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IC Adapters

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Material Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Number of Contacts Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Number of Pins Additional Feature Package / Case REACH SVHC Lead Pitch Height Mounting Type Operating Temperature Insulation Resistance Lead Length JESD-609 Code Body Material Number of Rows Feature Pitch Current Rating (Amps) Material Flammability Rating Row Spacing Device Socket Type Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Convert From (Adapter End) Convert To (Adapter End) Board Material Core Architecture
44-647-10 44-647-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Bulk 2002 647 Active 1 (Unlimited) Solder EAR99 Gold 44 69.9mm Non-RoHS Compliant Contains Lead 44 UL 94V-0 2.39mm Through Hole e4 3A IC SOCKET Tin 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Phosphor Bronze 0.180 4.57mm SOIC DIP, 0.6 (15.24mm) Row Spacing
228-1277-29-0602J 228-1277-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 28 150°C -55°C Gold 28 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 28 Through Hole -55°C~125°C 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
16-354000-11-RC 16-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Glass, Polyester, Thermoplastic Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 16 ROHS3 Compliant UL94 V-0 Lead Free Copper 3A 16 STANDARD: UL 94V-0 No SVHC 2.54mm Surface Mount 762μm e4 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-653000-11-RC 28-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Box 2006 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant UL94 V-0 Lead Free 1A 28 UL 94V-0 No SVHC Through Hole 3.175mm e4 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
800-37-6-1 800-37-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
18-354000-11-RC 18-354000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 Surface Mount 762μm 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.030 0.76mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
84-505-110 84-505-110 Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2006 Correct-A-Chip® 505 Active 1 (Unlimited) Solder EAR99 84 Non-RoHS Compliant 84 SOCKET ADAPTER Through Hole e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.150 3.81mm 0.050 1.27mm PLCC PGA FR4 Epoxy Glass
28-650000-11-RC-P 28-650000-11-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Gold 28 Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
800-27-6-1 800-27-6-1 TE Connectivity Deutsch Connectors 0.0000
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0.00000000 16 Weeks Active 1 (Unlimited)
MIKROE-230 MIKROE-230 MikroElektronika 0.0000
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0.00000000 4 Weeks Socket Active 1 (Unlimited) Non-RoHS Compliant 40 AT90PWM1 DIP AVR
PA-SOD6SM18-44 PA-SOD6SM18-44 Logical Systems Inc. 0.0000
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0.00000000 7 Weeks Active Not Applicable Solder RoHS Compliant 44 Through Hole 0.050 1.27mm 0.125 3.18mm 0.100 2.54mm SOIC DIP
LCQT-QFP0.5-60 LCQT-QFP0.5-60 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 60 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
1109522 1109522 Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 1109522 Active 1 (Unlimited) Solder EAR99 105°C -55°C Gold 8 Non-RoHS Compliant UL94 V-0 3A 8 STANDARD: UL 94V-0 TO-8 2.54mm Through Hole 3.175mm e0 2 UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.125 3.18mm DIP, 0.3 (7.62mm) Row Spacing JEDEC FR4 Epoxy Glass
32-653000-11-RC 32-653000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 653000 yes Active 1 (Unlimited) Solder EAR99 32 ROHS3 Compliant UL94 V-0 Lead Free 1A 32 UL 94V-0 No SVHC Through Hole 3.175mm e4 Socket Included UL94 V-0 15.24 mm IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm PLCC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
232-1285-29-0602J 232-1285-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 32 150°C -55°C Female Gold 32 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 32 Through Hole -55°C~125°C 1GOhm Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
242-1281-29-0602J 242-1281-29-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2011 Textool™ Active 1 (Unlimited) Solder 42 150°C -55°C Female Gold 42 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 42 Through Hole -55°C~125°C Closed Frame 2.54mm 1A UL94 V-0 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 0.6 (15.24mm) Row Spacing DIP, 0.6 (15.24mm) Row Spacing
