Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Max Power Dissipation | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Common Flash Interface | Serial Bus Type | I2C Control Byte | Refresh Cycles | Access Mode | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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IS25LQ032B-JNLE | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Tube | Active | 3 (168 Hours) | 8 | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | 3.9mm | Surface Mount | -40°C~105°C TA | FLASH - NOR | SYNCHRONOUS | 1.75mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | YES | 1.27mm | 2.3V | 3.6V | 32Mb 4M x 8 | Non-Volatile | 2.3V~3.6V | 32MX1 | 1 | 33554432 bit | 104MHz | 2.7V | FLASH | SPI - Quad I/O | 1ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7025S35J | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 5V | 2 | 29.21mm | RoHS Compliant | Contains Lead | No | 84 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 29.21mm | 3.63mm | 250mA | 35 ns | 16kB | RAM, SDR, SRAM | 26b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT29F512G08EBHAFJ4-3R:A TR") |
MT29F512G08EBHAFJ4-3R:A TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tape & Reel (TR) | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46H32M16LFBF-5 IT:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2009 | yes | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 9mm | ROHS3 Compliant | AUTO/SELF REFRESH | 60-VFBGA | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPDDR | SYNCHRONOUS | 1mm | 8542.32.00.28 | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 1.8V | 30 | MT46H32M16 | 60 | YES | 0.8mm | R-PBGA-B60 | 1.7V | Not Qualified | 1.8V | 1.95V | 3-STATE | 5ns | 512Mb 32M x 16 | Volatile | 0.13mA | 1.7V~1.95V | 32MX16 | 16 | 536870912 bit | 200MHz | 0.00001A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P74604S167BQ | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | PIPELINED ARCHITECTURE | Parallel | not_compliant | 167MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 20 | 165 | COMMERCIAL | YES | 1mm | 1.7V | SRAMs | Not Qualified | 1.5/1.81.8V | 1.9V | 3-STATE | QDR, RAM, SRAM | 0.85mA | 512KX36 | 36 | 18874368 bit | 0.3A | 0.5 ns | SEPARATE | 1.7V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT53E128M32D2DS-053 AIT:A | Micron Technology Inc. | 9.8279 |
Min: 1 Mult: 1 |
0.00000000 | 11 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 200-WFBGA | Surface Mount | -40°C~95°C | SDRAM - Mobile LPDDR4 | 4Gb 128M x 32 | Volatile | 0.6V 1.1V | 1.866GHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3319S133BCGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 256 | 85°C | -40°C | 3.3V | 2 | 17mm | RoHS Compliant | Lead Free | No | 256 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | Parallel | 3.45V | 3.15V | 4.5 Mb | 133MHz | 17mm | 1.4mm | CMOS | 1.7mm | 1 | 480mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 256 | INDUSTRIAL | 1mm | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 36b | Synchronous | 0.04A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA100BQGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 11 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 165 | 85°C | -40°C | 3.3V | 1 | 15mm | RoHS Compliant | Lead Free | No | 165 | Parallel | 3.465V | 3.135V | 4.5 Mb | 100MHz | 13mm | 1.2mm | CMOS | 1 | 255mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 165 | INDUSTRIAL | SRAMs | 3-STATE | 5 ns | 100MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR25H256CDF | Everspin Technologies Inc. | 1.7643 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Surface Mount | Tray | 2013 | Not For New Designs | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | Lead Free | No | 8 | 8-VDFN Exposed Pad | SPI, Serial | 256 kb | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 0.9mm | 1 | 27mA | DUAL | 3V | 1.27mm | 2.7V | 3.6V | 600mW | 10 ns | 256Kb 32K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 8b | RAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
