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Transistor Sockets

Compare Image Name Manufacturer Pricing(USD) Quantity Weight(Kg) Size(LxWxH) Datasheet Factory Lead Time Mount Housing Material Packaging Published Series Pbfree Code Part Status Moisture Sensitivity Level (MSL) Connector Type Termination Number of Positions ECCN Code Max Operating Temperature Min Operating Temperature Gender Contact Finish - Mating Orientation Depth Number of Contacts ELV Length RoHS Status Flammability Rating Lead Free Contact Material Contact Plating Current Rating Radiation Hardening Number of Pins Additional Feature REACH SVHC Lead Pitch Housing Color Mounting Type Operating Temperature Voltage - Rated DC Voltage - Rated AC HTS Code Contact Resistance Insulation Resistance Max Current Rating Type Lead Length JESD-609 Code Terminal Pitch Operating Temperature (Max) Operating Temperature (Min) Body Length or Diameter Body Breadth Insulation Material Mounting Style Number of Rows PCB Contact Pattern Body Depth Contact Style Mating Contact Pitch Dielectric Withstanding Voltage Contact Finish Termination Feature Pitch Current Rating (Amps) Termination Type PCB Contact Row Spacing Material Flammability Rating Row Spacing Device Socket Type Device Type Used On Max Voltage Rating (AC) Pitch - Mating Contact Finish - Post Contact Finish Thickness - Mating Contact Finish Thickness - Post Number of Positions or Pins (Grid) Contact Material - Mating Contact Material - Post Termination Post Length Pitch - Post Contact Configuration
ICF-308-S-O ICF-308-S-O Samtec Inc. 3.3033
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0.00000000 download 3 Weeks Surface Mount Liquid Crystal Polymer (LCP) Tube 2009 iCF yes Active 1 (Unlimited) DIP, Socket Solder EAR99 Female Tin Straight 9.53mm 8 10.16mm ROHS3 Compliant Copper Gold 1A No TIGER EYE CONTACT No SVHC Surface Mount -55°C~125°C 10mOhm 5000000000Ohm DIP, 0.3 (7.62mm) Row Spacing e3 0.375 inch Polymer 2 RECTANGULAR RND PIN-SKT 0.1 inch 600VAC V Open Frame 7.62 mm 0.100 2.54mm 8 (2 x 4) Beryllium Copper Beryllium Copper 0.100 2.54mm
110-47-320-41-105000 110-47-320-41-105000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
116-83-312-41-018101 116-83-312-41-018101 Preci-Dip 0.0000
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0.00000000 download 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 116 yes Active 1 (Unlimited) Solder EAR99 Gold 12 ROHS3 Compliant UL94 V-0 1A 12 94V-0 Through Hole -55°C~125°C 8536.69.40.40 10mOhm DIP, 0.3 (7.62mm) Row Spacing 3.175mm e3 Elevated, Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 12 (2 x 6) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
117-43-642-61-105000 117-43-642-61-105000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Active ROHS3 Compliant
XR2A-2401-N XR2A-2401-N Omron Electronics Inc-EMC Div 0.0000
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0.00000000 download 10 Weeks Through Hole Polybutylene Terephthalate (PBT), Glass Filled Bulk 2002 XR2 Active 1 (Unlimited) Solder EAR99 Gold Straight 24 RoHS Compliant No Through Hole -55°C~125°C 8536.69.40.40 20mOhm 1A DIP, 0.6 (15.24mm) Row Spacing e4 2 Open Frame UL94 V-0 300V 0.100 2.54mm 30.0μin 0.76μm 30.0μin 0.76μm 24 (2 x 12) Beryllium Copper Beryllium Copper 0.126 3.20mm 0.100 2.54mm
111-41-964-41-001000 111-41-964-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYETHYLENE yes Active EAR99 GOLD (10) OVER NICKEL (100) 64 ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e3 Matte Tin (Sn) - with Nickel (Ni) barrier IC SOCKET DIP64
110-83-424-41-005101 110-83-424-41-005101 Preci-Dip 0.0000
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0.00000000 10 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester, Glass Filled Bulk 2012 110 Active 1 (Unlimited) Solder Gold ROHS3 Compliant UL94 V-0 1A 24 Through Hole -55°C~125°C 10mOhm DIP, 0.4 (10.16mm) Row Spacing Open Frame UL94 V-0 0.100 2.54mm Tin 29.5μin 0.75μm 24 (2 x 12) Beryllium Copper Brass 0.100 2.54mm
510-13-064-08-000003 510-13-064-08-000003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 64 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) IC SOCKET PGA64
