Items : %s%s
Memory
Contact Plating
- Tin
ECCN Code
- 3A991.B.1.A
- EAR99
Factory Lead Time
- 11 Weeks
- 4 Weeks
- 5 Weeks
- 6 Weeks
- 7 Weeks
- 8 Weeks
JESD-609 Code
- e3
- e4
Manufacturer Package Identifier
- 24AA256-I/P
Moisture Sensitivity Level (MSL)
- 1 (Unlimited)
- 1 (Unlimited)
- 3 (168 Hours)
Mount
- Surface Mount
- Through Hole
Mounting Type
- Surface Mount
- Through Hole
Number of Pins
- 28
- 3
- 32
- 5
- 8
Number of Terminations
- 28
- 3
- 32
- 5
- 8
Operating Temperature
- -40°C~85°C TA
- 0°C~70°C TA
Package / Case
- 28-DIP (0.600, 15.24mm)
- 32-DIP (0.600, 15.24mm)
- 32-LCC (J-Lead)
- 32-TFSOP (0.488, 12.40mm Width)
- 8-DIP (0.300, 7.62mm)
- 8-SOIC (0.154, 3.90mm Width)
- 8-SOIC (0.209, 5.30mm Width)
- 8-TSSOP, 8-MSOP (0.118, 3.00mm Width)
- SC-74A, SOT-753
- TO-226-3, TO-92-3 (TO-226AA)
Packaging
- Bulk
- Tape & Reel (TR)
- Tray
- Tube
Part Status
- Active
- Obsolete
Pbfree Code
- yes
Published
- 1995
- 1997
- 2000
- 2002
- 2003
- 2004
- 2005
- 2007
- 2008
- 2009
- 2013
Series
- MoBL®
- SST39 MPF™
Surface Mount
- NO
- YES
Terminal Finish
- Matte Tin (Sn)
- Matte Tin (Sn) - annealed
- Nickel/Palladium/Gold (Ni/Pd/Au)
Termination
- SMD/SMT
- Through Hole
Weight
- 453.59237mg
| Compare | Image | Name | Manufacturer | Pricing(USD) | Quantity | Weight(Kg) | Size(LxWxH) | Datasheet | Factory Lead Time | Lifecycle Status | Mount | Packaging | Published | Series | Pbfree Code | Part Status | Moisture Sensitivity Level (MSL) | Number of Terminations | Termination | ECCN Code | Max Operating Temperature | Min Operating Temperature | Operating Supply Voltage | Number of Ports | Length | RoHS Status | Lead Free | Contact Plating | Radiation Hardening | Number of Pins | Additional Feature | Package / Case | Interface | Max Supply Voltage | REACH SVHC | Reach Compliance Code | Min Supply Voltage | Density | Frequency | Height | Width | Thickness | Mounting Type | Weight | Operating Temperature | Technology | Operating Supply Current | Operating Mode | Height Seated (Max) | HTS Code | Number of Functions | Nominal Supply Current | Max Frequency | JESD-609 Code | Terminal Finish | Terminal Position | Terminal Form | Peak Reflow Temperature (Cel) | Supply Voltage | Time@Peak Reflow Temperature-Max (s) | Base Part Number | Pin Count | Temperature Grade | Surface Mount | Terminal Pitch | JESD-30 Code | Supply Voltage-Min (Vsup) | Subcategory | Qualification Status | Power Supplies | Supply Voltage-Max (Vsup) | Voltage | Supplier Device Package | Output Characteristics | Logic Function | Access Time | Frequency (Max) | Screening Level | Memory Size | Memory Type | Address Bus Width | Supply Current-Max | Voltage - Supply | Organization | Memory Width | Memory Density | Sync/Async | Data Bus Width | Parallel/Serial | Clock Frequency | Standby Current-Max | Access Time (Max) | Word Size | Alternate Memory Width | Data Retention Time-Min | Endurance | Write Protection | Write Cycle Time-Max (tWC) | I/O Type | Programming Voltage | Data Polling | Toggle Bit | Command User Interface | Number of Sectors/Size | Page Size | Serial Bus Type | I2C Control Byte | Reverse Pinout | Refresh Cycles | Standby Voltage-Min | Memory Format | Memory Interface | Write Cycle Time - Word, Page | Sector Size | Sequential Burst Length | Interleaved Burst Length | Boot Block |
|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|---|