24-650000-11-RC-P 24-650000-11-RC-P Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2009 Correct-A-Chip® 650000 Active 1 (Unlimited) Solder Gold ROHS3 Compliant Gold 24 Through Hole 3.175mm 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC DIP, 0.6 (15.24mm) Row Spacing FR4 Epoxy Glass
LCQT-QFP0.5-80 LCQT-QFP0.5-80 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 80 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
LCQT-QFP0.5-40-1 LCQT-QFP0.5-40-1 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyester Correct-A-Chip® Active 1 (Unlimited) Solder 125°C -55°C Non-RoHS Compliant UL94 V-0 Lead Free 40 QFP No SVHC Through Hole -55°C~125°C 5.9944mm UL94 V-0 0.020 0.50mm Gold Flash Brass 0.236 6.00mm 0.100 2.54mm Multiple Packages QFP FR4 Epoxy Glass
97-56001 97-56001 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2010 Correct-A-Chip® 97-56001 Active 1 (Unlimited) Solder 144 Gold 132 Non-RoHS Compliant Contains Lead 169 SOCKET ADAPTER Through Hole 3.175mm e3 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm 0.100 2.54mm QFP PGA FR4 Epoxy Glass
240-3639-09-0602J 240-3639-09-0602J Artery 0.0000
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0.00000000 download 8 Weeks Through Hole Polysulfone (PSU), Glass Filled 2001 Textool™ Active 1 (Unlimited) Solder 40 150°C -55°C Female Gold Straight 40 RoHS Compliant UL94 V-0 Lead Free Copper Gold 1A 40 Through Hole -55°C~125°C Glass, Polysulfone Closed Frame 2.54mm 1A UL94 V-0 25.4 mm 0.100 2.54mm Gold 30.0μin 0.76μm 30.0μin 0.76μm Beryllium Copper Beryllium Copper 0.130 3.30mm 0.100 2.54mm DIP, 1.0 (25.40mm) Row Spacing DIP, 1.0 (25.40mm) Row Spacing
20-301550-20 20-301550-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2006 Correct-A-Chip® 301550 Active 1 (Unlimited) Solder EAR99 32 Non-RoHS Compliant 20 SOCKET ADAPTER Through Hole 2.286mm e0 IC SOCKET 0.050 1.27mm Tin-Lead 200.0μin 5.08μm Brass 0.090 2.29mm 0.100 2.54mm SOIC PLCC FR4 Epoxy Glass
14-354W00-20 14-354W00-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354W00 Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant 14 STANDARD: UL 94V-0 Through Hole 105°C e0 3A UL94 V-0 IC SOCKET 0.100 2.54mm Tin-Lead 10.0μin 0.25μm 200.0μin 5.08μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOWIC
20-354000-21-RC 20-354000-21-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2009 Correct-A-Chip® 354000 yes Active 1 (Unlimited) Solder EAR99 Gold 20 ROHS3 Compliant UL94 V-0 3A 20 STANDARD: UL 94V-0 Surface Mount 2.286mm e4 UL94 V-0 IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.089 2.28mm 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
16-35W000-11-RC 16-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2008 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 16 ROHS3 Compliant Lead Free 16 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET 0.050 1.27mm Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.100 2.54mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
DS9075-40V/NO-BRAND DS9075-40V/NO-BRAND Maxim Integrated 0.0000
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0.00000000 download Bulk 2001 DS9075 Obsolete 1 (Unlimited) Non-RoHS Compliant Contains Lead 40 SIP DIP
18-354000-10 18-354000-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled 2006 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder 18 Gold ROHS3 Compliant UL94 V-0 Gold 3A 18 SOIC Surface Mount 3A UL94 V-0 0.100 2.54mm Gold 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
28-354000-10 28-354000-10 Aries Electronics 0.0000
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0.00000000 5 Weeks Polyamide (PA46), Nylon 4/6, Glass Filled 2012 Correct-A-Chip® 354000 Active 1 (Unlimited) Solder EAR99 Gold 28 Non-RoHS Compliant UL94 V-0 Tin 3A 28 STANDARD: UL 94V-0 Surface Mount 105°C e3 2 UL94 V-0 7.62 mm IC SOCKET 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm Beryllium Copper Brass 0.050 1.27mm DIP, 0.3 (7.62mm) Row Spacing SOIC
97-AQ132D 97-AQ132D Aries Electronics 0.0000
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0.00000000 download 5 Weeks 2009 Correct-A-Chip® 97-AQ132D Active 1 (Unlimited) Solder EAR99 Gold 132 34.3mm Non-RoHS Compliant Lead Free Tin 132 SOCKET ADAPTER 1.27mm 1.58mm Through Hole e0 1 IC SOCKET 0.025 0.64mm Tin-Lead 200.0μin 5.08μm Brass 0.125 3.18mm PQFP PGA FR4 Epoxy Glass
28-35W000-11-RC 28-35W000-11-RC Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole 2012 Correct-A-Chip® 35W000 yes Active 1 (Unlimited) Solder EAR99 28 ROHS3 Compliant Lead Free 28 SOCKET ADAPTER SOIC Through Hole 3.175mm e4 IC SOCKET Gold 10.0μin 0.25μm Brass 0.125 3.18mm 0.050 1.27mm SOIC-W DIP, 0.3 (7.62mm) Row Spacing FR4 Epoxy Glass
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