Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Mounting Type | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | Manufacturer Package Identifier | HTS Code | Number of Functions | Nominal Supply Current | JESD-609 Code | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Operating Temperature (Max) | Operating Temperature (Min) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Ambient Temperature Range High | Max Power Dissipation | Supplier Device Package | Access Time | Screening Level | Memory Size | Memory Type | Voltage - Supply | Organization | Memory Width | Memory Density | Memory IC Type | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | Programming Voltage | Serial Bus Type | I2C Control Byte | Memory Format | Memory Interface | Write Cycle Time - Word, Page |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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FT24C64A-USG-B | Fremont Micro Devices Ltd | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Tube | 2010 | Discontinued | 1 (Unlimited) | 85°C | -40°C | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | 2-Wire, I2C, Serial | 1MHz | Surface Mount | -40°C~85°C | EEPROM | 8-SOP | 700ns | 64Kb 8K x 8 | Non-Volatile | 1.8V~5.5V | 800kHz | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RS256TYPNF-G-BCERE1 | Fujitsu Electronics America, Inc. | 3.2163 |
Min: 1 Mult: 1 |
0.00000000 | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | RoHS Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~125°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 256Kb 32K x 8 | Non-Volatile | 1.8V~3.6V | 33MHz | FRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RS2MTPF-G-JNERE2 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tape & Reel (TR) | 2015 | Not For New Designs | 1 (Unlimited) | 85°C | -40°C | 3.3V | RoHS Compliant | 8 | 8-SOIC (0.209, 5.30mm Width) | SPI, Serial | 2 Mb | 40MHz | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 2Mb 256K x 8 | Non-Volatile | 1.8V~3.6V | 8b | 25MHz | FRAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RS64TUPN-G-AMEWE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | RoHS Compliant | 8-WFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SON | 64Kb 8K x 8 | Non-Volatile | 1.8V~3.6V | 10MHz | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MB85RC16VPNF-G-JNERE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2016 | Obsolete | 3 (168 Hours) | RoHS Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 8-SOP | 550ns | 16Kb 2K x 8 | Non-Volatile | 3V~5.5V | 1MHz | FRAM | I2C | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
GD5F1GQ4UEYIGY | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | Active | 3 (168 Hours) | ROHS3 Compliant | 8-WDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NAND | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 120MHz | FLASH | SPI - Quad I/O | 700μs | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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BQ4011YMA-100 | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Through Hole | Tube | no | Obsolete | 1 (Unlimited) | 28 | EAR99 | 5V | 37.72mm | ROHS3 Compliant | Contains Lead | No | 28 | 28-DIP Module (0.61, 15.49mm) | No SVHC | 256 kb | 100GHz | Through Hole | 0°C~70°C TA | NVSRAM (Non-Volatile SRAM) | 50mA | 9.53mm | 8542.32.00.41 | 1 | 50mA | DUAL | 5V | BQ4011 | 2.54mm | SRAMs | 5V | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | 32KX8 | 8 | 8b | 0.004A | 100 ns | 8b | NVSRAM | Parallel | 100ns | ||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ32DSIGR | GigaDevice Semiconductor (HK) Limited | 1.0697 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 32Mb 4M x 8 | Non-Volatile | 1.65V~2V | 120MHz | FLASH | SPI - Quad I/O | 2.4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25VE16CTIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.1V~3.6V | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25VQ16CSIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
