Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Output Characteristics | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
 |
24LC21-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Tube | 2004 | yes | Active | 1 (Unlimited) | 8 | 9.46mm | ROHS3 Compliant | Lead Free | No | 8 | 2-WIRE SERIAL INTERFACE; DATA RETENTION > 200 YEARS; 1000000 ERASE/WRITE CYCLES GUARANTEED | 8-DIP (0.300, 7.62mm) | I2C, Serial | 1 kb | 7.62mm | Through Hole | -40°C~85°C TA | CMOS | 4.32mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 3V | 24LC21 | 8 | 2.54mm | 2.5V | 3/5V | 5.5V | 900ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 400kHz | 0.00003A | 200 | 1000000 Write/Erase Cycles | 10ms | I2C | 1010XXXR | EEPROM | I2C | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1041GE30-10VXIT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Active | 3 (168 Hours) | 44 | 3A991.B.2.A | 28.575mm | ROHS3 Compliant | 44-BSOJ (0.400, 10.16mm Width) | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 3.7592mm | 8542.32.00.41 | 1 | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-J44 | 2.2V | 3.6V | 4Mb 256K x 16 | Volatile | 2.2V~3.6V | 256KX16 | 16 | 4194304 bit | 10 ns | SRAM | Parallel | 10ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
N01S830HAT22IT | ON Semiconductor | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | ACTIVE (Last Updated: 2 weeks ago) | Tape & Reel (TR) | 2012 | yes | Active | 3 (168 Hours) | 8 | 1 | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 1 Mb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | e3 | Tin (Sn) | DUAL | YES | 0.65mm | 2.5V | 5.5V | 1Mb 128K x 8 | Volatile | 2.5V~5.5V | 8 | 20MHz | SRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V639S12BFGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 208 | 85°C | -40°C | 3.3V | 2 | 15mm | RoHS Compliant | Lead Free | No | 208 | Parallel | 3.45V | 3.15V | 2.3 Mb | 15mm | 1.4mm | CMOS | 1.7mm | 1 | 515mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 208 | INDUSTRIAL | 0.8mm | SRAMs | 3-STATE | 12 ns | 256kB | RAM, SDR, SRAM | 34b | Asynchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
S25FS128SAGMFB103 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 16 Weeks | Tape & Reel (TR) | Automotive, AEC-Q100, FS-S | Active | 3 (168 Hours) | 8 | 5.283mm | ROHS3 Compliant | ALSO CONFIGURABLE AS 128MX1 | 8-SOIC (0.209, 5.30mm Width) | 5.283mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 2.159mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | S-PDSO-G8 | 1.7V | 2V | 128Mb 16M x 8 | Non-Volatile | 1.7V~2V | 32MX4 | 4 | 134217728 bit | SERIAL | 133MHz | 2 | 1.8V | FLASH | SPI - Quad I/O, QPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7015S15PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2010 | no | Active | 3 (168 Hours) | 80 | EAR99 | 70°C | 0°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 80 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | TQFP | Parallel | 5.5V | 4.5V | 72 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 310mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 80 | COMMERCIAL | 0.65mm | SRAMs | 5V | 3-STATE | 15 ns | 9kB | RAM, SDR, SRAM | 26b | 8KX9 | Asynchronous | 0.015A | 9b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||
 |
71421LA20J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | CMOS | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28EW128ABA1LJS-0SIT | Micron Technology Inc. | 7.4886 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tray | Active | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | 56-TFSOP (0.724, 18.40mm Width) | 14mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e3 | MATTE TIN | DUAL | 260 | 3V | 30 | YES | 0.5mm | R-PDSO-G56 | 2.7V | 3.6V | 95ns | 128Mb 16M x 8 8M x 16 | Non-Volatile | 2.7V~3.6V | 8MX16 | 16 | 134217728 bit | 8 | 3V | FLASH | Parallel | 60ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V416YS15YI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | no | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 28.575mm | Non-RoHS Compliant | 44 | Parallel | not_compliant | 10.16mm | CMOS | 3.683mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | J BEND | 225 | 3.3V | 30 | 44 | INDUSTRIAL | YES | 1.27mm | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.17mA | 256KX16 | 16 | 4194304 bit | 0.02A | 15 ns | COMMON | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7519S166BCI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2009 | no | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Contains Lead | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | BGA | Parallel | 3.45V | 3.15V | 9 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 830mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 18b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "S72VS256RE0AHBJ13") |