346-93-116-41-013000 346-93-116-41-013000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2011 346 no Active 1 (Unlimited) Press-Fit EAR99 Gold 16 Non-RoHS Compliant 16 Through Hole -55°C~125°C 8536.90.40.00 SIP e0 3A 0.100 2.54mm Tin-Lead 30.0μin 0.76μm 200.0μin 5.08μm 16 (1 x 16) Beryllium Copper Brass Alloy 0.175 4.45mm 0.100 2.54mm
10-822-90C 10-822-90C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Horizontal, Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Vertisockets™ 800 Active 1 (Unlimited) Solder 10 EAR99 Gold 10 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole, Right Angle, Horizontal -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e4 2.54mm 0.5 inch 0.4 inch RECTANGULAR 0.428 inch RND PIN-SKT 0.1 inch Closed Frame 0.2 mm UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 10 (2 x 5) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
14-C280-20 14-C280-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Surface Mount Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 EJECT-A-DIP™ Active 1 (Unlimited) Solder EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A 14 LATCHED, UL 94V-0 2.54mm Surface Mount -55°C~105°C 1000000000Ohm DIP, 0.3 (7.62mm) Row Spacing 1.016mm e3 0.95 inch 0.4 inch 2 RECTANGULAR RND PIN-SKT 0.1 inch 1000VAC V Closed Frame 0.3 mm UL94 V-0 0.100 2.54mm Tin 10.0μin 0.25μm 200.0μin 5.08μm 14 (2 x 7) Beryllium Copper Brass 0.040 1.02mm 0.100 2.54mm
510-13-289-17-000003 510-13-289-17-000003 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (30) OVER NICKEL (100) 289 ROHS3 Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e4 2.54mm 125°C -55°C 1.7 inch 1.7 inch STRAIGHT RECTANGULAR 0.165 inch RND PIN-SKT 0.1 inch 1000VAC V Gold (Au) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA289 17X17
AW 127-24/Z-T AW 127-24/Z-T Assmann WSW Components 0.0000
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0.00000000 23 Weeks Active 1 (Unlimited) ROHS3 Compliant e2 Tin/Nickel (Sn/Ni)
126-43-636-41-003000 126-43-636-41-003000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC yes Active EAR99 125°C -55°C Straight 17.78mm 36 45.72mm ROHS3 Compliant NOT SPECIFIED Gold 3A DIP SOCKET 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polybutylene 2 Matte Tin (Sn) - with Nickel (Ni) barrier 2.54mm 15.24 mm IC SOCKET DIP36
26-820-90C 26-820-90C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Horizontal, Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 Vertisockets™ 800 Active 1 (Unlimited) Solder 26 EAR99 Gold 26 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole, Right Angle, Horizontal -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e4 2.54mm 1.3 inch 0.4 inch RECTANGULAR 0.565 inch RND PIN-SKT 0.1 inch Closed Frame 0.1 mm UL94 V-0 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 26 (2 x 13) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
511-93-241-18-075002 511-93-241-18-075002 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER no Active EAR99 GOLD (30) OVER NICKEL (100) 241 Non-RoHS Compliant NOT SPECIFIED 1A PGA SOCKET 8536.90.40.00 10000000000Ohm e0 2.54mm 125°C -55°C 1.8 inch 1.8 inch STRAIGHT RECTANGULAR 0.173 inch RND PIN-SKT 0.1 inch 1000VAC V Tin/Lead (Sn/Pb) - with Nickel (Ni) barrier SOLDER 0.1 mm IC SOCKET PGA241 18X18
4-2013620-3 4-2013620-3 TE Connectivity / AMP 0.0000
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0.00000000 Surface Mount Thermoplastic 989 Compliant RoHS Compliant UL94 V-0 Gold Black
44-3571-10 44-3571-10 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyphenylene Sulfide (PPS), Glass Filled Bulk 2005 57 yes Active 1 (Unlimited) Solder 44 EAR99 Tin 44 ROHS3 Compliant UL94 V-0 1A STANDARD: UL 94V-0 Through Hole DIP, ZIF (ZIP), 0.3 (7.62mm) Row Spacing 2.794mm e3 Closed Frame UL94 V-0 0.100 2.54mm 200.0μin 5.08μm 200.0μin 5.08μm 44 (2 x 22) Beryllium Copper Beryllium Copper 0.110 2.78mm 0.100 2.54mm
551-10-100-13-061004 551-10-100-13-061004 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks POLYCYCLOHEXYDIMETHYLENE TEREPHTHALATE-POLYESTER yes Active EAR99 GOLD (10) OVER NICKEL (150) 100 ROHS3 Compliant NOT SPECIFIED PGA SOCKET 8536.90.40.00 e4 Gold (Au) - with Nickel (Ni) barrier IC SOCKET PGA100