GD25VQ16CSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tube | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 16Mb 2M x 8 | Non-Volatile | 2.3V~3.6V | 104MHz | FLASH | SPI - Quad I/O | 50μs, 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24FC515-I/SM | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 3 Weeks | Surface Mount | Tube | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5.33mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 8-SOIC (0.209, 5.30mm Width) | I2C, Serial | No SVHC | 512 kb | 1.98mm | 5.38mm | Surface Mount | -40°C~85°C TA | CMOS | 1 | 3mA | e3 | DUAL | 4.5V | 24FC515 | 8 | 1.27mm | 2.5V | 3/5V | 5.5V | 400ns | 512Kb 64K x 8 | Non-Volatile | 2.5V~5.5V | 1MHz | 0.000005A | 200 | 100000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010MDDR | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||
|
GD25WD80CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "S34ML02G100BHB000") |
S34ML02G100BHB000 | SkyHigh Memory Limited | 5.2916 |
Min: 1 Mult: 1 |
0.00000000 | Tray | Active | 3 (168 Hours) | 63 | 11mm | RoHS Compliant | 9mm | CMOS | ASYNCHRONOUS | 1mm | 1 | BOTTOM | BALL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | INDUSTRIAL | YES | 0.8mm | R-PBGA-B63 | 2.7V | 105°C | -40°C | 3.6V | AEC-Q100 | 256MX8 | 8 | 2147483648 bit | FLASH | PARALLEL | 3V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
GD25VE20CSIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 2.1V~3.6V | 104MHz | FLASH | SPI - Quad I/O | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W29N01GVBIAA | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2016 | Discontinued | 3 (168 Hours) | 63 | 11mm | ROHS3 Compliant | 63 | 63-VFBGA | unknown | 9mm | Surface Mount | -40°C~85°C TA | FLASH - NAND (SLC) | ASYNCHRONOUS | 1mm | 1 | BOTTOM | 3.3V | YES | 0.8mm | 2.7V | 3.6V | 1Gb 128M x 8 | Non-Volatile | 2.7V~3.6V | 128MX8 | 8 | 1073741824 bit | 3.3V | FLASH | Parallel | 25ns | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
SFEM008GB1EA1TO-I-GE-121-STD | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | EM-20 | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | 64Gb 8G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
|
SFEM016GB1EA1TO-I-GE-121-STD | Swissbit | 30.4110 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tray | EM-20 | Active | 3 (168 Hours) | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (MLC) | 128Gb 16G x 8 | Non-Volatile | 2.7V~3.6V | 200MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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SFEM008GB1EA1TO-I-GE-111-E04 | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | EM-26 | Active | 3 (168 Hours) | 153 | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~85°C | FLASH - NAND (pSLC) | SYNCHRONOUS | 1 | BOTTOM | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | R-PBGA-B153 | 2.7V | 3.6V | 32Gb 4G x 8 | Non-Volatile | 2.7V~3.6V | 4GX8 | 8 | 34359738368 bit | 200MHz | 2.7V | FLASH | eMMC | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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EM-10 8GB I-GRADE | Swissbit | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | Bulk | EM-10 | Active | Not Applicable | ROHS3 Compliant | 153-VFBGA | Surface Mount | -40°C~105°C | FLASH - NAND (MLC) | 153-BGA (11.5x13) | 8GB | Non-Volatile | 2.7V~3.6V | 52MHz | FLASH | eMMC | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
FM25640B-GATR | Ramtron | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Cut Tape (CT) | 2011 | Automotive, AEC-Q100, F-RAM™ | Obsolete | 1 (Unlimited) | 8 | 7V | 4.9mm | ROHS3 Compliant | 8 | 8-SOIC (0.154, 3.90mm Width) | SPI, Serial | unknown | 3.9mm | Surface Mount | -40°C~125°C TA | FRAM (Ferroelectric RAM) | SYNCHRONOUS | 1.75mm | 1 | DUAL | 5V | FM25640 | 8 | YES | 1.27mm | 4.5V | Not Qualified | 5.5V | 64Kb 8K x 8 | Non-Volatile | 4.5V~5.5V | 8 | 65536 bit | 4MHz | FRAM | SPI | |||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MB85R4002ANC-GE1 | Fujitsu Electronics America, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 20 Weeks | Tray | 2015 | Not For New Designs | 1 (Unlimited) | 85°C | -40°C | RoHS Compliant | Lead Free | 48 | 48-TFSOP (0.488, 12.40mm Width) | Parallel | 3.6V | Unknown | 3V | Surface Mount | -40°C~85°C TA | FRAM (Ferroelectric RAM) | 48-TSOP | 150ns | 4Mb 256K x 16 | Non-Volatile | 3V~3.6V | FRAM | Parallel | 150ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25Q80CSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | 2016 | Active | 3 (168 Hours) | 8 | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 1 | DUAL | NOT SPECIFIED | 3.3V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 2.7V | 3.6V | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 8MX1 | 1 | 8388608 bit | SERIAL | 120MHz | 3.3V | FLASH | SPI - Quad I/O | 50μs, 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