S72VS256RE0AHBJ13 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 26 Weeks | Tape & Reel (TR) | VS-R | Active | 3 (168 Hours) | 133 | 3A991.B.1.A | 8mm | ROHS3 Compliant | 256 MBIT (16M X 16 TOP BOOT BLOCK) FLASH MEMORY | 133-VFBGA | 8mm | Surface Mount | -25°C~85°C TA | FLASH, DRAM | SYNCHRONOUS | 1mm | 8542.32.00.71 | 1 | BOTTOM | 1.8V | YES | 0.5mm | S-PBGA-B133 | 1.7V | 1.95V | 256Mbit Flash 2565Mbit DDR DRAM | Non-Volatile | 1.7V~1.95V | 16MX16 | 16 | 268435456 bit | 108MHz | FLASH, RAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29C1024-90TI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1998 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | -40°C~85°C TC | AT29C1024 | 90ns | 1Mb 64K x 16 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
DS2045Y-100# | Maxim Integrated | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2006 | no | Obsolete | 5 (48 Hours) | 256 | EAR99 | 27mm | ROHS3 Compliant | Lead Free | 256-BGA | not_compliant | 27mm | Surface Mount | -40°C~85°C TA | NVSRAM (Non-Volatile SRAM) | ASYNCHRONOUS | 8.72mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn/Pb) | BOTTOM | NOT SPECIFIED | 5V | NOT SPECIFIED | DS2045 | 256 | YES | 1.27mm | S-PBGA-B256 | 4.5V | SRAMs | Not Qualified | 5V | 5.5V | 1Mb 128K x 8 | Non-Volatile | 0.085mA | 4.5V~5.5V | 128KX8 | 8 | 1048576 bit | 0.005A | 100 ns | NVSRAM | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GT28F320B3TA110 | Intel | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2002 | Obsolete | 3 (168 Hours) | 48 | 3A991.B.1.A | 13mm | Non-RoHS Compliant | 47 | TOP BOOT BLOCK | 48-VFBGA | 110GHz | 10mm | Surface Mount | -40°C~85°C TA | FLASH - Boot Block | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | BOTTOM | 240 | 3V | 30 | 48 | YES | 1mm | R-PBGA-B48 | 2.7V | Not Qualified | 1.8/3.63/3.3V | 3.3V | 32Mb 2M x 16 | Non-Volatile | 0.055mA | 2.7V~3.6V | 2MX16 | 16 | 33554432 bit | 0.000005A | 110 ns | 3V | NO | NO | YES | 863 | FLASH | Parallel | 110ns | 4K32K | TOP | |||||||||||||||||||||||||||||||||||||||||||||||||
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7142SA35C | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Through Hole | Bulk | 2007 | Active | 70°C | 0°C | 5V | 2 | 61.72mm | RoHS Compliant | Contains Lead | No | 48 | DIP | Parallel | 5.5V | 4.5V | 16 kb | 15.24mm | 3.3mm | 165mA | 35 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V424S10PHI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 3 (168 Hours) | 44 | 3A991.B.2.A | 85°C | -40°C | 18.41mm | Non-RoHS Compliant | TSOP | Parallel | not_compliant | 10.16mm | CMOS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | DUAL | GULL WING | 225 | 3.3V | 20 | 44 | INDUSTRIAL | YES | 0.8mm | R-PDSO-G44 | 3V | SRAMs | Not Qualified | 3.3V | 3.6V | 3-STATE | RAM, SRAM - Asynchronous | 0.18mA | 512KX8 | 8 | 4194304 bit | 0.02A | 10 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V7319S166BCGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2002 | yes | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4 Mb | 166MHz | 17mm | 1.4mm | CMOS | 1.5mm | 1 | 830mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 12 ns | RAM, SRAM | 36b | Synchronous | 0.00004A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA025E64T-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | 2013 | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | 8 | 100KHZ AVAILABLE @1.7V | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.75mm | 1 | e3 | Matte Tin (Sn) - annealed | DUAL | 260 | 5V | 40 | 24AA025E64 | YES | 1.27mm | 2.5V | Not Qualified | 5.5V | 900ns | TS 16949 | 2Kb 256 x 8 | Non-Volatile | 0.003mA | 1.7V~5.5V | 8 | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | 5ms | I2C | 1010DDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
