Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Operating Temperature | Technology | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Supplier Device Package | Output Characteristics | Access Time | Frequency (Max) | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Ready/Busy | Common Flash Interface | Serial Bus Type | I2C Control Byte | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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AT25160N-10SI-2.7 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 1 (Unlimited) | Non-RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | EEPROM | AT25160 | 8-SOIC | 16Kb 2K x 8 | Non-Volatile | 2.7V~5.5V | 3MHz | EEPROM | SPI | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
TE28F320J3D75A | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2007 | StrataFlash™ | Obsolete | 2 (1 Year) | 56 | Non-RoHS Compliant | No | 56 | 56-TFSOP (0.724, 18.40mm Width) | 32 Mb | Surface Mount | -40°C~85°C TA | FLASH - NOR | DUAL | 28F320J3 | 0.5mm | 3/3.3V | 32Mb 4M x 8 2M x 16 | Non-Volatile | 0.08mA | 2.7V~3.6V | 2MX16 | 16 | Asynchronous | 0.00012A | 75 ns | 8 | NO | NO | YES | 32 | 4/8words | YES | YES | FLASH | Parallel | 75ns | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q16FWSSIQ | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 14 Weeks | Tube | 2016 | SpiFlash® | Last Time Buy | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 5.28mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | S-PDSO-G8 | 1.65V | 1.95V | 16Mb 2M x 8 | Non-Volatile | 1.65V~1.95V | 16MX1 | 1 | 16777216 bit | 104MHz | 1.8V | FLASH | SPI - Quad I/O, QPI | 60μs, 3ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT34C02-10PC-1.8 | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | Not Applicable | Non-RoHS Compliant | 8-DIP (0.300, 7.62mm) | Through Hole | 0°C~70°C TA | AT34C02 | 900ns | 2Kb 256 x 8 | Non-Volatile | 1.8V~5.5V | 400kHz | EEPROM | I2C | 10ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT48H16M32L2B5-8 IT TR | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2003 | Discontinued | 2 (1 Year) | ROHS3 Compliant | 90-VFBGA | Surface Mount | -40°C~85°C TA | SDRAM - Mobile LPSDR | MT48H16M32 | 90-VFBGA (8x13) | 7.5ns | 512Mb 16M x 32 | Volatile | 1.7V~1.9V | 125MHz | DRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7130SA25TF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2013 | no | Active | 3 (168 Hours) | 64 | EAR99 | 70°C | 0°C | 5V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | TQFP | Parallel | 5.5V | 4.5V | 8 kb | 10mm | 1.4mm | CMOS | 1.6mm | 1 | 220mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 5V | 20 | 64 | COMMERCIAL | 0.5mm | SRAMs | 5V | 3-STATE | 25 ns | 1kB | RAM, SDR, SRAM | 10b | 1KX8 | Asynchronous | 0.015A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7054L25PRFI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 128 | EAR99 | 85°C | -40°C | 5V | 4 | 20mm | RoHS Compliant | Contains Lead | No | 128 | AUTOMATIC POWER DOWN; LOW POWER STANDBY MODE | TQFP | Parallel | 5.5V | 4.5V | 32 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 300mA | e0 | Tin/Lead (Sn/Pb) | QUAD | FLAT | 225 | 5V | 128 | INDUSTRIAL | 0.5mm | SRAMs | 5V | 3-STATE | 25 ns | RAM, SRAM | 12b | Asynchronous | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX29GL512FLXFI-11G | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 64 | 85°C | -40°C | 3.6V | 13mm | RoHS Compliant | Lead Free | Parallel | 512 Mb | 11mm | CMOS | ASYNCHRONOUS | 1.4mm | 1 | e1 | Tin/Silver/Copper (Sn95.5Ag4.0Cu0.5) | BOTTOM | BALL | 260 | 3V | 40 | INDUSTRIAL | YES | 1mm | R-PBGA-B64 | 2.7V | Flash Memories | Not Qualified | 3/3.3V | 110 ns | FLASH, NOR | 0.03mA | 32MX16 | 16 | 0.00002A | 8 | 3V | YES | YES | 512 | 8/16words | YES | 128K | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93LC66AXT/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | yes | Obsolete | 1 (Unlimited) | 8 | EAR99 | 5.5V | 4.9mm | ROHS3 Compliant | Lead Free | No | 1000000 ERASE/WRITE CYCLES MIN; DATA RETENTION > 200 YEARS | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, Serial | 4 kb | 3.9mm | Surface Mount | 0°C~70°C TA | CMOS | 1.75mm | 8542.32.00.51 | 1 | e3 | Matte Tin (Sn) | DUAL | 260 | 3V | 40 | 93LC66A | 8 | YES | 1.27mm | R-PDSO-G8 | 2.5V | 3/5V | 6V | 6 ms | 4Kb 512 x 8 | Non-Volatile | 0.003mA | 2.5V~5.5V | 512X8 | 8 | 2MHz | 0.00003A | 10 | 100000 Write/Erase Cycles | SOFTWARE | MICROWIRE | EEPROM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V67602S150PFG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2004 | yes | Active | 3 (168 Hours) | 100 | 70°C | 0°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 