GD25LD40CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 4Mb 512K x 8 | Non-Volatile | 1.65V~2V | 50MHz | FLASH | SPI - Dual I/O | 97μs, 6ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SST39WF800B-70-4I-B3KE-T | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel (TR) | 2010 | SST39 MPF™ | yes | Active | 3 (168 Hours) | 48 | 3A991.B.1.A | ROHS3 Compliant | Lead Free | 48 | 48-TFBGA | 8 Mb | Surface Mount | -40°C~85°C TA | CMOS | 8542.32.00.51 | e3 | Matte Tin (Sn) | BOTTOM | 260 | 1.8V | 40 | SST39WF800B | YES | 0.8mm | Not Qualified | 1.8V | 70ns | 8Mb 512K x 16 | Non-Volatile | 0.02mA | 1.65V~1.95V | 512KX16 | 16 | 16b | 0.00004A | YES | YES | YES | 256 | YES | FLASH | Parallel | 40μs | 2K | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT46V64M8CV-5B IT:J | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2011 | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1 | 12.5mm | Non-RoHS Compliant | AUTO/SELF REFRESH | 60-TFBGA | not_compliant | 8mm | Surface Mount | -40°C~85°C TA | SDRAM - DDR | SYNCHRONOUS | 1.2mm | 8542.32.00.28 | 1 | BOTTOM | 2.6V | MT46V64M8 | 60 | YES | 1mm | R-PBGA-B60 | 2.5V | Not Qualified | 2.6V | 2.7V | 3-STATE | 700ps | 512Mb 64M x 8 | Volatile | 0.23mA | 2.5V~2.7V | 64MX8 | 8 | 536870912 bit | 200MHz | 0.005A | COMMON | 8192 | DRAM | Parallel | 15ns | 248 | 248 | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P79804S250BQG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2008 | 70°C | 0°C | RoHS Compliant | 165 | Parallel | 250MHz | DDR, RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
GD25WD20CTIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3558S200PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | LQFP | Parallel | not_compliant | 200MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.4mA | 256KX18 | 18 | 4718592 bit | 0.04A | 3.2 ns | COMMON | 3.14V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MTFC16GAKAEEF-AAT | Micron Technology Inc. | 24.1356 |
Min: 1 Mult: 1 |
0.00000000 | Tray | e•MMC™ | Active | 3 (168 Hours) | ROHS3 Compliant | 169-TFBGA | Surface Mount | -40°C~105°C TA | FLASH - NAND | 128Gb 16G x 8 | Non-Volatile | 2.7V | FLASH | MMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA02T-I/MNY | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2009 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 3mm | ROHS3 Compliant | Lead Free | No | 8 | 8-WFDFN Exposed Pad | I2C, Serial | 2 kb | 750μm | 2mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e4 | Nickel/Palladium/Gold (Ni/Pd/Au) | DUAL | 260 | 2.5V | 40 | 24AA02 | 8 | 0.5mm | 1.7V | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.7V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010XXXR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||
|
CG8614AAT | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 8 Weeks | Obsolete | Vendor Undefined | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
709269L12PFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 85°C | -40°C | 5V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | FLOW-THROUGH OR PIPELINED ARCHITECTURE | TQFP | Parallel | 5.5V | 4.5V | 256 kb | 33.3MHz | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 340mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 100 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 12 ns | 32kB | RAM, SDR, SRAM | 28b | 16KX16 | Synchronous | 0.005A | 16b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||
 |
70V261S25PF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2001 | Active | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 256 kb | 14mm | 1.4mm | 170mA | 25 ns | 32kB | RAM, SDR, SRAM | 28b | Asynchronous | 16b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC16BT-I/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2002 | yes | Active | 1 (Unlimited) | 8 | 4.9mm | ROHS3 Compliant | Lead Free | No | 8 | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 16 kb | 1.5mm | 3.9mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 24LC16B | 8 | 1.27mm | 2.5V | 2/5V | 5.5V | OPEN-DRAIN | 900ns | 16Kb 2K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MMMR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