605-43-322-11-480000 605-43-322-11-480000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC yes Active EAR99 125°C -55°C Straight 10.1mm 22 27.8mm ROHS3 Compliant Copper Gold 3A LOW PROFILE 150V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 Matte Tin (Sn) - with Nickel (Ni) barrier 2.54mm 7.62 mm IC SOCKET
05-0503-20 05-0503-20 Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA), Nylon, Glass Filled Bulk 2006 0503 Active 1 (Unlimited) Wire Wrap 5 EAR99 Gold 5 ROHS3 Compliant UL94 HB 3A 2.54mm Through Hole SIP 9.144mm e4 1 RECTANGULAR RND PIN-SKT UL94 HB 0.100 2.54mm Tin 30.0μin 0.76μm 200.0μin 5.08μm 5 (1 x 5) Beryllium Copper Brass 0.360 9.14mm 0.100 2.54mm
14-0513-11H 14-0513-11H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2007 0513 yes Active 1 (Unlimited) Solder 14 EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 2.54mm Through Hole SIP 3.175mm e4 1 RECTANGULAR RND PIN-SKT UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 14 (1 x 14) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
14-8270-310C 14-8270-310C Aries Electronics 0.0000
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0.00000000 download 6 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 8 yes Active 1 (Unlimited) Solder 14 EAR99 Gold 14 ROHS3 Compliant UL94 V-0 3A STANDARD: UL 94V-0 Through Hole -55°C~105°C DIP, 0.3 (7.62mm) Row Spacing 3.556mm e3 Closed Frame, Elevated UL94 V-0 0.100 2.54mm 30.0μin 0.76μm 10.0μin 0.25μm 14 (2 x 7) Beryllium Copper Brass 0.140 3.56mm 0.100 2.54mm
510-41-144-15-082001 510-41-144-15-082001 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 download 3 Weeks Active ROHS3 Compliant
110-43-428-41-001000 110-43-428-41-001000 0.0000
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0.00000000
09-0518-11H 09-0518-11H Aries Electronics 0.0000
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0.00000000 download 5 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 518 yes Active 1 (Unlimited) Solder Gold 9 ROHS3 Compliant UL94 V-0 3A 9 2.54mm Through Hole SIP 3.175mm e4 1 RECTANGULAR RND PIN-SKT Open Frame UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 9 (1 x 9) Beryllium Copper Brass 0.125 3.18mm 0.100 2.54mm
18-6501-31 18-6501-31 Aries Electronics 0.0000
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0.00000000 download 7 Weeks Through Hole Polyamide (PA46), Nylon 4/6, Glass Filled Bulk 2006 501 Active 1 (Unlimited) Wire Wrap 18 EAR99 Gold 18 ROHS3 Compliant UL94 V-0 1.5A STANDARD: UL 94V-0 2.54mm Through Hole -55°C~125°C DIP, 0.6 (15.24mm) Row Spacing 17.526mm e4 0.95 inch 0.69 inch 2 RECTANGULAR 0.3 inch SQ PIN-SKT 0.1 inch Closed Frame 0.6 mm UL94 V-0 0.100 2.54mm 10.0μin 0.25μm 10.0μin 0.25μm 18 (2 x 9) Phosphor Bronze Phosphor Bronze 0.690 17.52mm 0.100 2.54mm
210-43-424-41-001000 210-43-424-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks PLASTIC yes Active Solder EAR99 125°C -55°C Straight 12.7mm 24 30.48mm ROHS3 Compliant NOT SPECIFIED Gold 3A LOW PROFILE 150V 100V 8536.90.40.00 10mOhm 10GOhm e3 Polychlorinated 2 2.54mm 10.16 mm IC SOCKET
123-41-420-41-001000 123-41-420-41-001000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks yes Active EAR99 GOLD (10) OVER NICKEL (100) ROHS3 Compliant NOT SPECIFIED 8536.90.40.00 e3 Matte Tin (Sn) - with Nickel (Ni) barrier IC SOCKET
117-93-764-41-005000 117-93-764-41-005000 Mill-Max Manufacturing Corp. 0.0000
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0.00000000 3 Weeks Through Hole Polycyclohexylenedimethylene Terephthalate (PCT), Polyester Tube 2011 117 no Active 1 (Unlimited) Solder EAR99 Female Gold Straight 21.34mm 64 57.2mm Non-RoHS Compliant Contains Lead Copper 3A 64 180μm Through Hole -55°C~125°C 150V 100V 8536.90.40.00 10mOhm 10GOhm DIP, 0.75 (19.05mm) Row Spacing e0 Polychlorinated 2 Closed Frame UL94 V-0 19.05 mm 0.070 1.78mm Tin-Lead 30.0μin 0.76μm 200.0μin 5.08μm 64 (2 x 32) Beryllium Copper Brass Alloy 0.125 3.18mm 0.070 1.78mm
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