150MHz | 14mm | 1.4mm | CMOS | 1 | 305mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | COMMERCIAL | 0.65mm | SRAMs | 3-STATE | 3.8 ns | 150MHz | 1.1MB | RAM, SDR, SRAM | 18b | 256KX36 | Synchronous | 0.05A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V35761SA166BGG | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | yes | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | PIPELINED ARCHITECTURE | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 320mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | COMMERCIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 576kB | RAM, SDR, SRAM | 17b | Synchronous | 0.03A | 36b | COMMON | |||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA133BG8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2015 | no | Active | 3 (168 Hours) | 119 | 70°C | 0°C | 3.3V | 1 | 14mm | RoHS Compliant | Contains Lead | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 133MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 300mA | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 3.3V | 20 | 119 | COMMERCIAL | SRAMs | 3-STATE | 4.2 ns | 133MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.04A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "7005S55JI8") |
7005S55JI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | no | Active | 1 (Unlimited) | 68 | EAR99 | 85°C | -40°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; SEMAPHORE | PLCC | Parallel | 5.5V | 4.5V | 64 kb | 24mm | 3.63mm | CMOS | 1 | 300mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 68 | INDUSTRIAL | SRAMs | 5V | 3-STATE | 55 ns | 8kB | RAM, SDR, SRAM | 26b | 8KX8 | Asynchronous | 0.03A | 8b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71256SA15TPI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Rail/Tube | 2010 | 85°C | -40°C | 5V | 1 | Non-RoHS Compliant | 28 | PDIP | Parallel | 5.5V | 4.5V | 256 kb | 150mA | 15 ns | RAM, SRAM - Asynchronous | 15b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
24LC1026-I/P | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | 2001 | Active | 1 (Unlimited) | 8 | EAR99 | 10.16mm | ROHS3 Compliant | Tin | No | 8 | 200 YEARS DATA RETENTION | 8-DIP (0.300, 7.62mm) | I2C, Serial | No SVHC | 1 Mb | 4.953mm | 7.112mm | Through Hole | -40°C~85°C TA | CMOS | 1 | 5mA | e3 | DUAL | 5V | 24LC1026 | 8 | NO | 2.54mm | 2.5V | 3/5V | 5.5V | 900ns | 1Mb 128K x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDMR | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||
|
71342LA45JI | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 52-LCC (J-Lead) | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 45ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MX30UF4G28AB-TI | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 48 | 85°C | -40°C | 18.4mm | RoHS Compliant | Lead Free | TFSOP | Parallel | 12mm | CMOS | ASYNCHRONOUS | 1.2mm | 1 | DUAL | GULL WING | NOT SPECIFIED | 1.8V | NOT SPECIFIED | INDUSTRIAL | YES | 0.5mm | R-PDSO-G48 | 1.7V | 1.95V | FLASH, NAND | 512MX8 | 8 | 4294967296 bit | 1.8V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
7006S25J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | Active | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | 265mA | 25 ns | 16kB | RAM, SDR, SRAM | 28b | Asynchronous | 8b | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V08L35PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2009 | no | Active | 3 (168 Hours) | 100 | EAR99 | 70°C | 0°C | 3.3V | 2 | 14mm | RoHS Compliant | Contains Lead | No | 100 | TQFP | Parallel | 3.6V | 3V | 512 kb | 14mm | 1.4mm | CMOS | 1.6mm | 1 | 160mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | 0.5mm | SRAMs | 3-STATE | 35 ns | 64kB | RAM, SDR, SRAM | 16b | 64KX8 | Asynchronous | 0.003A | 8b | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||
|
7050S35PQF | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 132-BQFP Bumpered | Surface Mount | 0°C~70°C TA | SRAM - Quad Port, Asynchronous | IDT7050 | 8Kb 1K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 35ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V3556SA166BGGI | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2006 | yes | Active | 3 (168 Hours) | 119 | 85°C | -40°C | 3.3V | 1 | 14mm | RoHS Compliant | Lead Free | No | 119 | BGA | Parallel | 3.465V | 3.135V | 4.5 Mb | 166MHz | 22mm | 2.15mm | CMOS | 2.36mm | 1 | 360mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | BALL | 260 | 3.3V | 30 | 119 | INDUSTRIAL | SRAMs | 3-STATE | 3.5 ns | 166MHz | 512kB | RAM, SDR, SRAM | 17b | Synchronous | 0.045A | 36b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||
|