USBF1600T-I/MFVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | 16Mb 2M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 1.5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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USBF1600-I/MFVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | 16Mb 2M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 1.5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT53B384M32D2NP-062 WT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Not For New Designs | 200-WFBGA | Surface Mount | -30°C~85°C TC | SDRAM - Mobile LPDDR4 | 12Gb 384M x 32 | Volatile | 1.1V | 1600MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3556S100BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 165 | 70°C | 0°C | Non-RoHS Compliant | 165 | Parallel | not_compliant | 100MHz | CMOS | SYNCHRONOUS | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 3.3V | COMMERCIAL | YES | 1mm | SRAMs | Not Qualified | 3.3V | 3-STATE | RAM, SRAM | 0.25mA | 128KX36 | 36 | 4718592 bit | 0.04A | 5 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S166BGG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 18 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 119 | COMMERCIAL | YES | 2.375V | SRAMs | 2.625V | 3-STATE | RAM, SRAM | 20b | 0.245mA | 0.04A | 3.5 ns | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75902S75BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 2.5V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | FLOW-THROUGH ARCHITECTURE | BGA | Parallel | 2.625V | 2.375V | 18 Mb | 100MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 275mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 2.5V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 7.5 ns | 100MHz | 2.3MB | RAM, SDR, SRAM | 20b | Synchronous | 0.04A | 18b | COMMON | 2.38V | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71T75802S133PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2015 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 2.5V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 2.375V | SRAMs | Not Qualified | 2.5V | 2.625V | 3-STATE | RAM, SRAM | 0.195mA | 1MX18 | 18 | 18874368 bit | 0.04A | 4.2 ns | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M29W640GH7ANB6E | Micron Technology Inc. | 3.6474 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2015 | yes | Obsolete | 3 (168 Hours) | 56 | 3A991.B.1.A | 18.4mm | ROHS3 Compliant | No | 56 | BOTTOM BOOT BLOCK | 56-TFSOP (0.724, 18.40mm Width) | 64 Mb | 14mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1.2mm | 8542.32.00.51 | 1 | 10mA | e3 | MATTE TIN | DUAL | 260 | 3V | 30 | M29W640 | 56 | YES | 0.5mm | 3/3.3V | 2.7V | 64Mb 8M x 8 4M x 16 | Non-Volatile | 2.7V~3.6V | 4MX16 | 16 | Asynchronous | 0.0001A | 70 ns | 8 | YES | YES | YES | 128 | 4/8words | YES | YES | FLASH | Parallel | 70ns | 64K | ||||||||||||||||||||||||||||||||||||||||||||||
 |
BR25L160FVT-WE2 | ROHM Semiconductor | 0.2537 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tape & Reel (TR) | 2005 | yes | Not For New Designs | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 16 kb | 3mm | Surface Mount | -40°C~85°C TA | CMOS | 1.25mm | 1 | 3mA | e2 | DUAL | 260 | 2.5V | 10 | BR25L160 | 8 | 0.65mm | 70 ns | 16Kb 2K x 8 | Non-Volatile | 1.8V~5.5V | 8 | 5MHz | 0.000002A | 40 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CG8194AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | Vendor Undefined | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7132LA20J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2004 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | CMOS | 4.57mm | 1 | 200mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 20 ns | 2kB | RAM, SDR, SRAM | 22b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||
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IDT71016S20PHI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Rail/Tube | 2010 | no | 3 (168 Hours) | 44 | 85°C | -40°C | 5V | 1 | Non-RoHS Compliant | 44 | TSOP | Parallel | 5.5V | not_compliant | 4.5V | 1 Mb | CMOS | 1 | 170mA | e0 | DUAL | GULL WING | 225 | 5V | 20 | 44 | INDUSTRIAL | 0.8mm | SRAMs | Not Qualified | 5V | 5V | 3-STATE | 20 ns | RAM, SRAM - Asynchronous | 16b | 16 | Asynchronous | 16b | COMMON |
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