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 3 Weeks Active ROHS3 Compliant
117-41-428-41-005000 117-41-428-41-005000 Mill-Max Manufacturing Corp. 0.0000
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Min: 1

Mult: 1

0.00000000 3 Weeks POLYETHYLENE yes Active EAR99 GOLD (10) OVER NICKEL (100) 28 ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e3 Matte Tin (Sn) - with Nickel (Ni) barrier IC SOCKET DIP28
06-3518-11 06-3518-11 Aries Electronics 0.0000
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Min: 1

Mult: 1

0.00000000 download 4 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder 6 EAR99 Gold 6 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole DIP, 0.3 (7.62mm) Row Spacing 3.175mm e4 0.4 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch Open Frame 0.3 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 6 (2 x 3) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
115-87-648-41-003101 115-87-648-41-003101 Preci-Dip 0.0000
RFQ

Min: 1

Mult: 1

0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 115 yes Active 1 (Unlimited) Solder EAR99 Gold 48 ROHS3 Compliant UL94 V-0 1A 48 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.6 (15.24mm) Row Spacing 2.413mm e3 Open Frame UL94 V-0 0.100 2.54mm Tin Flash 48 (2 x 24) Beryllium Copper Brass 0.095 2.41mm 0.100 2.54mm
APA-422-T-J APA-422-T-J Samtec Inc. 0.0000
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0.00000000 3 Weeks Through Hole POLYESTER Bulk yes Active Not Applicable EAR99 Male TIN OVER NICKEL (50) Straight 22 ROHS3 Compliant BRASS No STANDARD: UL 94V-0 8536.69.40.40 e3 2 Tin (Sn) - with Nickel (Ni) barrier 2.54mm IC SOCKET
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