W9825G6KH-6 | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tray | 2016 | Active | 3 (168 Hours) | 54 | EAR99 | 1 | 22.22mm | ROHS3 Compliant | AUTO/SELF REFRESH | 54-TSOP (0.400, 10.16mm Width) | 10.16mm | Surface Mount | 0°C~70°C TA | SDRAM | SYNCHRONOUS | 1.2mm | 1 | e3 | Tin (Sn) | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 0.8mm | R-PDSO-G54 | 3V | 3.6V | 5ns | 256Mb 16M x 16 | Volatile | 3V~3.6V | 16MX16 | 16 | 268435456 bit | 166MHz | DRAM | Parallel | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q20CTIG | GigaDevice Semiconductor (HK) Limited | 0.7796 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 50μs, 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MTFC4GMDEA-4M IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | 2017 | e•MMC™ | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 153-WFBGA | Surface Mount | -40°C~85°C TA | FLASH - NAND | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | FLASH | MMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
CG8310AA | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V3389S6BF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Bulk | 2009 | no | Active | 3 (168 Hours) | 208 | 70°C | 0°C | 3.3V | 2 | 15mm | RoHS Compliant | Contains Lead | No | 208 | PIPELINED OUTPUT MODE; SELF-TIMED WRITE CYCLE | Parallel | 3.45V | 3.15V | 1.1 Mb | 83.3MHz | 15mm | 1.4mm | CMOS | 1 | 310mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 208 | COMMERCIAL | 0.8mm | SRAMs | 3-STATE | 6 ns | 128kB | RAM, SDR, SRAM | 32b | 64KX18 | Synchronous | 0.015A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT29F2G08ABAEAWP-E:E TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 48-TFSOP (0.724, 18.40mm Width) | Surface Mount | 0°C~70°C TA | FLASH - NAND | 48-TSOP I | 2Gb 256M x 8 | Non-Volatile | 2.7V~3.6V | FLASH | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
MT53E256M32D2DS-046 AIT:B TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 200-WFBGA | Surface Mount | -40°C~95°C | SDRAM - Mobile LPDDR4 | 8Gb 256M x 32 | Volatile | 0.6V 1.1V | 2.133GHz | DRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AS4C64M8D2-25BINTR | Alliance Memory, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Tape & Reel (TR) | 2014 | yes | Active | 3 (168 Hours) | ROHS3 Compliant | 60-TFBGA | unknown | Surface Mount | -40°C~85°C TA | SDRAM - DDR2 | NOT SPECIFIED | NOT SPECIFIED | 400ps | 512Mb 64M x 8 | Volatile | 1.7V~1.9V | 400MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
W979H2KBQX2I | Winbond Electronics Corporation | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 168 | 85°C | -40°C | 1 | 12mm | RoHS Compliant | 168 | AUTO/SELF REFRESH; IT ALSO REQUIRES 1.8V NOM | Parallel | 400MHz | 12mm | CMOS | SYNCHRONOUS | 0.8mm | 1 | BOTTOM | BALL | 1.2V | INDUSTRIAL | YES | 0.5mm | 1.14V | 1.3V | RAM, SDRAM | 16MX32 | 32 | 536870912 bit | FOUR BANK PAGE BURST |
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7025S35J Integrated Device Technology (IDT)
Surface Mount Memory IC 128 kb kb 29.21mm mm 250mA mA 16b b
Price: 0.0000
RFQ -
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MT46H32M16LFBF-5 IT:B Micron Technology Inc.
1.8V V 60 Pin Memory IC MT46H32M16 9mm mm
Price: 0.0000
RFQ -
IDT71P74604S167BQ Integrated Device Technology (IDT)
1.5/1.81.8V V 165 Pin Memory IC 15mm mm
Price: 0.0000
RFQ -
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70V3319S133BCGI Integrated Device Technology (IDT)
Surface Mount 256 Pin Memory IC 4.5 Mb kb 17mm mm 480mA mA 18b b
Price: 0.0000
RFQ -
71V3556SA100BQGI Integrated Device Technology (IDT)
Surface Mount 165 Pin Memory IC 4.5 Mb kb 15mm mm 255mA mA 36b b
Price: 0.0000
RFQ -
MR25H256CDF Everspin Technologies Inc.
Surface Mount Memory IC 256 kb kb 6mm mm 27mA mA 8b b
Price: 1.7643
RFQ -
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SST39WF800B-70-4I-B3KE-T Microchip Technology
1.8V V SST39 MPF™ Memory IC SST39 MPF™ Series SST39WF800B 8 Mb kb
Price: 0.0000
RFQ -
MT46V64M8CV-5B IT:J Micron Technology Inc.
2.6V V 60 Pin Memory IC MT46V64M8 12.5mm mm
Price: 0.0000
RFQ -
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IDT71V3558S200PF Integrated Device Technology (IDT)
3.3V V 100 Pin Memory IC 20mm mm
Price: 0.0000
RFQ -
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24AA02T-I/MNY Microchip Technology
Surface Mount 8 Pin Memory IC 24AA02 2 kb kb 3mm mm 3mA mA
Price: 0.0000
RFQ -
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709269L12PFI Integrated Device Technology (IDT)
5V V Surface Mount 100 Pin Memory IC 256 kb kb 14mm mm 340mA mA 16b b
Price: 0.0000
RFQ -
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