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CY7C0831AV-133BBXI | Cypress Semiconductor Corp | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Surface Mount | Tray | 2003 | Obsolete | 3 (168 Hours) | 144 | 3.3V | 2 | 13mm | ROHS3 Compliant | Lead Free | 144 | PIPELINED ARCHITECTURE | 144-LFBGA | unknown | 2 Mb | Surface Mount | -40°C~85°C TA | SRAM - Dual Port, Synchronous | 1.6mm | 1 | 300mA | e1 | Tin/Silver/Copper (Sn/Ag/Cu) | BOTTOM | 260 | 3.3V | 20 | CY7C0831 | 144 | 1mm | 3.135V | Not Qualified | 3.465V | 3-STATE | 4.4 ns | 2Mb 128K x 18 | Volatile | 34b | 3.135V~3.465V | 18 | Synchronous | 133MHz | 0.075A | 18b | COMMON | 3.14V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24LC08BT-I/MS16KVAO | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | Automotive, AEC-Q100 | Active | 2 (1 Year) | 8 | 3mm | 8-TSSOP, 8-MSOP (0.118, 3.00mm Width) | compliant | 3mm | Surface Mount | -40°C~85°C TA | CMOS | SYNCHRONOUS | 1.1mm | 4 | DUAL | 5V | 24LC08B | YES | 0.65mm | S-PDSO-G8 | 2.5V | 5.5V | 900ns | TS 16949 | 8Kb 1K x 8 | Non-Volatile | 2.5V~5.5V | 256X8 | 8 | 2048 bit | SERIAL | 400kHz | 5ms | I2C | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q128JVCIQ TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 24-TBGA | Surface Mount | -40°C~85°C TA | FLASH - NOR | 128Mb 16M x 8 | Non-Volatile | 2.7V~3.6V | 133MHz | FLASH | SPI - Quad I/O, QPI, DTR | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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CY7C1019CV33-15ZXI | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | yes | Obsolete | 3 (168 Hours) | 32 | 20.95mm | ROHS3 Compliant | 32-SOIC (0.400, 10.16mm Width) | unknown | 10.16mm | Surface Mount | -40°C~85°C TA | SRAM - Asynchronous | 1.2mm | 1 | e3 | TIN | DUAL | 260 | 3.3V | 20 | 32 | YES | 1.27mm | R-PDSO-G32 | 2.97V | COMMERCIAL | 3.63V | 1Mb 128K x 8 | Volatile | 3V~3.6V | 128KX8 | 8 | 1048576 bit | 15 ns | SRAM | Parallel | 15ns | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V416L12PHG/3247 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Bulk | 2014 | 70°C | 0°C | 3.3V | 1 | RoHS Compliant | No | 44 | TSOP | Parallel | 4 Mb | RAM, SRAM - Asynchronous | 18b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
.png "MT47H512M4EB-3:C") |
MT47H512M4EB-3:C | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 2012 | yes | Obsolete | 3 (168 Hours) | 60 | EAR99 | 1.8V | 1 | 11.5mm | ROHS3 Compliant | Lead Free | No | 60 | AUTO/SELF REFRESH | 60-TFBGA | 2 Gb | Surface Mount | 0°C~85°C TC | SDRAM - DDR2 | 1.2mm | 8542.32.00.36 | 1 | 667MHz | e1 | TIN SILVER COPPER | BOTTOM | 260 | 1.8V | 30 | MT47H512M4 | 60 | YES | 0.8mm | 1.7V | 1.9V | 3-STATE | 450ps | 2Gb 512M x 4 | Volatile | 18b | 0.225mA | 1.7V~1.9V | 512MX4 | 4 | 4b | 333MHz | 0.012A | COMMON | 8192 | DRAM | Parallel | 15ns | 48 | 48 | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT29F4T08EUHBFM4-T:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 7 Weeks | Bulk | Active | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
7130LA20TF8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2005 | Active | 70°C | 0°C | 5V | 2 | 10mm | RoHS Compliant | Contains Lead | No | 64 | LQFP | Parallel | 5.5V | 4.5V | 8 kb | 10mm | 1.4mm | 200mA | 20 ns | 1kB | RAM, SDR, SRAM | 10b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71V65803S100PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | 2005 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 3.3V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 3.465V | 3.135V | 9 Mb | 100MHz | 14mm | 1.4mm | CMOS | 1 | 270mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 10 ns | 100MHz | 1.1MB | RAM, SDR, SRAM | 19b | Synchronous | 0.06A | 18b | COMMON | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3557SA80BQGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2009 | 85°C | -40°C | RoHS Compliant | 165 | Parallel | RAM, SRAM | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577SA85BGG | Renesas Electronics America Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | 119-BGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, SDR | IDT71V3577 | 119-PBGA (14x22) | 8.5ns | 4.5Mb 128K x 36 | Volatile | 3.135V~3.465V | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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24LC01BHT-E/ST | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | Active | 1 (Unlimited) | 125°C | -40°C | 5V | ROHS3 Compliant | Tin | 8 | 8-TSSOP (0.173, 4.40mm Width) | 2-Wire, Serial | 5.5V | 2.5V | 1 kb | 400kHz | Surface Mount | -40°C~125°C TA | EEPROM | 3mA | 100kHz | 24LC01BH | 8-TSSOP | 900ns | 1Kb 128 x 8 | Non-Volatile | 2.5V~5.5V | 400kHz | EEPROM | I2C | 5ms | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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71321LA55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | Tape & Reel | 2005 | no | Active | 3 (168 Hours) | 52 | EAR99 | 70°C | 0°C | 5V | 2 | 19mm | RoHS Compliant | Contains Lead | No | 52 | INTERRUPT FLAG; AUTOMATIC POWER-DOWN; BATTERY BACKUP | PLCC | Parallel | 5.5V | 4.5V | 16 kb | 19mm | 3.63mm | CMOS | 1 | 110mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 5V | 52 | COMMERCIAL | SRAMs | 5V | 3-STATE | 55 ns | 2kB | RAM, SDR, SRAM | 11b | Asynchronous | 0.0015A | 8b | COMMON | 2V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
93C46BXT-E/SN | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 6 Weeks | Surface Mount | Tape & Reel (TR) | 2008 | yes | Active | 1 (Unlimited) | 8 | EAR99 | 5V | 4.9mm | ROHS3 Compliant | Lead Free | Tin | No | 8 | 1000000 ERASE/WRITE CYCLES; DATA RETENTION > 200 YEARS | 8-SOIC (0.154, 3.90mm Width) | Serial | 1 kb | 3.9mm | Surface Mount | -40°C~125°C TA | CMOS | 1.75mm | 1 | 2mA | e3 | DUAL | 260 | 5V | 40 | 93C46B | 8 | 1.27mm | 5V | 250 ns | 1Kb 64 x 16 | Non-Volatile | 4.5V~5.5V | 64X16 | 16 | 2MHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | SOFTWARE | 6ms | MICROWIRE | EEPROM | SPI | 2ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
24AA256T-I/SM | Microchip Technology | 0.8325 |
Min: 1 Mult: 1 |
0.00000000 | download | 5 Weeks | Surface Mount | Tape & Reel (TR) | 2007 | yes | Active | 1 (Unlimited) | 8 | SMD/SMT | EAR99 | 5.26mm | ROHS3 Compliant | Lead Free | Gold | No | 8 | 8-SOIC (0.209, 5.30mm Width) | I2C, Serial | No SVHC | 256 kb | 5.25mm | Surface Mount | -40°C~85°C TA | CMOS | 2.03mm | 1 | 3mA | e3 | Matte Tin (Sn) | DUAL | 260 | 40 | 24AA256 | 8 | 1.27mm | 1.7V | 5.5V | 900ns | 256Kb 32K x 8 | Non-Volatile | 1.7V~5.5V | 8 | 400kHz | 0.000005A | 200 | 1000000 Write/Erase Cycles | HARDWARE | 5ms | I2C | 1010DDDR | NO | EEPROM | I2C | 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V06L55J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | no | Active | 1 (Unlimited) | 68 | EAR99 | 70°C | 0°C | 3.3V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | INTERRUPT FLAG; SEMAPHORE; AUTOMATIC POWER-DOWN | PLCC | Parallel | 3.6V | 3V | 128 kb | 24mm | 3.63mm | CMOS | 4.57mm | 1 | 155mA | e0 | Tin/Lead (Sn85Pb15) | QUAD | J BEND | 225 | 3.3V | 68 | COMMERCIAL | SRAMs | 3-STATE | 55 ns | 16kB | RAM, SDR, SRAM | 28b | 16KX8 | Asynchronous | 8b | COMMON | 2V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V2558S133PF | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 2007 | 3 (168 Hours) | 100 | 3A991.B.2.A | 70°C | 0°C | 20mm | Non-RoHS Compliant | PIPELINED ARCHITECTURE | LQFP | Parallel | not_compliant | 133MHz | 14mm | CMOS | SYNCHRONOUS | 1.6mm | 8542.32.00.41 | 1 | e0 | Tin/Lead (Sn85Pb15) | QUAD | GULL WING | 240 | 3.3V | 20 | 100 | INDUSTRIAL | YES | 0.65mm | R-PQFP-G100 | 3.135V | SRAMs | Not Qualified | 2.53.3V | 3.465V | 3-STATE | RAM, SRAM | 0.3mA | 128KX36 | 36 | 4718592 bit | 0.04A | 4.2 ns | COMMON | 3.14V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
71T75802S133PFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 8 Weeks | Surface Mount | Tape & Reel | 2012 | yes | Active | 3 (168 Hours) | 100 | 85°C | -40°C | 2.5V | 1 | 20mm | RoHS Compliant | Lead Free | No | 100 | PIPELINED ARCHITECTURE | TQFP | Parallel | 2.625V | 2.375V | 18 Mb | 133MHz | 14mm | 1.4mm | CMOS | 1 | 215mA | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 2.5V | 100 | INDUSTRIAL | 0.65mm | SRAMs | 3-STATE | 4.2 ns | RAM, SRAM | 20b | Synchronous | 0.06A | 18b | COMMON | 2.38V | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
AT29C257-70JI | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 1996 | Obsolete | 2 (1 Year) | Non-RoHS Compliant | 32-LCC (J-Lead) | Surface Mount | -40°C~85°C TC | FLASH | AT29C257 | 32-PLCC (13.97x11.43) | 70ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | FLASH | Parallel | 10ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
M25P64S-VMF6P | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tube | 2010 | Obsolete | 3 (168 Hours) | 85°C | -40°C | ROHS3 Compliant | 16 | 16-SOIC (0.295, 7.50mm Width) | SPI, Serial | 75MHz | Surface Mount | -40°C~85°C TA | FLASH - NOR | M25P64 | 2.7V | 16-SO W | 64Mb 8M x 8 | Non-Volatile | 2.7V~3.6V | 75MHz | FLASH | SPI | 15ms, 5ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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MT52L256M64D2QB-125 XT ES:B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | Bulk | Obsolete | 3 (168 Hours) | ROHS3 Compliant | SDRAM - Mobile LPDDR3 | 16Gb 256M x 64 | Volatile | 1.2V | 800MHz | DRAM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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70V9279L7PRFGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Tape & Reel | 2008 | yes | Active | 3 (168 Hours) | 128 | 85°C | -40°C | 3.3V | 2 | 20mm | RoHS Compliant | Lead Free | No | 128 | LQFP | Parallel | 512 kb | 14mm | 1.4mm | CMOS | e3 | Matte Tin (Sn) - annealed | QUAD | GULL WING | 260 | 3.3V | 30 | 128 | INDUSTRIAL | YES | 0.5mm | SRAMs | 3-STATE | RAM, SRAM | 15b | 0.335mA | 83MHz | 0.015A | 7.5 ns | COMMON | 3V | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
MT28F400B5WG-8 B | Micron Technology Inc. | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Bulk | 2002 | Obsolete | 1 (Unlimited) | 48 | EAR99 | 18.4mm | Non-RoHS Compliant | USER SELECTABLE 5V OR 12V VPP; BOTTOM BOOT BLOCK | 48-TFSOP (0.724, 18.40mm Width) | not_compliant | 12mm | Surface Mount | 0°C~70°C TA | FLASH - NOR | ASYNCHRONOUS | 1.2mm | 8542.32.00.51 | 1 | e0 | Tin/Lead (Sn/Pb) | DUAL | 235 | 5V | 30 | MT28F400B5 | 48 | YES | 0.5mm | R-PDSO-G48 | 4.5V | Not Qualified | 5V | 5.5V | 3-STATE | 4Mb 512K x 8 256K x 16 | Non-Volatile | 0.055mA | 4.5V~5.5V | 256KX16 | 16 | 4194304 bit | 0.000005A | 80 ns | 8 | 5V | NO | NO | YES | 1213 | FLASH | Parallel | 80ns | 16K8K96K128K | BOTTOM | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT45DB081E-UUN2B-T | Adesto Technologies | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 12 Weeks | Surface Mount | Tape & Reel (TR) | 2012 | Active | 1 (Unlimited) | ROHS3 Compliant | 8 | 8-UFBGA, WLCSP | SPI, Serial | 64 Mb | Surface Mount | -40°C~85°C TC | 7 ns | 8Mb 256Bytes x 4096 pages | Non-Volatile | 1.7V~3.6V | 85MHz | 256B | FLASH | SPI | 8μs, 4ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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AT27C256R-12TC | Microchip Technology | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | 1998 | Obsolete | 3 (168 Hours) | Non-RoHS Compliant | 28-TSSOP (0.465, 11.80mm Width) | Surface Mount | 0°C~70°C TC | EPROM - OTP | AT27C256 | 28-TSOP | 120ns | 256Kb 32K x 8 | Non-Volatile | 4.5V~5.5V | EPROM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
W25Q80DVSSIG TR | Winbond Electronics | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 10 Weeks | Tape & Reel (TR) | 2016 | SpiFlash® | Active | 3 (168 Hours) | ROHS3 Compliant | 8-SOIC (0.209, 5.30mm Width) | Surface Mount | -40°C~85°C TA | FLASH - NOR | 8Mb 1M x 8 | Non-Volatile | 2.7V~3.6V | 104MHz | FLASH | SPI | 3ms | |||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
BQ2024DBZR | Texas Instruments | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | 6 Weeks | ACTIVE (Last Updated: 1 week ago) | Tape & Reel (TR) | yes | Active | 1 (Unlimited) | 3 | EAR99 | 2.92mm | ROHS3 Compliant | Lead Free | Gold | No | 3 | TO-236-3, SC-59, SOT-23-3 | Serial | 1.5 kb | 1.22mm | 1.3mm | 1mm | Surface Mount | 1.437803g | -20°C~70°C TA | EPROM - OTP | 20μA | 1 | 20μA | e4 | DUAL | 260 | 2.7V | BQ2024 | 3 | YES | 0.96mm | 2.65V | OTP ROMs | 5.5V | OPEN-DRAIN | OR | 1.5K 6 pagesx32bytes | Non-Volatile | 2.65V~5.5V | 1.5KX1 | 0.01667MHz | COMMON | EPROM | Single Wire | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
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7006S20J8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | 7 Weeks | Surface Mount | 2008 | Active | 70°C | 0°C | 5V | 2 | 24mm | RoHS Compliant | Contains Lead | No | 68 | PLCC | Parallel | 5.5V | 4.5V | 128 kb | 24mm | 3.63mm | 290mA | 20 ns | 16kB | RAM, SDR, SRAM | 28b | Asynchronous | 8b | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
CY7C1911KV18-250BZXC | Rochester Electronics, LLC | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tray | Obsolete | 3 (168 Hours) | ROHS3 Compliant | 165-LBGA | Surface Mount | 0°C~70°C TA | SRAM - Synchronous, QDR II | 165-FBGA (13x15) | 18Mb 2M x 9 | Volatile | 1.7V~1.9V | 250MHz | SRAM | Parallel | ||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||||
 |
IDT71V3577SA75BGGI8 | Integrated Device Technology (IDT) | 0.0000 |
Min: 1 Mult: 1 |
0.00000000 | download | Tape & Reel (TR) | 2005 | 85°C | -40°C | RoHS Compliant | BGA | Parallel | RAM, SRAM |
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CY7C0831AV-133BBXI Cypress Semiconductor Corp
Surface Mount 144 Pin Memory IC CY7C0831 2 Mb kb 13mm mm 300mA mA 18b b
Price: 0.0000
RFQ -
24LC08BT-I/MS16KVAO Microchip Technology
Automotive, AEC-Q100 Memory IC Automotive, AEC-Q100 Series 24LC08B 3mm mm
Price: 0.0000
RFQ -
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MT47H512M4EB-3:C Micron Technology Inc.
60 Pin Memory IC MT47H512M4 2 Gb kb 11.5mm mm
Price: 0.0000
RFQ -
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7130LA20TF8 Integrated Device Technology (IDT)
Surface Mount Memory IC 8 kb kb 10mm mm 200mA mA 8b b
Price: 0.0000
RFQ -
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