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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Published Series Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Depth Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case Height Width Mounting Type Weight Operating Temperature Insulation Resistance Lead Length JESD-609 Code Number of Rows Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material
24-354000-20 24-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
44-652000-10 44-652000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 652000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Lead Free Tin 1A 44 UL 94V-0 Through Hole 3.175mm e0 2 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
264-4493-19-0602J 264-4493-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole, Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 64 150°C -55°C Gold 43.2mm 64 100.3mm RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 64 6.9mm Through Hole -55°C~125°C 1GOhm 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.9 (22.86mm) Row Spacing DIP, 0.9 (22.86mm) Row Spacing
20-301550-10 20-301550-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 762μm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.030 0.76mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
20-354000-10 20-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 20 Non-RoHS Compliant UL94 V-0 Tin 3A 20 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
20-651000-10 20-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 20 Non-RoHS Compliant 1A 20 SOCKET ADAPTER Through Hole 3.683mm e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
24-354000-10 24-354000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 24 ROHS3 Compliant UL94 V-0 Gold, Tin 3A 24 STANDARD: UL 94V-0 Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
214-3339-09-0602J 214-3339-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 14 150°C -55°C Female Gold 14 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 14 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing
32-354000-10 32-354000-10 Aries Electronics 0.0000
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0.00000000 download Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder 32 Gold ROHS3 Compliant UL94 V-0 Gold 3A 32 Surface Mount 3A UL94 V-0 Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.100 2.54mm DIP, 0.3 (7.62mm) Row Spacing SOIC
242-1281-39-0602J 242-1281-39-0602J Artery 0.0000
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0.00000000 download Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Obsolete 1 (Unlimited) Wire Wrap 42 150°C -55°C Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
10-666000-00 10-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 10 Non-RoHS Compliant 10 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
64-304121-00 64-304121-00 Aries Electronics 0.0000
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0.00000000 download 2006 Obsolete Not Applicable Solder EAR99 64 Non-RoHS Compliant Lead Free 64 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.031 0.80mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.031 0.80mm TQFP QFP FR4 Epoxy Glass
95-132I25-P 95-132I25-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 95-132I25 Active 1 (Unlimited) Solder EAR99 Tin 132 Non-RoHS Compliant 132 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Copper Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
16-354000-20 16-354000-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 16 ROHS3 Compliant UL94 V-0 Lead Free Tin 3A 16 STANDARD: UL 94V-0 1.58mm Surface Mount e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
22-304504-18 22-304504-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 304504 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant Lead Free 22 SOCKET ADAPTER Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.4 (10.16mm) Row Spacing FR4 Epoxy Glass
28-651000-10 28-651000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 651000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 28 35.6mm Non-RoHS Compliant Contains Lead 28 SOCKET ADAPTER 1.58mm Through Hole e3 1A IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.145 3.68mm 0.100 2.54mm SSOP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
16-35W000-11-RC-P (220 UP) 16-35W000-11-RC-P (220 UP) Aries Electronics 0.0000
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0.00000000 download Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder ROHS3 Compliant 16 Through Hole 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
16-304235-10 16-304235-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 304235 Active 1 (Unlimited) Solder EAR99 Gold 16 Non-RoHS Compliant 16 STANDARD: UL 94V-0 Through Hole 105°C e0 Socket Included 1A UL94 V-0 IC SOCKET Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
28-555000-00 28-555000-00 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Surface Mount 2006 Correct-A-Chip® 555000 Active 1 (Unlimited) Solder EAR99 28 Non-RoHS Compliant 28 SOCKET ADAPTER Surface Mount e3 IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.050 1.27mm SSOP SOWIC FR4 Epoxy Glass
68-304538-10 68-304538-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 304538 Active 1 (Unlimited) Solder EAR99 68 Non-RoHS Compliant Lead Free 68 SOCKET ADAPTER Through Hole 3.175mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC PGA FR4 Epoxy Glass
44-653000-10 44-653000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2007 Correct-A-Chip® 653000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 44 Non-RoHS Compliant Contains Lead Tin 1A 44 UL 94V-0 1.58mm Through Hole e0 2 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
232-1285-19-0602J 232-1285-19-0602J Artery 0.0000
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0.00000000 download 8 Weeks Wire Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Wire Wrap 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole 453.59237g -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.620 15.75mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
48-6645-18 48-6645-18 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 6645 Active 1 (Unlimited) Solder EAR99 48 Non-RoHS Compliant 48 ADAPTER Through Hole e3 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm TQFP DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
97-80C251 97-80C251 Aries Electronics 0.0000
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0.00000000 Active 1 (Unlimited) EAR99 84 ROHS3 Compliant PLCC IC SOCKET
22-665000-00 22-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder EAR99 22 Non-RoHS Compliant 22 Surface Mount e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
84-505-111 84-505-111 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2013 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 GOLD (10) 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole 3.81mm e4 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
12-665000-00 12-665000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 665000 Active 1 (Unlimited) Solder 12 Non-RoHS Compliant 12 SOIC Surface Mount 787.4μm 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.031 0.80mm 0.050 1.27mm SOIC-W SOIC FR4 Epoxy Glass
18-35W000-10 18-35W000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2003 Correct-A-Chip® 35W000 Active 1 (Unlimited) Solder EAR99 NOT SPECIFIED 18 22.9mm Non-RoHS Compliant Lead Free 18 1.58mm Through Hole IC SOCKET 0.050 1.27mm Tin-Lead Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
12-666000-00 12-666000-00 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount 2006 Correct-A-Chip® 666000 Active 1 (Unlimited) Solder EAR99 12 Non-RoHS Compliant 12 UL 94V-0 Surface Mount 2.032mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.080 2.03mm 0.050 1.27mm SOIC SOWIC FR4 Epoxy Glass
24-351000-10 24-351000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 351000 Active 1 (Unlimited) Solder EAR99 105°C -55°C 24 Non-RoHS Compliant Lead Free Tin 1A 24 SOCKET ADAPTER 1.58mm Through Hole e0 2 7.62 mm IC SOCKET 0.026 0.65mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm SSOP DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
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