S99FL256SAGMFIR01 | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Obsolete | 3 (168 Hours) | ROHS3 Compliant | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IS61LPS102418A-200TQ-TR | ISSI, Integrated Silicon Solution Inc | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 2 (1 Year) | 70°C | 0°C | Non-RoHS Compliant | 100 | 100-LQFP | Parallel | 3.465V | 3.135V | 200MHz | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | 200MHz | 100-TQFP (14x20) | 3.1ns | 18Mb 1M x 18 | Volatile | 3.135V~3.465V | 200MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3579S85PFI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | 3 (168 Hours) | 100 | 3A991.B.2.A | 85°C | -40°C | 20mm | Non-RoHS Compliant | FLOW-THROUGH ARCHITECTURE | LQFP | Parallel | not_compliant | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 3.3V | 3.465V | 3-STATE | RAM, SRAM | 0.19mA | 256KX18 | 18 | 4718592 bit | 87MHz | 0.035A | 8.5 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V2576S133PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2009 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | COMMERCIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.25mA | 128KX36 | 36 | 4718592 bit | 0.03A | 4.2 ns | COMMON | 3.13V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
70V658S15BC | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 17 Weeks | Tray | Active | 4 (72 Hours) | Non-RoHS Compliant | 256-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Dual Port, Asynchronous | IDT70V658 | 256-CABGA (17x17) | 15ns | 2Mb 64K x 36 | Volatile | 3.15V~3.45V | SRAM | Parallel | 15ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
25LC020A-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 27 Weeks | Surface Mount | Tube | 2012 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.4mm | ROHS3 Compliant | Lead Free | No | 8 | DATA RETENTION > 200 YEARS; 1,000,000 ERASE/WRITE CYCLES | 8-TSSOP (0.173, 4.40mm Width) | SPI, Serial | 2 kb | 3mm | Surface Mount | -40°C~125°C TA | CMOS | 1.2mm | 1 | 5mA | e3 | Matte Tin (Sn) | DUAL | 260 | 5V | 40 | 25LC020A | 8 | 0.65mm | 50 ns | 2Kb 256 x 8 | Non-Volatile | 2.5V~5.5V | 8 | 10MHz | 0.000001A | 200 | 1000000 Write/Erase Cycles | HARDWARE/SOFTWARE | 5ms | SPI | EEPROM | SPI | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MX25U51245GXDI00 | Macronix | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tray | MX25xxx45 - MXSMIO™ | Active | 3 (168 Hours) | 24 | 8mm | RoHS Compliant | IT ALSO HAVE MEMORY WIDTH X1 | 24-TBGA, CSPBGA | 6mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 1.2mm | 1 | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1mm | R-PBGA-B24 | 1.65V | 2V | 512Mb 64M x 8 | Non-Volatile | 1.65V~2V | 128MX4 | 4 | 536870912 bit | SERIAL | 166MHz | 2 | 1.8V | FLASH | SPI - Quad I/O, QPI, DTR | 60μs, 750μs | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71P71604S167BQ8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2007 | 3 (168 Hours) | 165 | 3A991.B.2.A | 70°C | 0°C | 15mm | Non-RoHS Compliant | 165 | Parallel | not_compliant | 167MHz | 13mm | CMOS | SYNCHRONOUS | 1.2mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn63Pb37) | BOTTOM | BALL | 225 | 1.8V | 20 | 165 | COMMERCIAL | YES | 1mm | 1.7V | SRAMs | Not Qualified | 1.5/1.81.8V | 1.9V | 3-STATE | DDR, RAM, SRAM | 0.6mA | 512KX36 | 36 | 18874368 bit | 0.275A | 0.5 ns | COMMON | 1.7V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71342LA25PFI8 | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 64-LQFP | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Asynchronous | IDT71342 | 32Kb 4K x 8 | Volatile | 4.5V~5.5V | SRAM | Parallel | 25ns |
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TE28F320J3D75A Micron Technology Inc.
3/3.3V V Surface Mount StrataFlash™ Memory IC StrataFlash™ Series 28F320J3 32 Mb kb
Price: 0.0000
RFQ -
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7130SA25TF8 Integrated Device Technology (IDT)
5V V Surface Mount 64 Pin Memory IC 8 kb kb 10mm mm 220mA mA 8b b
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71V67602S150PFG8 Integrated Device Technology (IDT)
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24LC1026-I/P Microchip Technology
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7006S25J8 Integrated Device Technology (IDT)
Surface Mount Memory IC 128 kb kb 24mm mm 265mA mA 8b b
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IDT71V3579S85PFI8 Integrated Device Technology (IDT)
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25LC020A-E/ST Microchip Technology
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MX25U51245GXDI00 Macronix
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