EM6GE16EWXD-10IH | Etron Technology, Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Tape & Reel (TR) | Not For New Designs | 3 (168 Hours) | 96-TFBGA | Surface Mount | -40°C~95°C TC | SDRAM - DDR3 | 20ns | 4Gb 256M x 16 | Volatile | 1.425V~1.575V | 933MHz | DRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR25H10MDF | Everspin Technologies Inc. | 10.3598 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tray | 2013 | Automotive, AEC-Q100 | Active | 3 (168 Hours) | 8 | EAR99 | 6mm | ROHS3 Compliant | 8 | 8-VDFN Exposed Pad | 1 Mb | 900μm | Surface Mount | -40°C~125°C TA | MRAM (Magnetoresistive RAM) | SYNCHRONOUS | 1 | 27mA | DUAL | NOT SPECIFIED | 3V | NOT SPECIFIED | 8 | 1.27mm | 3V | 3.6V | 125°C | 600mW | 10 ns | 1Mb 128K x 8 | Non-Volatile | 2.7V~3.6V | 8 | 8b | 40MHz | 8b | RAM | SPI | ||||||||||||||||||||||||||||||||||||||||||||||||
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GD25WD10CEIGR | GigaDevice Semiconductor (HK) Limited | 0.4212 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-XFDFN Exposed Pad | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1Mb 128K x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25WD10CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 1Mb 128K x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25LQ64CSIG | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tube | 2016 | Active | 3 (168 Hours) | 8 | 3A991.B.1.A | 5.28mm | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | 5.23mm | Surface Mount | -40°C~85°C TA | FLASH - NOR | SYNCHRONOUS | 2.16mm | 8542.32.00.51 | 1 | DUAL | NOT SPECIFIED | 1.8V | NOT SPECIFIED | YES | 1.27mm | R-PDSO-G8 | 1.65V | 2V | 64Mb 8M x 8 | Non-Volatile | 1.65V~2V | 64MX1 | 1 | 67108864 bit | SERIAL | 120MHz | 1.8V | FLASH | SPI - Quad I/O | 2.4ms | ||||||||||||||||||||||||||||||||||||||||||||||||||
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GD25WD20CTIGR | GigaDevice Semiconductor (HK) Limited | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 4 Weeks | Tape & Reel (TR) | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.154, 3.90mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 2Mb 256K x 8 | Non-Volatile | 1.65V~3.6V | FLASH | SPI - Quad I/O | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MR2A16ACYS35 | Everspin Technologies Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Surface Mount | Tray | 2003 | yes | Active | 3 (168 Hours) | 44 | SMD/SMT | EAR99 | 3.3V | 18.41mm | ROHS3 Compliant | Lead Free | No | 44 | 44-TSOP (0.400, 10.16mm Width) | No SVHC | 4 Mb | 1.2mm | Surface Mount | -40°C~85°C TA | MRAM (Magnetoresistive RAM) | 105mA | MR2A16ACYS35 | 8542.32.00.71 | 1 | 165mA | DUAL | 3.3V | 44 | 0.8mm | 3V | 3.6V | 85°C | 4Mb 256K x 16 | Non-Volatile | 3V~3.6V | 256KX16 | 16 | 16b | 0.028A | 35 ns | 16b | RAM | Parallel | 35ns |
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BQ4011YMA-100 Texas Instruments
5V V Through Hole Memory IC BQ4011 256 kb kb 37.72mm mm 50mA mA 8b b
Price: 0.0000
RFQ -
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24FC515-I/SM Microchip Technology
3/5V V Surface Mount 8 Pin Memory IC 24FC515 512 kb kb 5.33mm mm 3mA mA
Price: 0.0000
RFQ -
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FM25640B-GATR Ramtron
Automotive, AEC-Q100, F-RAM™ 8 Pin Memory IC Automotive, AEC-Q100, F-RAM™ Series FM25640 4.9mm mm
Price: 0.0000
RFQ -
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MR25H10MDF Everspin Technologies Inc.
Surface Mount Automotive, AEC-Q100 8 Pin Memory IC Automotive, AEC-Q100 Series 1 Mb kb 6mm mm 27mA mA 8b b
Price: 10.3598
RFQ -
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MR2A16ACYS35 Everspin Technologies Inc.
Surface Mount 44 Pin Memory IC 4 Mb kb 18.41mm mm 165mA mA 16b b
Price: 0.0000
RFQ
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